Heat-dissipating device with thin fins

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is related to a heat-dissipating device with thin fins, and more particularly, to a heat-dissipating device with fins thinner than conventional ones. Hence, the number of fins of the heat-dissipating device can be increased to enlarge the heat-dissipating area, so the heat-dissipating efficiency can be enhanced. Furthermore, the grooves of the present invention don't need to be narrowed, so the manufacture of the present invention is easy and the overall cost is low.

2. Description of Related Art

With the rapid progress of computer industries, electronic heat sources, such as chips or central processing units (CPUs), have faster and faster processing speeds and produce increasing amounts of heat. In order to dissipate heat and maintain a normal operation state, a heat-dissipating device is usually attached to the electronic heat source. The heat-dissipating device has a larger heat-dissipating surface. The heat-dissipating device uses its heat-dissipating fins to dissipate heat.

Reference is made to FIG. 1. The conventional heat-dissipating device 9 includes a plate-shaped base 91 and multiple fins 92. The plate-shaped base 91 and the fins 92 are made of copper or aluminum, which has a good heat-transfer property. The plate-shaped base 91 has multiple parallel grooves 911. The fins 92 are sheet-shaped. The lower ends of the fins 92 are first placed within the grooves 911 of the plate-shaped base 91 and then clipped or welded therein. The fins 92 are periodically disposed on the plate-shaped base 91 and the spacing distance of the fins 92 is d.

Reference is made to FIG. 2. In order to enlarge the heat-dissipating area of the heat-dissipating device 9 to enhance the heat-dissipating efficiency, the fins 92 can be made thinner, so the number of fins 92 can be increased without changing the spacing distance. However, when the fins 92 are made thinner, the grooves 911 of the plate-shaped base 91 must be narrowed correspondingly. This increases the difficulty and cost of manufacture.

SUMMARY OF THE INVENTION

An objective of the present invention is to provide a heat-dissipating device, which has fins thinner than conventional ones. The number of fins of the heat-dissipating device can thus be increased to enlarge the heat-dissipating area, thereby enhancing the heat-dissipating efficiency thereof. Furthermore, each of the fins has one end formed with a folded portion. Thus, the ends of the folded portions are thicker than the fins themselves. Hence, the grooves for disposition of the fines can be made wider, so the manufacture of the present invention is easy and the overall cost is low.

For achieving the objective above, the present invention provides a heat-dissipating device, including a base and multiple fins. The base has a plurality of grooves formed periodically thereon. Each of the fins has an end formed with a folded portion. The ends with the folded portions are thicker than the fins themselves, and are fixed within the grooves of the base.

Numerous additional features, benefits and details of the present invention are described in the detailed description, which follows.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of this invention will be more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a cross-sectional view of a conventional heat-dissipating device;

FIG. 2 is a cross-sectional view of another conventional heat-dissipating device;

FIG. 3 is a decomposed view of a heat-dissipating device in accordance with the present invention;

FIG. 4 is a combined view of the heat-dissipating device in accordance with the present invention; and

FIG. 5 is a cross-sectional view of a portion of the heat-dissipating device in accordance with the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Reference is made to FIGS. 3-5. The present invention provides a heat-dissipating device with thin fins. It includes a base 1 and multiple fins 2. The base 1 is made of copper or aluminum, which has a good heat-transfer property. In this embodiment, the base 1 has a central portion 11 and two wing portions 12 extending out from the central portion 11. The base 1 has multiple parallel grooves 13, which are formed periodically on the central portion 11 and the wing portions 12 for disposition of the fins 2.

The fins 2 are sheet-shaped and made of copper or aluminum, which has a good heat-transfer property. The fins 2 are thinner than conventional ones, and each has one end formed with a folded portion 21. The folded portion 21 is formed at the end for disposition on the base 1, i.e. the lower end. Since the folded portions 21 are formed by folding the fins 2, they are thicker and have twice width of the fins 2. Hence, the grooves 13 of the base 1 can be made wider than the fins 2.

In the process to combine the base 1 and the fins 2, the base 1 is first heated to a temperature ranging from 1000-1100° C. Thus, the base is completely softened and the folded portions 21 of the fins 2 can be easily disposed within the grooves 13. After the ends of the fins 2 with the folded portions 21 are placed in the grooves 13, two opposite sides of the base 1 are pressed equivalently by an external force to change the shape of the groove 13 to clip the ends of the fins 2 with the folded portions 21. In this way, the fins 2 are fixed on the base 1. According to the above disclosure, the heat-dissipating device of the present invention is provided.

The method of using an external force to press two opposite sides of the base 1 to clip the fins 2 to fix the fins 2 on the base 1 is just a preferred embodiment. The present invention is not limited thereto. The fins 2 can be fixed on the base by welding or other methods.

As shown in FIG. 5, the fins 2 of the present invention can be made thinner than the conventional ones, so the number of fins 2 can be increased without changing the spacing distance. In this way, the heat-dissipating area of the heat-dissipating device is enlarged and the heat-dissipating efficiency is thus enhanced effectively.

Furthermore, the lower ends of the fins 2 are formed with the folded portions 21, so the lower ends of the fins 2 are thicker. In this way, although the fins 2 are made thinner, the grooves 13 of the base 1 don't need to be narrowed. Therefore, the grooves 13 can still be made relatively wider. This method lowers the difficulty and cost of manufacture.

Although the present invention has been described with reference to the preferred embodiments thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are embraced within the scope of the invention as defined in the appended claims.