Daisuke Ueyama

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2015-12-03

Top Assignees for applications by Daisuke Ueyama

The entities that hold a legal rights for patent applications filed by inventor Ueyama Daisuke:

Daisuke Ueyama from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board

Resin composition, prepreg and laminate

Resin composition, and prepreg and laminate using the same

Resin composition, and prepreg as well as laminate using the same

InventorID:

982913 ⎘