Marcus RINKIÖ

City:

Rajamaki

Country:

Finland

Published Applications:

Last publication date:

2025-06-05

Top Assignees for applications by Marcus RINKIÖ

The entities that hold a legal rights for patent applications filed by inventor RINKIÖ Marcus:

Marcus RINKIÖ from Rajamaki, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF

Method for bonding wafers, and a wafer

Electrode for a microelectromechanical device

Micromechanical gyroscope structure

Gyroscope structure and gyroscope with improved quadrature compensation

Microelectromechanical resonator

InventorID:

973077 ⎘