Daniel J. Williams

City:

Ithaca, New York

Country:

United States

Published Applications:

Last publication date:

2018-06-21

Top Assignees for applications by Daniel J. Williams

The entities that hold a legal rights for patent applications filed by inventor Williams Daniel J.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 9 ARMONK, NY United States

Recent patent applications by Williams Daniel J.

Daniel J. Williams from Ithaca, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-06-21

US20180176127A1

Electricity

Multipathing using a network of overlays

#2 | 2017-12-21

US20170364377A1

Physics

Specialized micro-hypervisors for unikernels

#3 | 2017-02-02

US20170034046A1

Electricity

Multipathing using flow tunneling through bound overlay virtual machines

#4 | 2016-08-25

US20160246592A1

Physics

Dynamic extensibility of application programming interfaces

#5 | 2016-08-18

US20160239546A1

Physics

Supporting software application developers to iteratively refine requirements for web application programming interfaces

#6 | 2016-08-18

US20160239269A1

Physics

Supporting software application developers to iteratively refine requirements for web application programming interfaces

#7 | 2014-12-25

US20140380087A1

Physics

Fault tolerance solution for stateful applications

#8 | 2014-12-04

US20140359128A1

Electricity

Coordinating application migration processes

#9 | 2014-12-04

US20140359053A1

Electricity

Coordinating application migration processes

InventorID:

994332 ⎘