HEAT SINK

Description

BACKGROUND

1. Technical Field

The present disclosure relates to a heat sink.

2. Description of Related Art

Heat dissipation for electronic devices in a server, such as central processing units (CPUs), is generally done by heat sinks. Different CPUs have different heat ratings. However, design of the heat sinks is based on the high heat ratings of the CPUs, which is inflexible.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat sink, wherein the heat sink includes a plurality of first fins and a plurality of second fins.

FIG. 2 is an enlarged, inverted view of one of the second fins of FIG. 1.

FIG. 3 is an assembled, isometric view of FIG. 1.

FIG. 4 is an enlarged view of a circled portion IV of FIG. 3.

DETAILED DESCRIPTION

The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

FIGS. 1 and 2 show an exemplary embodiment of a heat sink. The heat sink includes a bottom plate 10, a plurality of first fins 20 perpendicularly extending up from the bottom plate 10, and a plurality of second fins 30.

Each second fin 30 includes a main body 31 and a bar 32 connected to a bottom side of the main body 31. A hooking slot 322 is defined in a bottom of the bar 32. A plurality of pairs of resilient tabs 33 extends from a bottom of the bar 32. The resilient tabs 33 of each pair are respectively located at opposite sides of the hooking slot 322. Each resilient tab 33 is substantially C-shaped, arced toward the other resilient tab 33 of the same pair of the resilient tabs 33.

FIGS. 3 and 4 show in assembly, the hooking slot 322 of each second fin 30 is aligned with the corresponding first fin 20 and is manipulated toward the first fin 30. The first fin 20 extends through the pairs of resilient tabs 33 of the second fin 30 and engages in the hooking slot 322, to allow the resilient tabs 33 to resiliently sandwich the first fin 20.

In use, according to the heat rating of the electronic device, a corresponding number of second fins 30 are mounted to the first fins 20. In the embodiment, the second fins 30 are alternately mounted to the first fins 20, for instance, to every other one of the first fins 20.

Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and the functions of the embodiments, the disclosure is illustrative only, and changes may be made in details, especially in the matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.