Corvallis, Oregon
United States
162
2025-09-25
The entities that hold a legal rights for patent applications filed by inventor Gardner James Michael:
James Michael Gardner from Corvallis, US has applied for patents for these inventions. The list has both pending applications and granted patents:
DIE FOR A PRINTHEAD
#2 | 2024-08-29Integrated circuits including high-voltage high-power and high-voltage low-power supply nodes
#3 | 2024-08-29INTEGRATED CIRCUITS INCLUDING FIRST AND SECOND POWER SUPPLY NODES FOR WRITING AND READING MEMORY CELLS
#4 | 2024-08-08MULTIPLE CIRCUITS COUPLED TO AN INTERFACE
#5 | 2024-04-11Integrated circuits including memory cells
#6 | 2024-01-11Print component having fluidic actuating structures with different fluidic architectures
#7 | 2023-11-30Print component with memory circuit
#8 | 2023-11-23COMMUNICATING PRINT COMPONENT
#9 | 2023-11-09Accessing registers of fluid ejection devices
#10 | 2023-11-09Integrated circuits including memory cells
#11 | 2023-09-28DIE FOR A PRINTHEAD
#12 | 2023-08-10Communicating print component
#13 | 2023-03-16Communicating print component
#14 | 2023-03-16Integrated circuit with address drivers for fluidic die
#15 | 2023-03-09Integrated circuits including customization bits
#16 | 2023-02-23Memories of fluidic dies
#17 | 2023-02-02Multiple circuits coupled to an interface
#18 | 2023-02-02Print component with memory circuit
#19 | 2023-01-19Temperature detection and control
#20 | 2022-12-08FLUIDIC DIE CHANGE OF DIRECTION DETECTION
#21 | 2022-12-01Print component with memory circuit
#22 | 2022-11-03Identifying random bits in control data packets
#23 | 2022-11-03Logic circuitry
#24 | 2022-11-03Fluid ejection devices including contact pads
#25 | 2022-11-03Pulldown devices
#26 | 2022-11-03Emulating parameters of a fluid ejection die
#27 | 2022-09-01Integrated circuits including customization bits
#28 | 2022-08-25Die for a printhead
#29 | 2022-07-14PRINT COMPONENT WITH MEMORY ARRAY USING INTERMITTENT CLOCK SIGNAL
#30 | 2022-06-09FLUID PROPERTY SENSOR
#31 | 2022-04-28Logic circuitry
#32 | 2022-03-17LOGIC CIRCUITRY PACKAGE
#33 | 2022-03-17Integrated circuits including strain gauge sensors
#34 | 2022-02-17Print material level sensing
#35 | 2022-02-17Print material level sensing
#36 | 2022-02-03Integrated circuits including memory cells
#37 | 2022-01-13PRINT MATERIAL LEVEL SENSING
#38 | 2022-01-06Logic circuitry package
#39 | 2021-12-30Power management in a logic circuitry package
#40 | 2021-12-30SENSOR CIRCUITRY PACKAGE FOR REPLACEABLE PRINT APPARATUS COMPONENT
#41 | 2021-12-30SENSOR CIRCUITRY PACKAGE FOR REPLACEMENT PRINT APPARATUS COMPONENT
#42 | 2021-12-30Liquid sensor package
#43 | 2021-12-30Logic circuitry package
#44 | 2021-12-30Logic circuitry package
#45 | 2021-12-30Logic circuitry
#46 | 2021-12-30Zonal firing signal adjustments
#47 | 2021-12-02Contact connectivity
#48 | 2021-12-02LOGIC CIRCUITRY PACKAGE
#49 | 2021-12-02Die for a printhead
#50 | 2021-11-25TEMPERATURE SENSING
#51 | 2021-11-25Thermal zone selection with a circular shift register
#52 | 2021-11-25THERMAL ZONE SELECTION WITH A SEQUENCER AND DECODERS
#53 | 2021-11-18Logic circuitry
#54 | 2021-11-18Die for a printhead
#55 | 2021-11-18Die for a printhead
#56 | 2021-11-18Die for a printhead
#57 | 2021-11-18Temperature detection and control
#58 | 2021-11-18Temperature detection and control
#59 | 2021-11-18Communicating print component
#60 | 2021-11-18Die for a printhead
#61 | 2021-11-18Die for a printhead
#62 | 2021-11-18Communicating print component
#63 | 2021-11-18Communicating print component
#64 | 2021-10-28Logic circuitry
#65 | 2021-10-28Logic circuitry
#66 | 2021-10-28Fluidic die
#67 | 2021-10-21TEMPERATURE SENSING
#68 | 2021-10-14Print component with memory circuit
#69 | 2021-09-09Current leakage test of a fluid ejection die
#70 | 2021-08-19FLUID PROPERTY SENSOR
#71 | 2021-08-05Replaceable print apparatus component
#72 | 2021-08-05Logic circuitry package
#73 | 2021-08-05Print component with memory circuit
#74 | 2021-08-05MICROFLUIDIC DEVICES WITH IMPEDANCE SETTING TO SET BACKPRESSURE
#75 | 2021-08-05MICROFLUIDIC DEVICES TO DETECT FLUID PRIMING
#76 | 2021-07-29Multiple circuits coupled to an interface
#77 | 2021-07-29Identifying random bits in control data packets
#78 | 2021-07-29Integrated circuits including customization bits
#79 | 2021-07-29Accessing registers of fluid ejection devices
#80 | 2021-07-22Logic circuitry package
#81 | 2021-07-22Logic circuitry package
#82 | 2021-07-22WRITING A NONVOLATILE MEMORY TO PROGRAMMED LEVELS
#83 | 2021-07-22Logic circuitry package
#84 | 2021-07-22Pulldown devices
#85 | 2021-07-22Fluid ejection devices including contact pads
#86 | 2021-07-22Print component with memory array using intermittent clock signal
#87 | 2021-07-22THERMAL MANAGEMENT OF FLUID EJECTION DEVICES
#88 | 2021-07-22Logic circuitry
#89 | 2021-07-22Memories of fluidic dies
#90 | 2021-07-22Writing a nonvolatile memory to programmed levels
#91 | 2021-07-22LOGIC CIRCUITRY PACKAGE
#92 | 2021-07-22Logic circuitry package
#93 | 2021-07-15FLUIDIC SENSORS TESTING
#94 | 2021-07-15Logic circuitry package
#95 | 2021-07-15Logic circuitry package
#96 | 2021-07-15Logic circuitry package
#97 | 2021-07-15Logic circuitry package
#98 | 2021-07-15LOGIC CIRCUITRY PACKAGE
#99 | 2021-07-15Multiple circuits coupled to an interface
#100 | 2021-07-15Integrated circuits including memory cells
989384 ⎘