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Inventor profile of:

Binod B. De

City:

Attleboro, Massachusetts

Country:

United States

Published Applications:

39

Last publication date:

2025-09-11

Top Assignees for applications by Binod B. De

The entities that hold a legal rights for patent applications filed by inventor De Binod B.:

Fujifilm Electronic Materials U.S.A., Inc. 16 N. Kingstown, RI United States
Fujifilm Electronic Materials U.S.A., Inc. 7 North Kingstown, RI United States
Arch Specialty Chemicals, Inc. 1 Norwalk, CT United States

Recent patent applications by De Binod B.

Binod B. De from Attleboro, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-09-11

US20250285785A1

DRY FILM

#2 | 2025-06-12

US20250189892A1

POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME

#3 | 2025-06-12

US20250188312A1

Chemistry; metallurgy

POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME

#4 | 2025-06-12

US20250188311A1

Chemistry; metallurgy

POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME

#5 | 2025-06-12

US20250188223A1

Chemistry; metallurgy

POLYIMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME

#6 | 2025-06-12

US20250188015A1

Chemistry; metallurgy

INDANE BIS-O-AMINOPHENOLS AND POLYMERS PREPARED THEREFROM

#7 | 2025-02-27

US20250065365A1

Performing operations; transporting

DIELECTRIC FILM-FORMING COMPOSITION

#8 | 2025-02-13

US20250051532A1

Chemistry; metallurgy

DIELECTRIC FILM-FORMING COMPOSITION

#9 | 2025-02-06

US20250046717A1

Microelectronic Devices with Good Reliability and Related Compositions and Methods

#10 | 2024-12-12

US20240408590A1

Performing operations; transporting

BIODERIVED ORGANIC SOLVENTS

#11 | 2024-08-01

US20240254268A1

Chemistry; metallurgy

Dielectric Film-Forming Composition

#12 | 2024-07-25

US20240248400A1

DIELECTRIC FILM FORMING COMPOSITION CONTAINING ACYL GERMANIUM COMPOUND

#13 | 2023-02-23

US20230053355A1

Dry Film

#14 | 2022-04-28

US20220127459A1

Chemistry; metallurgy

Dielectric Film-Forming Composition

#15 | 2022-01-20

US20220017673A1

Chemistry; metallurgy

Dielectric Film Forming Compositions

#16 | 2022-01-06

US20220002463A1

Chemistry; metallurgy

Dielectric film-forming composition

#17 | 2021-11-18

US20210355279A1

Chemistry; metallurgy

Polyimides

#18 | 2020-08-20

US20200262978A1

Chemistry; metallurgy

Polyimides

#19 | 2020-07-09

US20200218152A1

Photosensitive polyimide compositions

#20 | 2019-08-29

US20190263969A1

Chemistry; metallurgy

Polyimides

#21 | 2019-06-06

US20190171105A1

Photosensitive polyimide compositions

#22 | 2019-05-02

US20190129303A1

Polyimides

#23 | 2019-03-14

US20190077913A1

Chemistry; metallurgy

Dielectric film forming composition

#24 | 2019-01-17

US20190018321A1

Photosensitive stacked structure

#25 | 2019-01-17

US20190016999A1

Chemistry; metallurgy

Cleaning composition

#26 | 2017-09-14

US20170260330A1

Chemistry; metallurgy

Polymer and thermosetting composition containing same

#27 | 2017-06-22

US20170174837A1

Chemistry; metallurgy

Process for the production of polyimide and polyamic ester polymers

#28 | 2016-10-27

US20160313642A1

Photosensitive polyimide compositions

#29 | 2016-10-27

US20160313641A1

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

#30 | 2015-08-06

US20150219990A1

Polyimide compositions

#31 | 2014-11-20

US20140343223A1

Chemistry; metallurgy

Process for the production of polyimide and polyamic ester polymers

#32 | 2014-11-20

US20140343199A1

Chemistry; metallurgy

Polymer and thermosetting composition containing same

#33 | 2012-07-12

US20120178871A1

Thermally cured underlayer for lithographic application

#34 | 2010-12-02

US20100304299A1

Chemically amplified positive photoresist composition

#35 | 2008-08-28

US20080206676A1

Thermally cured underlayer for lithographic application

#36 | 2008-08-28

US20080206667A1

High etch resistant underlayer compositions for multilayer lithographic processes

#37 | 2008-08-21

US20080199805A1

PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES

#38 | 2005-10-27

US20050238997A1

Thermally cured undercoat for lithographic application

#39 | 2005-02-24

US20050042542A1

Chemistry; metallurgy

Photosensitive bilayer composition

InventorID:

976567 ⎘