Eagle-Vail, Colorado
United States
17
2019-05-30
The entities that hold a legal rights for patent applications filed by inventor Sauter Wolfgang:
Wolfgang Sauter from Eagle-Vail, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Conductive pillar shaped for solder confinement
#2 | 2018-06-07Structures and methods to enable a full intermetallic interconnect
#3 | 2018-04-12Conductive pillar shaped for solder confinement
#4 | 2018-03-22Conductive pillar shaped for solder confinement
#5 | 2017-09-14Photonics chip
#6 | 2017-06-22Structures and methods to enable a full intermetallic interconnect
#7 | 2017-06-22Structures to enable a full intermetallic interconnect
#8 | 2017-05-11Barrier structures for underfill blockout regions
#9 | 2017-05-04Conductive pillar shaped for solder confinement
#10 | 2016-12-22Conductive pillar shaped for solder confinement
#11 | 2016-10-11Passivation layer topography
#12 | 2016-03-17Use of electrolytic plating to control solder wetting
#13 | 2015-11-19Organic coating to inhibit solder wetting on pillar sidewalls
#14 | 2015-02-19PREVENTING MISSHAPED SOLDER BALLS
#15 | 2015-02-12Structures and methods for improving solder bump connections in semiconductor devices
#16 | 2015-01-22Semiconductor structures and methods of manufacture
#17 | 2014-11-20Under ball metallurgy (UBM) for improved electromigration
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