HEAT DISSIPATION MODULE AND METHOD OF USING THE HEAT DISSIPATION MODULE

Description

BACKGROUND

1. Technical Field

The present disclosure relates to a heat dissipation module for an electronic component and a method using the heat dissipation module.

2. Description of Related Art

To get a good balance between heat dissipation effectiveness and cost, a heat dissipation module for an electronic component, such as a central processing unit, may comprise an aluminum heat sink, and a plurality of copper heat pipes fitted in grooves defined in a bottom side of the heat sink. However, because of the size of the heat pipes and assembly tolerances, when the heat dissipation module is seated on an electronic component, there may be spaces between the electronic components and the bottom side of the heat sink and the heat pipes. The spaces do not allow contact between the pipe and the heat sink and reduces the efficiency of head dissipation from the electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.

FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipation module.

FIG. 2 shows the heat dissipation module in use.

FIGS. 3 and 4 are sectional views taken along the line III-III of FIG. 2, but respectively showing before and after the heat dissipation module being heating.

FIG. 5 is a flowchart of an exemplary embodiment of a method using the heat dissipation module of FIG. 2.

DETAILED DESCRIPTION

The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references can mean “at least one.”

FIG. 1, is an exemplary embodiment of a heat dissipation module. The heat dissipation module includes a heat sink 10, a plurality of heat pipes 20, and a heat conductive pad 30 made of phase change material.

The heat sink 10 includes a base plate 11 and a plurality of fins 12 perpendicularly extending from a top surface of the base plate 11. A plurality of grooves 112 is defined in a bottom surface of the base plate 11 opposite to the fins 12.

Each heat pipe 20 has a rounded cross section.

The heat conductive pad 30 is a flexible solid material at ambient room temperature. A top surface of the heat conductive pad 30 is adhesive and covered with a protective film (not shown) before use. The heat conductive pad 30 softens when heated to a phase-transition temperature of the heat conductive pad 30.

Referring to FIGS. 2 and 3, in assembly, the heat pipes 20 are forced to be deformed to be tightly engaged in the corresponding grooves 112 of the heat sink 10. The protective film of the heat conductive pad 30 is removed, and then the heat conductive pad 30 is adhered to the bottom surface of the base plate 11 of the heat sink 10 to cover the grooves 112 and the heat pipes 20. Due to geometric differences, there will be spaces 1020 between the heat conductive pad 30, the bottom surface of the heat sink 10, and the heat pipes 20.

FIGS. 3-5, shows a method to use the heat dissipation module of FIG. 2. The method for dissipating heat for an electronic component 200 includes the following steps.

In step S01, a heat sink 10 with a plurality of grooves 12 defined in a bottom surface of the heat sink 20 is provided.

In step S02, providing a plurality of heat pipes 20. The plurality of heat pipes 20 correspondingly engage in the grooves 12 of the heat sink 10.

In step S03, providing a heat conductive pad 30 made of phase change material.

The heat conductive pad 30 is adhered to the bottom surface of the heat sink 10 covering the grooves 12 and the heat pipes 20;

In step S04, the heat sink is seated on the electronic component 200, with a bottom surface of the heat conductive pad 30 opposite to the heat sink 10 abutting against a top surface of the electronic component 200.

In step S05, the heat conductive pad 30 is softened by heating the heat conductive pad 30 to a temperature greater than the phase-transition temperature of the heat conductive pad 30. Since the electronic component 200 generates heat in operation, in one embodiment, the heat conductive pad 30 is heated by heat generated by the electronic component 200.

It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.