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Inventor profile of:

Genki Yano

City:

Beppu-city

Country:

Japan

Published Applications:

Last publication date:

2025-05-15

Top Assignees for applications by Genki Yano

The entities that hold a legal rights for patent applications filed by inventor Yano Genki:

TEXAS INSTRUMENTS INCORPORATED 8 Dallas, TX United States

Recent patent applications by Yano Genki

Genki Yano from Beppu-city, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-15

US20250157858A1

Electricity

LASER DICING FOR SINGULATION

#2 | 2023-08-17

US20230260839A1

Electricity

FRONT SIDE LASER-BASED WAFER DICING

#3 | 2023-02-09

US20230040267A1

Electricity

Laser dicing for singulation

#4 | 2021-02-04

US20210035932A1

Electricity

Integrated circuit backside metallization

#5 | 2020-06-25

US20200203295A1

Electricity

Integrated circuit backside metallization

#6 | 2020-06-04

US20200176314A1

Electricity

Front side laser-based wafer dicing

#7 | 2020-02-13

US20200051860A1

Electricity

Laser dicing for singulation

#8 | 2020-01-23

US20200027772A1

Electricity

Die matrix expander with partitioned subring

#9 | 2016-04-28

US20160118300A1

Electricity

Wafer die separation

#10 | 2016-02-04

US20160035652A1

Electricity

Integrated Circuit Device With Wire Bond Connections

#11 | 2014-11-20

US20140339672A1

Electricity

Wafer die separation

InventorID:

972736 ⎘