System and Method for Generating Electrical Energy from A Volume of Water

Description

FIELD OF THE INVENTION

The present invention relates to a system for generating electrical energy. More specifically, the present invention relates to a system and method for generating electrical energy from a volume of water.

BACKGROUND OF THE INVENTION

The idea of generating electrical energy from water has long been a subject of scientific interest, primarily because of its potential to offer a clean, renewable, and sustainable energy source. One of the notable principles explored in this domain is the phenomenon of charge separation induced by hydrophilic surfaces, commonly known as the exclusion zone (EZ) effect. When water comes into contact with certain hydrophilic materials, a distinct region of highly ordered water molecules forms near the surface. This exclusion zone is characterized by a separation of charges: the water molecules within the zone are positively charged, while the surrounding bulk water retains a negative charge. This natural charge separation creates a potential difference that can theoretically be harnessed to generate electrical energy.

While early investigations into this phenomenon have demonstrated its feasibility, the practical application of these systems remains limited. Existing technologies relying on the exclusion zone for energy generation are often confined to experimental setups due to their inherent technical and practical shortcomings. For instance, the power density achievable in these systems is extremely low, primarily because the size of the exclusion zone is constrained by the physical properties of the hydrophilic surface and the environmental conditions that sustain it. This limitation makes it difficult to scale such systems for meaningful energy production, especially in real-world applications where higher energy output is required.

Another significant challenge lies in the preparation of the hydrophilic surfaces. The exclusion zone effect is highly dependent on the uniformity and quality of the surface in contact with the water. In most prior systems, creating a consistent hydrophilic coating involves intricate and labour-intensive processes, often requiring specialized materials or coatings that add to the complexity and cost of fabrication. Furthermore, maintaining the effectiveness of the hydrophilic surface over time is difficult, as it is prone to degradation or contamination during operation.

Electrode placement is another area where prior systems encounter considerable difficulty. For efficient energy extraction, electrodes need to be positioned precisely within the exclusion zone and the bulk water region. However, ensuring this level of precision in manual or semi-automated setups is challenging, resulting in suboptimal charge collection and reduced efficiency. This lack of precise alignment, coupled with the limitations of existing fabrication methods, has restricted these technologies to small-scale or experimental applications, with little prospect for industrial scalability.

The inability of existing systems to scale effectively is one of the most significant barriers to widespread adoption. Many of these systems rely on custom-made hydrophilic surfaces and manually assembled components, making mass production impractical. Furthermore, the materials and processes used, such as those for fabricating and protecting the electrodes, are costly and prone to degradation. Electrodes, for instance, often suffer from corrosion due to their continuous exposure to water, which not only diminishes the performance of the system over time but also increases the need for frequent maintenance and replacement.

Another critical limitation is the lack of integration with modern manufacturing technologies. Most existing systems are designed as stand-alone setups and do not take advantage of advanced microfabrication techniques. This prevents them from benefiting from the precision, scalability, and cost efficiencies associated with semiconductor fabrication processes. Without leveraging such technologies, these systems remain prohibitively expensive and unsuitable for commercialization.

The practical constraints of prior systems are compounded by their dependence on environmental conditions. Combined with high production costs and limited energy output, these drawbacks prevent these systems from competing with established energy technologies like lithium-ion batteries or photovoltaic cells.

Therefore, there is a need for a system and method for generating electrical energy from a volume of water which overcomes one or more drawbacks of the above-mentioned prior art.

OBJECTS OF THE INVENTION

An object of the present invention is to provide a system and method for generating electrical energy from a volume of water.

Another object of the present invention is to provide a system and method for generating electrical energy from a volume of water that utilizes the charge-separated zone phenomenon.

One more object of the present invention is to provide a system and method for generating electrical energy from a volume of water that integrates microfabrication techniques for mass production and cost efficiency.

Yet another object of the present invention is to provide a system and method for generating electrical energy from a volume of water that ensures precise alignment of conductive elements within the charge-separated zone to maximize charge extraction efficiency.

Still one more object of the present invention is to provide a system and method for generating electrical energy from a volume of water that provides durable and corrosion-resistant electrodes that enhance conductivity and maintain efficiency over extended periods of operation.

Further object of the present invention is to provide a system and method for generating electrical energy from a volume of water that enable multiple system configurations, including single-unit, stacked, and ultra-high-density designs, to cater to various energy generation requirements.

An additional object of the present invention is to provide a system and method for generating electrical energy from a volume of water that reduce fabrication costs and enhance manufacturability by adopting silicon wafer platforms and leveraging batch production techniques.

One more object of the present invention is to provide a system and method for generating electrical energy from a volume of water that sustains the charge-separated zone by absorbing ambient infrared energy, ensuring continuous energy generation.

SUMMARY OF THE INVENTION

According to the present invention a system for generating electrical energy from a volume of water is provided. The system includes a base layer and a collection layer. The base layer includes a substrate with a plurality of cavities dimensioned to hold water. The inner surface of each cavity is applied with a surface coating. The plurality of cavities is configured to create a charge-separated zone when in contact with water. The collection layer extract electrical energy from the charge-separated zone. The collection layer includes an inlet and an outlet to facilitate the initial introduction of a low molar ion concentration aqueous solution into the plurality of cavities wherein the aqueous solution remains within the cavities after filling. Further the collection layer includes a plurality of conductive elements including negative electrodes and positive electrodes. The plurality of electrical connections is coupled to the conductive elements to form a potential difference.

The base layer and the collection layer are assembled together by aligning the conductive elements of the collection layer with the substrate of the base layer. A low molar ion concentration aqueous solution is allowed to flow through the inlet and outlet to create the charge-separated zone adjacent to the base layer. The negative electrodes of the collection layer are configured to be positioned within the charge-separated zone and the positive electrodes being positioned within the surrounding water and the charge-separated zone enables electrical energy to be extracted through the conductive elements when connected to an external load.

In an aspect of the invention, the surface coating of the base layer includes a hydrophilic coating applied as a dispersion of Nafion with a thickness of 1 micron.

In an aspect of the invention, the collection layer includes P-type doped regions and N-type doped regions the negative electrodes are connected to P-type doped regions of the collection layer and positive electrodes are connected to N-type doped regions of the collection layer.

In an aspect of the invention, the substrate includes a grid of cavities, each cavity having dimensions between 500-700 microns.

In an aspect of the invention, the base layer and collection layer form a single-unit configuration, with a grid of 169 cavities, each cavity independently generating electrical energy.

In an aspect of the invention, the base layer and the collection layer are configured in a three-dimensional stacked configuration, with one or more intermediate layers, each intermediate layer including water interaction features on one side and conductive features on the other side.

In an aspect of the invention, wherein the collection layer is configured in a high-density electrode configuration, including a closely spaced arrangement of positive and negative conductive elements.

In an aspect of the invention, the base layer is configured in a layered hydrophilic surface configuration, with pre-formed hydrophilic sheets adhered to the inner surfaces of the cavities.

In an aspect of the invention, the base layer and the collection layer are configured in an ultra-high-density configuration, with cavities of microscopic dimensions wherein the conductive elements include nanostructured materials and the base layer being fabricated with ultra-thin walls.

In an aspect of the invention, the system is fabricated on a silicon wafer platform scalable to larger diameters, including 6-inch, 8-inch, and 12-inch wafers, enabling batch production of multiple systems.

In an aspect of the invention, method for fabricating a system for generating electrical energy from a volume of water is provided. Initially a base layer is fabricated by forming a substrate with a plurality of cavities dimensioned to hold water. A surface coating is then applied to the substrate to induce the formation of a charge-separated zone when in contact with water. After that a collection layer is fabricated by forming conductive elements including negative electrodes and positive electrodes. The electrical connections are then formed to couple the conductive elements for establishing a potential difference. The base layer and the collection layer are then assembled by aligning the conductive elements of the collection layer with the substrate of the base layer and bonding the base layer and collection layer using an adhesive to form a sealed interface. After that a low molar ion concentration aqueous solution is allowed to flow through an inlet and outlet of the collection layer to create the charge-separated zone. The charge-separated zone thus created enables electrical energy to be extracted through the conductive elements when connected to an external load.

In an aspect of the invention, fabricating the base layer includes the following steps. Initially the base layer is cleaned using a standard cleaning process. The cavity patterns are then formed on the structured surface of the base layer using photolithography. The cavity patterns are etched into the base layer using Deep Reactive Ion Etching (DRIE) to form cavities with a depth of at least 200 microns or greater than 200 microns. A surface coating is then applied by depositing a Nafion solution onto the cavities. The base layer is then placed in a vacuum chamber to remove solvents from the Nafion solution and form a surface coating on the inner surfaces of the cavities with a thickness of approximately 1 micron. The process of application of the Nafion solution is repeated until the required thickness is achieved.

In an aspect of the invention, fabricating the collection layer includes the following steps. The predefined tracks of the collection layer are doped with P-type dopants to form negative electrode regions and N-type dopants to form positive electrode regions. The collection layer is then oxidized to form an insulating silicon dioxide layer over the doped regions. The oxide layer from selected regions is removed to define electrode formation areas and power output regions. A thin metallic layer of nickel or titanium are deposited onto the selected regions. Electroplating copper onto the metallic regions is done to form conductive elements with a height of 50 microns and electroplating a thin gold layer onto the conductive elements is performed following that.

BRIEF DESCRIPTION OF DRAWINGS

The advantages and features of the present invention will be understood better with reference to the following detailed description and claims taken in conjunction with the accompanying drawings, wherein like elements are identified with like symbols, and in which:

FIGS. 1a and 1b illustrates the side section view and top view of the single cell for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 2 illustrates the method for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIGS. 3a, 3b and 3c illustrates the schematic representation and zoomed view of single unit configuration respectively for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIGS. 4a and 4b illustrates the schematic representation and zoomed view of base layer for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 5a-5d illustrates the schematic representation of the collection layer for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 6a-6c illustrates a three-dimensional stacked configuration and corresponding top and bottom views of a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 7a illustrates a high-density electrode configuration for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 7b illustrates the top view of high-density electrode configuration for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIGS. 8a and 8b illustrates the base layer and collection layer of the layered hydrophilic surface configuration for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 9a illustrates an ultra-high-density configuration for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 9b illustrates the collection layer of the ultra-high-density configuration for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 9c illustrates the bottom view of collection layer of the ultra-high-density configuration for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 9d illustrates the base layer of ultra-high-density configuration for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 9e illustrates the top view of the base layer of an ultra-high-density configuration for a system for generating electrical energy from a volume of water in accordance with the present invention;

FIG. 10a illustrates an embodiment of the cavities having a hexagonal shape;

FIG. 10b illustrates possible cross-sectional geometries of the electrodes, including hexagonal, triangular, multipoint star shapes, and fractal geometries; and

FIG. 11a-11c illustrates an embodiment in which the cavity walls are structured to increase the surface area available for the formation of charge-separated zones.

DETAILED DESCRIPTION OF THE INVENTION

An embodiment of this invention, illustrating its features, will now be described in detail. The words “comprising,” “having,” “containing,” and “including,” and other forms thereof, are intended to be equivalent in meaning and be open ended in that an item or items following any one of these words is not meant to be an exhaustive listing of such item or items, or meant to be limited to only the listed item or items.

The present invention relates to a system for generating electrical energy. More specifically, the present invention relates to a system and method for generating electrical energy from a volume of water by utilizing the charge-separated zone phenomenon induced by the interaction of water with hydrophilic surfaces, resulting in a natural separation of charges that can be harnessed to produce electrical energy. The invention integrates microfabrication techniques and scalable designs to provide a reliable and sustainable energy solution suitable for diverse applications.

The terms “first,” “second,” and the like, herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another, and the terms “a” and “an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced items.

The disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms.

While specific embodiments of the present invention are described herein, it should be understood that various modifications, adaptations, and alternative implementations are possible without departing from the spirit and scope of the invention. The invention is not limited to the precise form factors, dimensions, materials, or fabrication techniques described, and may be adapted for different applications as required.

For example, the shape of the system, the shape and configuration of cavities, and the selection of substrate materials may vary based on application requirements. The inlet and outlet designs may also be adapted to different geometries, including but not limited to circular, hexagonal, rectangular, or irregular polygonal forms. Additionally, materials compatible with microfabrication processes, including silicon, glass, polymers, and other semiconductors, may be used as substrates.

Furthermore, while the present invention describes a specific hydrophilic coating, alternative hydrophilic materials and surface treatments that facilitate charge separation may be used, including but not limited to Nafion, PEG, PDMS, and silica-based coatings. Similarly, while a specific doping process is described for conductive pathways, alternative methods such as metal sputtering, electroplating, or hybrid approaches may be employed.

These and other contemplated variations are within the scope of the invention, even if not explicitly described herein, as long as they achieve the fundamental principles of charge separation and energy extraction from water.

Referring now to FIGS. 1a, 1b, 4a, 4b, and 5, a system (100) for generating electrical energy from a volume of water is provided. The system (100) includes a base layer (20) and a collection layer (60). The system (100) is fabricated on a silicon wafer platform, scalable to larger diameters, including 6-inch, 8-inch, and 12-inch wafers, enabling batch production of multiple systems or one single large-footprint system. While silicon is used in the present embodiment, any substrate material that is compatible with microfabrication processes may be used, including glass, polymer-based materials, or other semiconductor substrates. The thickness of the substrate is not limited to 500 microns, and can be increased or decreased based on design considerations such as structural stability, fabrication feasibility, and energy output efficiency.

The base layer (20) includes a substrate (30) with a plurality of cavities (40) dimensioned to hold water. Specifically, the substrate (30) includes a grid of cavities (40), with each cavity (40) having dimensions in the range of 500-700 microns. The cavity (40) depth and width may vary depending on the width of the exclusion zone (charge-separated zone) formed by the hydrophilic surface. The shape of the cavities (40) is not limited to square or rectangular geometries. In an embodiment, shape of the cavities (40) may include hexagonal (as shown in FIG. 10a), circular, triangular, or other polygonal configurations, allowing for higher packing efficiency and energy extraction.

In the present embodiment, the substrate (30) is a silicon wafer, which is used for fabricating the base layer (20). However, other substrate materials that are compatible with microfabrication techniques may be used, including silicon, glass, quartz or other materials with an appropriate thicknesses of 0.5 mm, 1 mm, 2 mm etc. The base layer (20) is cleaned using a standard cleaning process and by forming cavity patterns on the structured surface of the base layer (20) using photolithography. Specifically, the fabrication of the base layer (20) begins with standard wafer cleaning to remove any surface contaminants. After cleaning, a photomask is applied to the wafer to define the areas to be etched during the photolithography process. Once the photomask is developed, the cavities (40) are fabricated using Deep Reactive Ion Etching, from herein afterwards referred as (DRIE), which etches patterns into a 4-inch silicon wafer with a thickness of 500 microns.

DRIE is performed to create cavity (40) patterns in the base layer (20) with a depth of approximately between 200 microns to 300 microns, with a permissible variation based on design requirements and fabrication constraints. The etching depth is not limited to 200 microns and may be increased based on the stability of the substrate and the capabilities of the DRIE tool. For instance, in an embodiment, a 500-micron-thick silicon wafer is used, and the etch depth is set to 200 microns to maintain wafer stability. However, etch depths up to 300 microns or beyond may be used if the substrate remains structurally stable.

The silicon wafer is then diced into 1 cm×1 cm chips using a diamond saw or additional DRIE steps. Each substrate (30) contains an array of cavities (40). It may be obvious to a person skilled in the art that the chip dimensions can be varied based on application requirements, including larger or smaller sizes and different geometric form factors such as rectangular, circular, hexagonal, or irregularly shaped substrates to accommodate specific integration needs. The overall footprint of the system is not limited to 1 cm×1 cm, and may be expanded to utilize the full wafer size, such as a 4-inch wafer supporting up to a 7 cm×7 cm footprint.

An inner surface of each cavity (40) is coated with a surface coating (50). In the present embodiment, the surface coating (50) includes a hydrophilic material, specifically a 20% Nafion solution with a thickness of 1 micron. The process includes pouring the Nafion solution onto each diced substrate, allowing the cavities (40) to be completely saturated, with the solution slightly overflowing at the boundaries of the cavities (40). The substrates (30) are then placed in a vacuum chamber, where the solvents in the Nafion solution are evaporated under vacuum, leaving a uniform hydrophilic coating on the cavity walls. The vacuum-assisted evaporation process is repeated as needed to achieve the required thickness of the hydrophilic layer, specifically 1 micron. The Nafion coating makes the inner surfaces of the cavities (40) to exhibit the necessary hydrophilic properties to facilitate the creation of a stable charge-separated zone (80). This charge-separated zone (80) is formed when water interacts with the hydrophilic surface and creates charge separation, forming a negatively charged region adjacent to the hydrophilic surface and a positively charged region in the surrounding water (90).

However, Nafion is not the only material that may be used for hydrophilic coating. The surface coating (50) includes a hydrophilic surface selected from the group consisting of Aculon coatings, Acrylate gels, Polydimethylsiloxane (PDMS), Polyethylene Glycol (PEG), Starch-based coatings, Mica coatings, Polyvinyl Alcohol (PVA) coatings, Titanium Dioxide (TiO₂) coatings, Silicon Dioxide (SiO₂) coatings, Si—OH coatings, 3-Aminopropyltriethoxysilane (APTES) coatings.

The hydrophilic surface may be generated using chemical treatments, molecular imprinting, or solvothermal deposition processes, depending on fabrication constraints and performance requirements.

In one embodiment, a starch-based hydrophilic coating may be applied to the inner surfaces of the cavities (40). The fabrication process begins with a standard wafer cleaning procedure using an RCA cleaning method, followed by rinsing with deionized water and drying with nitrogen gas. To enhance adhesion, a silane coupling agent may be applied by immersing the wafer in a 1-2% silane solution in ethanol for approximately 10-15 minutes, ensuring uniform coverage over the cavity surfaces. The wafer is then rinsed with ethanol or isopropanol and dried using nitrogen or by heating on a hot plate at 60° C. for 5-10 minutes. A starch solution is prepared by dissolving starch powder in deionized water under controlled heating and stirring, followed by vacuum filtration through a 0.2-micron filter to remove particulates. The wafer is subsequently immersed in the starch solution using vacuum-assisted infiltration to ensure complete penetration into the cavity walls. Finally, the wafer is dried on a hot plate or in an oven at 60-80° C. to solidify the starch layer, forming a uniform hydrophilic coating. The starch infiltration and drying process may be repeated as necessary to achieve the desired layer thickness.

In another embodiment, a mica-based hydrophilic coating may be deposited onto the inner surfaces of the cavities (40) using a solvothermal deposition method. The process begins with wafer cleaning using standard solvents such as acetone, isopropyl alcohol (IPA), and deionized water to remove contaminants. An oxygen plasma treatment may be performed to further enhance surface hydrophilicity. A 5M solution of potassium silicate or potassium hexafluorosilicate (K₂SiF₆) is prepared and mixed with muscovite mica precursors. The solution is adjusted to a neutral pH to optimize mica crystallization, and the wafer is then immersed in the solution within an autoclave chamber at approximately 250° C. The mica crystal growth process is carried out over 24 hours, ensuring a uniform and stable deposition of the hydrophilic layer. Following deposition, the wafer is rinsed with deionized water and dried using nitrogen gas, after which an annealing process at 400° C. in an inert atmosphere is conducted to improve the mechanical stability of the coating.

In another embodiment, polyvinyl alcohol (PVA) coatings may be applied to form a hydrophilic surface. A PVA solution is prepared by dissolving PVA in water at 80° C. under constant stirring. The solution is then applied to the wafer using a dip-coating or spray-coating method to ensure uniform distribution. The coated wafer is subsequently cured in an oven at 50-70° C. for 1-2 hours to solidify the PVA layer. Similarly, a polyethylene glycol (PEG) coating may be applied by immersing the wafer in a PEG-silane solution in ethanol for 30 minutes at room temperature. The wafer is then cured at 100-120° C. for 1 hour, bonding the PEG molecules to the surface.

In another embodiment, 3-Aminopropyltriethoxysilane (APTES) coatings may be employed. The wafer is first cleaned with a piranha solution (3:1 H₂SO₄:H₂O₂) and rinsed with deionized water to remove organic contaminants. The wafer is then immersed in a 1-2% APTES solution in ethanol for 30-60 minutes, ensuring complete surface coverage. The coating is finalized by baking the wafer at 110° C. for 1 hour, promoting chemical bonding between the APTES molecules and the silicon surface.

In another embodiment, titanium dioxide (TiO₂) coatings may be applied using a sol-gel deposition technique. A TiO₂ precursor solution is prepared and deposited onto the wafer using spin-coating or dip-coating methods. The coated wafer is then cured at 450-500° C. in a furnace, crystallizing the TiO₂ layer to enhance its hydrophilic properties. Similarly, silicon dioxide (SiO₂) coatings may be generated using a sol-gel process with tetraethyl orthosilicate (TEOS) in ethanol. The wafer is dip-coated or spray-coated, followed by curing at 250-400° C. for 1 hour to finalize the hydrophilic surface.

In another embodiment, a Si—OH coating may be applied by treating the wafer with a piranha solution (3:1 H₂SO₄:H₂O₂) for 10-15 minutes, followed by a 1:1:5 HCl:H₂O₂:DI water treatment at 80° C. for 10-15 minutes to introduce hydroxyl groups on the surface. The wafer is then dried using nitrogen gas or by baking at 100-120° C. for 10-15 minutes. A final hydroxylation step may be performed by immersing the wafer in DI water at 80° C. for an additional 10-15 minutes to ensure a uniform and stable Si—OH layer.

The collection layer (60) includes an inlet (60a) and an outlet (60b) to enable the initial introduction of water into the plurality of cavities (40) arranged in the base layer (20) as shown in FIGS. 4a and 4b. The plurality of cavities (40) is configured to create the charge-separated zone (80) when in contact with water. The inlet (60a) and outlet (60b) ports do not enable continuous water circulation, but rather allow a low molar ion concentration aqueous solution (85) to enter the system, fill all cavities (40), and exit through the outlet.

Once the cavities (40) are completely filled, the solution starts to exit through the outlet. At this point, no additional solution is needed, and the inlet (60a) and outlet (60b) ports can be sealed using a waterproof tape or any suitable material that does not dissolve in water, ensuring that the aqueous solution remains locked inside. In the present embodiment, diluted NaCl is used as the aqueous solution (85). However, other low molar ion concentration solutions may be used, depending on needs.

The charge-separated zone (80) is formed as a result of the interaction between the hydrophilic surface and water. The charge-separated zone (80) consists of highly ordered water molecules and is characterized by a distinct separation of charges. The charge-separated zone (80) is negatively charged, while the surrounding water (90) remains positively charged. This charge separation generates the potential difference necessary for energy extraction.

Referring now to FIGS. 5a-5d, the collection layer (60) is configured to extract electrical energy from the charge-separated zone (80). The collection layer (60) includes a plurality of conductive elements (70), including negative electrodes (70a) and positive electrodes (70b) as shown in FIGS. 1a, and 1b. The collection layer (60) includes a network of conductive pathways that form an Ohmic Conductivity Network (66), that electrically connects the positive electrode (70b) and negative electrodes (70a). The ohmic conductivity network (66) minimize resistance and maximize the efficiency of charge transfer. Specifically, the collection layer (60) includes P-type doped regions (22) and N-type doped regions (23) and the negative electrodes (70a) are connected to P-type doped regions (22) of the collection layer (60) and positive electrodes (70b) are connected to N-type doped regions (23) of the collection layer (60). The collection layer (60) is formed using a 4-inch silicon wafer, with a thickness of approximately 500 microns, which is cleaned to remove contaminants before further processing.

After removing the contaminants, doping is performed to establish conductive pathways within the collection layer (60). The P-type doping is applied along tracks of the silicon wafer to create connections for the negative electrodes (70a), while N-type doping is used to establish pathways for the positive electrodes (70b). The doping is applied such that the flow of electrons is directed from conductive elements (70) to the silicon wafer. The doped silicon wafer of the collection layer (60) is then oxidized to form a silicon dioxide (SiO₂) layer (33) over doped regions (22,23) and the oxide layer (33) from selected regions is removed to define electrode formation areas and power output regions in the collection layer (60). Specific regions designated for electrode formation and power output pads are stripped of this oxide layer (33). A thin layer of metal, such as nickel or titanium, is applied onto the stripped areas using a mask. The wafer is then immersed in a CuSO₄ solution for electroplating, where copper is deposited onto the conductive elements (70) of the collection layer (60) until they reach a height of approximately 50 microns with a permissible variation of ±5 microns. Further, the copper electrodes are coated with a thin layer of gold using a Gold Chloride bath. The gold plating improves conductivity and protects the electrodes from corrosion. Once the electrodes are formed, the wafer is transformed into the collection layer (60) and prepared for assembly with the base layer (20). It may be obvious to a person skilled in the art to fabricate the entire electrode structure using only gold for enhanced conductivity, corrosion resistance, and long-term stability. Other high-conductivity and corrosion-resistant materials, such as platinum or palladium, could be used depending on specific performance requirements and fabrication constraints.

For instance, if the substrate is 600-700 microns thick, and the cavity depth is 400 microns, and the exclusion zone is 100-150 microns thick, the electrodes can be extended up to 200 microns long without interfering with the exclusion zone, thereby avoiding short circuits.

The collection layer (60) is fabricated by forming conductive pathways that electrically connect the positive electrodes (70b) and negative electrodes (70a). In the present embodiment, these pathways are established using the P-type doped regions (22) and N-type doped regions (23). However, the doping process is not the only method for forming conductive pathways.

Instead of doping, metal sputtering through a photomask can be used to create the conductive tracks. This process eliminates Schottky effects, reduces complexity, and is often more cost-effective. The modified process includes Sputtering metal onto the substrate through a photomask, Coating the structure with a silicon dioxide (SiO₂) insulating layer. Stripping the oxide layer selectively from electrode formation areas. Growing electrodes on those areas using electroplating.

The conductive elements (70) are not limited to a square cross-section of 10 μm×10 μm. To optimize power generation, the electrode shape can be varied to increase the surface area while maintaining the same volume. Possible cross-sectional geometries include Hexagonal, Triangular, Multipoint star shapes, Fractal geometries as shown in FIG. 10b.

Further referring to FIGS. 11a-11c, the shape of the cavity walls can be adjusted to increase the surface area available for the formation of charge-separated zone (80). The cavity (40) walls may include formations that at least partially enclose the negative electrodes (70a), providing a stable charge-separated zone (80). The structured walls may be configured to improve charge retention and facilitate efficient charge transfer within the system (100). These wall features can be designed with microstructures to improve the stability and efficiency of charge separation. Further, the wall structures of the cavities (40) may be adapted to enclose or encapsulate the negative electrodes (70a) within specialized microstructures, ensuring improved exclusion zone stability. These wall designs may be optimized for specific energy extraction requirements, and in certain embodiments, micro structured features within the cavity (40) walls may be used to improve the stability of the charge-separated zone (80).

The coatings may selectively adhere to silicon or glass while exhibiting low affinity for metallic surfaces. This selectivity enables an alternative electrode fabrication (not shown) in which the negative electrodes (70a) may be formed directly on the base layer (20) rather than on the collection layer (60). This configuration simplifies the electrode alignment process and increases the alignment tolerance required for precise layer integration.

In the present embodiment, the base layer (20) and the collection layer (60) are assembled together by aligning the conductive elements (70) of the collection layer (60) with the substrate (30) of the base layer (20). The base layer (20) and the collection layer (60) are aligned such that the negative electrodes (70a) are positioned within the charge-separated zone (80) while the positive electrodes (70b) interact with the surrounding water (90). The base layer (20) and the collection layer (60) are bonded using a microelectronic adhesive (40) or the Nafion coating itself, which acts as an adhesive layer when cured. The assembly is then subjected to slight pressure which is >0.17 PSI and is placed in a preheated oven at approximately 200° C. for 60 minutes. During this process, the Nafion coating in the base layer (20) also acts as an adhesive, curing to form a hermetic seal between the base layer (20) and the collection layer (60). In the present embodiment, the resulting assembly, measuring 1 cm×1 cm with a thickness of 1 mm, contains 169 tightly packed cavities or cells, each capable of generating electrical energy. However, the size of the unit is not fixed and can be adjusted based on the available wafer size, the desired energy output, manufacturing scalability. For example, on a 4-inch wafer, a 7 cm×7 cm device can be produced, and the design can be repeated for any dimension as required.

It may be obvious to a person skilled in the art that the dimensions of the assembly can be increased to accommodate a greater number of cavities, thereby improving the total energy output.

After assembly, the system (100) is filled with a low molar ion concentration aqueous solution (85), such as a diluted NaCl solution. The water enters through the inlet (60a) and spreads into the interconnected cavities (40). Once the system is completely filled, water starts to exit from the outlet (60b). At this point, the inlet (60a) and outlet (60b) ports can be sealed using a waterproof tape or any suitable material to lock the aqueous solution inside and prevent evaporation or contamination.

The negative electrodes (70a) are positioned within the charge-separated zone (80), while the positive electrodes (70b) interact with the surrounding water (90). The plurality of electrical connections is coupled to the conductive elements (70), forming a potential difference that enables continuous electrical energy extraction when connected to an external load.

Referring to FIGS. 3a, 3b, 3c, the base layer (20) and collection layer (60) form a single-unit configuration, with a grid of 169 cavities (40). Each cavity (40) independently generates electrical energy. All cavities are connected in parallel, reducing internal resistance and improving current output. This configuration ensures that if some cavities fail, the rest continue to generate power, maintaining the reliability of the system.

Referring to FIGS. 6a-6c, the base layer (20) and collection layer (60) are configured in a three-dimensional stacked configuration (400), with one or more intermediate layers. Each intermediate layer includes water interaction features on one side and conductive, features on the other side.

The stacked configuration (400) consists of a stack of numerous dies, forming a 3D battery module as shown in FIG. 6a. The dies are positioned between the base layer (20) and the collection layer (60). Specifically, the top side of each die includes the charge-separated zones, while the bottom side of the die contains the electrode features. The initial stage of the production procedure of the dies includes creating the features of the base layer (20) through DRIE (Deep Reactive Ion Etching) on top. After that, the features of the collection layer (60) are created on the opposite side before proceeding to the electroplating. Finally, a layer of Nafion coating is applied on the top surface and the components such as conductive elements (70) are assembled in the stacked configuration (400).

Referring to FIGS. 7a and 7b, the collection layer (60) is configured in a high-density electrode configuration (500), including a closely spaced arrangement of positive and negative conductive elements (70). Each individual cavity (40) within this configuration includes 68 negative electrodes (70a) and 64 positive electrodes (70b).

The conductive elements (70) interact with the charge-separated zone (80) and surrounding water (90) to maximize the efficiency of charge collection. For accommodating high-density electrode configuration (500), modifications are made to the P-type doping regions (22) and N-type doping regions (23) for proper electrical connectivity. The modifications include organizing the cavities (40) in a structured grid pattern within a 1 cm×1 cm area ensuring that the electrodes within each cavity are correctly aligned with the doped regions, allowing for better charge collection and to minimize the resistance.

The walls of each cavity (40) are maintained at a thickness of 200 microns, and the size of each cavity (40) is set at 500 microns. The conductive elements (70) have an electrode footprint of approximately 10 μm×10 μm, with a length of 50 μm. The conductive elements (70) are positioned approximately 10 microns away from the surface coating (50) of the base layer. The surface coating (50) facilitates the formation of the charge-separated zone (80) with a thickness of approximately 100 microns or more when exposed to low molar concentration of aqueous solution (85).

In an embodiment the thickness of the wall cavity (40) can be reduced to approximately 50 microns to accommodate a denser arrangement of conductive elements (70). Similarly, the cavity size can be decreased to approximately 400 microns×400 microns, increasing the number of cavities (40) within the same area. A person skilled in an art can select hydrophilic materials for surface coating (50), such as Aculon, acrylate gels, Polydimethylsiloxane (PDMS), or Polyethylene Glycol (PEG), to reduce the charge-separated zone (80) size to around 50 microns for smaller cavity configuration. For getting an ultra-high-density design, the substrate (30) thickness can be reduced to approximately 250 microns and the cavity footprints can be scaled down to dimensions between 150 microns and 200 microns, and the depth of etching can be limited to approximately 100 microns. The wall thickness can also be minimized to a range of 25 microns to 30 microns, for increasing the density of cavities (40).

For instance, if a 600-micron-thick substrate is used, and the charge-separated zone is 100-150 microns, then electrodes up to 200 microns long can be used without risk of short circuits. The fabrication process can accommodate ultra-high-density designs, with cavity footprints as small as 150-200 microns. Etch depths up to 300 microns (or deeper, depending on stability). Wall thicknesses reduced to 25-30 microns.

Referring to FIGS. 8a and 8b, the base layer (20) is configured in a layered hydrophilic surface configuration (600), where pre-formed hydrophilic sheets are placed on the inner surfaces of the cavities (40). Specifically, Nafion 211 sheets with a thickness of approximately 25.4 microns, are cut into small, precise pieces and placed to the inner surfaces of the cavities (40). In the present invention Nafion 211 sheets are placed using a high-precision pick-and-place robotic mechanism. The pre-cut Nafion sheets are then placed directly into the slots formed by the matrix of electrodes and features in the base layer (20). It may be obvious to a person skilled in the art that materials other than Nafion can be used, as long as they are capable of forming exclusion zones and facilitating charge separation. Alternative materials may include Aculon, acrylate gels, Polydimethylsiloxane (PDMS), or Polyethylene Glycol (PEG), depending on requirements.

To fabricate the system (100) in this configuration, an n-type wafer is utilized for the base layer (20), and a p-type wafer is used for the collection layer (60). The process begins with deep reactive ion etching (DRIE) to create the cavity patterns in the base layer (20), followed by oxidation of the etched wafer. Selected regions in the base layer (20) are stripped of the oxide layer to define the areas for electrode formation. These regions are metallized using materials such as nickel (Ni) or titanium (Ti), and are plated with gold to improve conductivity and prevent corrosion. A similar process is applied to the collection layer (60). DRIE is used to etch patterns, which are then oxidized. Specific features in the collection layer are stripped of the oxide layer and metallized, followed by gold electroplating. The collection layer (60) acts as the positive electrode, while the base layer (20) serves as the negative electrode in the final assembly of the layered hydrophilic surface configuration. The assembly is diced into 1 cm×1 cm chips, or larger (or smaller) chips depending on design requirements, each containing an array of cavities (40) configured to generate electrical energy.

Referring to FIGS. 9a, 9b, 9c, 9d and 9e the base layer (20) and the collection layer (60) are configured in an ultra-high-density configuration (700), with cavities (40) of microscopic dimensions wherein the conductive elements (70) include nanostructured materials. The base layer (20) is fabricated with ultra-thin walls with microscopic cavities (40) and conductive elements (70) designed for maximum energy density. Each cavity (40) in this configuration is 4 to 5 microns and a 1-micron gap between adjacent cavities for water transport. To achieve this scale, ultra-thin substrates are utilized, with the base layer (20) and collection layer (60) being fabricated from silicon wafers measuring approximately 5 to 6 microns in thickness. The cavities (40) are etched to a depth between 200 microns and 300 microns, based on the stability of the substrate and the capabilities of the Deep Reactive Ion Etching (DRIE) process. The fabrication process employs Reactive Ion Etching (RIE) for cavity patterning, allowing the formation of microscopic features with high accuracy. The hydrophilic coatings in this configuration utilize materials such as bilipids, proteins, cellulose which are applied using molecular imprinting techniques. The precise coating process provides proper interaction with the water to form a stable charge-separated zone within each cavity (40).

Further the collection layer (60) in the ultra-high-density configuration (700) includes nanostructured conductive elements (70), including selectively grown gold nanowires. The nanowires serve as electrodes and are positioned in designated locations to interact with the charge-separated zone (80) and the surrounding water (90). Particularly gold nanowires are chosen for their durability, electrical conductivity, chemical inertness and resistance to damage. Alternatively platinum nanowires are also used for the desired purpose. The collection layer is created by performing doping in the conductive tracks of the silicon wafer, for charge transport from the nanowire electrodes to the external load. The assembly process involves direct wafer bonding for ensuring precise alignment of the base layer and collection layer while forming a hermetic seal. This bonding maintains the integrity of the ultra-thin structure and ensuring reliable operation in microscopic dimensions.

The system (100) the system (100) is fabricated using three-dimensional (3D) printing techniques or in combination with microfabrication processes. In an alternative embodiment, 3D printing methods may be used for feature generation, either as a standalone manufacturing technique or in combination with traditional microfabrication approaches. The use of 3D printing may facilitate the creation of complex cavity geometries, customized hydrophilic surface treatments, and high-density electrode configurations with increased fabrication efficiency.

Referring to FIG. 2, a method (200) for fabricating a system (100) for generating electrical energy from a volume of water is provided. The method (200) includes the following steps.

The method (200) starts at step 210.

At step 220, a base layer (20) is fabricated by forming a substrate (30) with a plurality of cavities (40) dimensioned to hold water. The fabrication of the base layer (20) begins with a standard cleaning procedure of the silicon wafer, which serves as the base material. After cleaning, photolithography is used to define the cavity patterns on the substrate (30). A photomask is applied to the surface, and the exposed areas are processed to prepare for etching. The defined patterns are then etched into the substrate (30) using Deep Reactive Ion Etching (DRIE), resulting in cavities (40) with a depth of approximately 200 microns.

At step 230, a surface coating (50) is applied to the substrate (30) to induce the formation of a charge-separated zone (80) when in contact with water. The surface coating (50) is hydrophilic coating that involves depositing a Nafion dispersion solution onto the substrate (30), making the cavities (40) completely saturated, with slight overflow along the boundaries. The substrate (30) is then placed in a vacuum chamber (not shown in Figure) to remove solvents from the Nafion solution, leaving a uniform hydrophilic coating with a thickness of 1 micron. The vacuum-assisted deposition process is repeated until the desired coating thickness is achieved.

At step 240, a collection layer (60) is fabricated by forming conductive elements (70) including negative electrodes (70a) and positive electrodes (70b). The fabrication of the collection layer (60) begins with the cleaning of the silicon wafer to remove any contaminants. After that, predefined tracks of the collection layer (60) are doped with P-type dopants to form regions for the negative electrodes (70a) and N-type dopants to form regions for the positive electrodes (70b). After doping, the silicon wafer is oxidized, creating a silicon dioxide (SiO₂) insulating layer (33) over the doped regions. For defining the electrode formation areas and power output regions, the oxide layer (33) is selectively stripped from these regions. A thin metallic layer of nickel or titanium is applied onto the stripped regions to serve as a base for the electrodes (70a, 70b). Electroplating is then used to deposit copper onto these metallic regions, forming conductive elements (70) with a height of approximately 50 microns with a permissible variation of ±5 microns. Following the copper deposition, a thin layer of gold is electroplated onto the conductive elements (70).

Further an inlet (60a) and outlet (60b) are formed in the collection layer (60) to enable water circulation through the cavities (40) arranged in the base layer (20). The inlet (60a) and outlet (60b) are fabricated using DRIE, similar to the cavity etching process. The inlet (60a) and outlet (60b) maintain the flow of a low molar ion concentration aqueous solution (90) through the interconnected cavities (40) of the base layer (20). In the present invention a diluted NaCl is used as a low molar ion concentration aqueous solution. Unlike a continuous flow system, once the aqueous solution enters through the inlet (60a), it spreads into all the cavities due to their interconnected pattern. Once all the cavities are completely filled, the solution will start to exit through the outlet (60b). At this point, no additional solution is needed, and the inlet (60a) and outlet (60b) ports can be sealed off (e.g., using a simple inert tape) to lock the solution inside.

At step 250, electrical connections are formed to couple the conductive elements (70) for establishing a potential difference. Specifically, the P-type and N-type doped regions (22,23) along with the conductive elements (70), are interconnected to form the electric circuit. These connections enable the potential difference generated within the charge-separated zone (80) to be efficiently extracted and transferred to an external load.

At step 260, the base layer (20) and the collection layer (60) are assembled by aligning the conductive elements (70) of the collection layer (60) with the substrate (30) of the base layer (20) and bonding the base layer (20) and collection layer (60) using an adhesive (44) to form a sealed interface. Specifically, the aligned base layer (20) and collection layer (60) are bonded using a microelectronic adhesive, which forms a sealed interface between the base layer (20) and the collection layer (60). The bonding process involves applying slight pressure greater than 0.17 PSI and curing the adhesive (44) in an oven at approximately 200° C. for 60 minutes. During this process, the Nafion coating on the base layer (20) also contributes to the bonding, acting as an adhesive layer and create a hermetic seal that prevents water leakage through the cavities (40). If Nafion is used, it acts as an adhesive layer when cured. Alternatively, a separate microelectronic adhesive can be applied to ensure a secure bond between the base layer (20) and the collection layer (60). The resulting assembly contains a tightly packed array of cavities (40), each capable of generating electrical energy independently.

At step 270, a low molar ion concentration aqueous solution (85) is allowed to flow through the inlet (60a) and outlet (60b) to create the charge-separated zone (80). The charge-separated zone (80) thus created enables electrical energy to be extracted through the conductive elements (70) when connected to an external load. Specifically, the water flows through the interconnected cavities (40) in the base layer (20), saturating the system (100) and enabling the formation of a charge-separated zone (80) along the Nafion-coated surfaces. When the system (100) is connected to an external load, the potential difference drives an electrical current through the load, enabling the extraction of electrical energy. The charge-separated zone (80) is sustained by ambient infrared (IR) energy from the surroundings.

The method (200) ends at step 280.

By way of non-limiting example, an application of the system (100) is described below. For example, if a sensor is deployed in a remote agricultural field to monitor soil moisture. The sensor can be powered continuously by using the water-based system (100). The system (100) does not require traditional chemical reactions or recharging, as the system (100) continuously generates power from environmental infrared (IR) radiation, which maintains the charge separation zone phenomenon in the water.

The sensor would rely on infra-red energy naturally present in the environment, and the surface coating (50) maintains the charge separated zone (80). The conductive elements (70) positioned within the charge separated zone (80) and the surrounding water (90) continuously collect charges thereby generating a steady current that powers the sensor without interruption or the need for conventional battery replacement.

Thus, the present invention has an advantage of providing a highly efficient and scalable system and method for generating electrical energy from a volume of water. By utilizing the charge-separated zone phenomenon, the invention harnesses the natural ability of water interacting with hydrophilic surfaces to form an exclusion zone, where charge separation occurs. This approach not only enables the generation of sustainable energy but also ensures continuous operation by maintaining the exclusion zone through the absorption of ambient infrared energy. Through the integration of advanced microfabrication techniques, the invention achieves precision and scalability, making it suitable for mass production. Utilizing silicon wafer platforms and batch production processes, the system reduces fabrication costs. The use of robust materials and durable, corrosion-resistant electrodes further ensures long-term operational efficiency and reliability, even under varying environmental conditions.

Moreover, the system is designed to maximize energy extraction by aligning conductive elements within the charge-separated zone. This alignment enhances charge collection efficiency and improves overall performance. The invention also supports versatile configurations, including single-unit designs, three-dimensional stacked architectures, and ultra-high-density arrangements, catering to a wide range of energy generation requirements.

The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the present invention to the precise forms disclosed, and obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the present invention and its practical application, and to thereby enable others skilled in the art to best utilize the present invention and various embodiments with various modifications as are suited to the particular use contemplated. It is understood that various omissions and substitutions of equivalents are contemplated as circumstances may suggest or render expedient, but such omissions and substitutions are intended to cover the application or implementation without departing from the scope of the claims of the present invention.