Inventor profile of:

Ryosuke Doi

City:

Hitachinaka

Country:

Japan

Published Applications:

32

Last publication date:

2020-07-30

Top Assignees for applications by Ryosuke Doi

The entities that hold a legal rights for patent applications filed by inventor Doi Ryosuke:

Recent patent applications by Doi Ryosuke

Ryosuke Doi from Hitachinaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-07-30
US20200240822A1
Physics

Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench

#2 | 2019-06-13
US20190178694A1
Physics

Thermal airflow sensor

#3 | 2019-05-30
US20190162569A1
Physics

Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench

#4 | 2018-09-27
US20180274959A1
Physics

Thermal flow meter

#5 | 2018-09-20
US20180266862A1
Physics

Thermal airflow sensor

#6 | 2018-09-06
US20180252564A1
Physics

Thermal airflow measuring device

#7 | 2018-08-16
US20180231410A1
Physics

Thermal-Type Flow Rate Sensor

#8 | 2018-01-18
US20180017422A1
Physics

Thermal flow meter

#9 | 2017-12-28
US20170370752A1
Physics

Thermal flow meter with a case having an external terminal for outputting an electric signal

#10 | 2017-12-21
US20170363455A1
Physics

Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and bypass passage trench

#11 | 2017-11-30
US20170345776A1
Electricity

Thermal flow meter

#12 | 2017-11-23
US20170336232A1
Physics

Thermal flow meter with an asymmetrical inflow-side of circuit package

#13 | 2017-08-17
US20170234710A1
Physics

Thermal air flow-rate sensor

#14 | 2017-08-10
US20170227389A1
Physics

Thermal airflow sensor

#15 | 2017-07-20
US20170205262A1
Physics

Thermal flow meter

#16 | 2016-07-21
US20160209255A1
Physics

Thermal flow sensor

#17 | 2016-05-05
US20160126127A1
Electricity

Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor

#18 | 2015-12-10
US20150355006A1
Physics

Thermal flow meter with an asymmetrical inflow-side of circuit package

#19 | 2015-11-12
US20150323360A1
Physics

Thermal airflow sensor

#20 | 2015-07-09
US20150192441A1
Physics

Thermal flow meter with temperature detection element positioned on protrusion of circuit package

#21 | 2015-07-02
US20150187708A1
Electricity

Thermal flow meter

#22 | 2015-07-02
US20150185060A1
Physics

Thermal flow meter with diaphragm forming a reduced pressure sealed space

#23 | 2015-06-25
US20150177043A1
Physics

Thermal flow meter

#24 | 2015-06-25
US20150177039A1
Physics

Thermal Flow Meter

#25 | 2015-06-25
US20150177038A1
Physics

Thermal flow meter including a protrusion protruding from a circuit package body and a temperature detection element buried in the protrusion

#26 | 2015-06-18
US20150168195A1
Physics

Thermal airflow sensor having a diaphragm with a cavity opening on the back side and a support member including a communicating hole

#27 | 2015-06-11
US20150160054A1
Physics

Thermal flow meter

#28 | 2015-05-07
US20150122012A1
Physics

Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench

#29 | 2015-01-01
US20150000395A1
Physics

Thermal airflow measuring device

#30 | 2014-12-11
US20140360262A1
Physics

Flow rate measuring device with first temperature sensor in a main passage and second temperature sensor in a sub-passage

#31 | 2014-12-04
US20140352424A1
Physics

Airflow measuring apparatus including a ventilation hole between a connector part and a circuit chamber

#32 | 2012-03-08
US20120055245A1
Physics

Thermal air flow sensor

InventorID:

986803 ⎘