Danville, California
United States
12
2018-08-30
The entities that hold a legal rights for patent applications filed by inventor Guha Joydeep:
Joydeep Guha from Danville, US has applied for patents for these inventions. The list has both pending applications and granted patents:
System implementing machine learning in complex multivariate wafer processing equipment
#2 | 2018-03-22Method and process of implementing machine learning in complex multivariate wafer processing equipment
#3 | 2018-02-01Pressure purge etch method for etching complex 3-D structures
#4 | 2017-11-16Adjustable side gas plenum for edge rate control in a downstream reactor
#5 | 2017-03-21Systems and methods for eliminating flourine residue in a substrate processing chamber using a plasma-based process
#6 | 2017-03-09Systems and methods for selectively etching tungsten in a downstream reactor
#7 | 2017-02-09Systems and Methods for Separately Applying Charged Plasma Constituents and Ultraviolet Light in a Mixed Mode Processing Operation
#8 | 2015-12-17Dual chamber plasma etcher with ion accelerator
#9 | 2015-12-17Dual chamber plasma etcher with ion accelerator
#10 | 2015-12-17Patterning of a hard mask material
#11 | 2015-01-15Dual chamber plasma etcher with ion accelerator
#12 | 2014-11-27Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor features
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