SUBSTRATE POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefits of Japanese application no. 2024-090081, filed on Jun. 3, 2024. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

Technical Field

The disclosure relates to a substrate polishing apparatus and a substrate processing apparatus.

Description of Related Art

Conventionally, a substrate polishing apparatus for planarizing a surface of a substrate such as a silicon wafer, etc. by chemical mechanical polishing (CMP) has been known. The substrate polishing apparatus include a polishing table which rotates, a polishing head which holds a substrate and presses the substrate against the polishing table, and a swinging arm which swings the polishing head (for example, refer to Patent Literature 1 (Japanese Patent Application Laid-Open No. 2014-147990)).

Incidentally, a bearing device that pivotally supports the polishing head is provided inside the swinging arm. The bearing device needs to be cooled with cooling water because heat is generated by the rotation of the polishing head. Additionally, the cooling water also has the purpose of lubricating a sliding surface in an environment where lubricating oil is unable to be used. As the cooling water, clean pure water, which has little influence on the substrate, is preferable. In this case, pure water supply piping is introduced from the outside into the inside of the swinging arm and is to be connected to the bearing device. However, due to the swinging of the swinging arm, the pure water supply piping may become twisted, causing blockage of the flow path inside the piping, or force resulting from the twisting may be continuously applied, leading to damage of the piping itself.

The disclosure is to mitigate the influence of twisting on the pure water supply piping.

SUMMARY

A substrate polishing apparatus according to an aspect of the disclosure includes: a polishing table which rotates; a polishing head which holds a substrate and presses the substrate against the polishing table; a swinging arm which swings the polishing head; a bearing device which is disposed in an inside of the swinging arm and pivotally supports the polishing head; and pure water supply piping which is introduced into the inside of the swinging arm and supplies pure water to the bearing device. The pure water supply piping includes a spiral part which is wound so as to go around a swinging axis line of the swinging arm.

In the above-described substrate polishing apparatus, an opening part is formed on an upper surface of the swinging arm on the swinging axis line, and the pure water supply piping may include a first straight line part extending upward from the spiral part and passing through the opening part, and a second straight line part extending from the upper end of the first straight line part in a direction intersecting with the swinging axis line and fixed to an outside of the swinging arm.

In the above-described substrate polishing apparatus, the first straight line part may be disposed along the swinging axis line.

In the above-described substrate polishing apparatus, the spiral part may be extendable and retractable in an up-down direction.

In the above-described substrate polishing apparatus, the pure water supply piping may be formed from perfluoroalkoxy alkane.

A substrate processing apparatus according to an aspect of the disclosure includes the above-described substrate polishing apparatus which polishes a substrate, and a substrate cleaning apparatus which cleans the substrate polished by the substrate polishing apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment.

FIG. 2 is a perspective view of a substrate polishing apparatus according to an embodiment.

FIG. 3 is a configuration diagram of a substrate polishing apparatus according to an embodiment.

FIG. 4 is a plan view of a swinging arm according to an embodiment.

FIG. 5 is a perspective view of pure water supply piping according to an embodiment.

DESCRIPTION OF THE EMBODIMENTS

According to an aspect of the disclosure described above, the influence of twisting on the pure water supply piping can be mitigated.

Hereinafter, an embodiment of the disclosure will be described with reference to the drawings.

FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus 1 according to an embodiment.

A substrate processing apparatus 1 shown in FIG. 1 is a chemical mechanical polishing (CMP) apparatus that polishes a surface of a substrate W such as a silicon wafer to a flat surface. The substrate processing apparatus 1 includes a rectangular box-shaped housing 2. The housing 2 is formed to be approximately rectangular in a plan view.

Note that, the substrate W, which is a processing target, includes various devices such as a semiconductor wafer, a glass substrate (for a liquid crystal display device or for a plasma display), a substrate for an optical disc, a substrate for a magneto-optical disc, a substrate for a magnetic disc, a printed wiring board, a substrate for a memory circuit, a substrate for a logic circuit, and a substrate for an image sensor (for example, a substrate for a CMOS sensor), etc. Also, the shape is not limited to a circular shape, and for example, may be a rectangular shape. Also, in the case of a circular shape, the size of the semiconductor wafer includes, for example, wafers with diameters of 100 mm, 150 mm, 200 mm, 300 mm, and 450 mm.

The housing 2 includes a substrate transport path 3 extending in a longitudinal direction in the center thereof. A load/unload part 10 is disposed at one end part in the longitudinal direction of the substrate transport path 3. A polishing part 20 is disposed on one side in a width direction of the substrate transport path 3 (a direction orthogonal to the longitudinal direction in a plan view), and a cleaning part 30 is disposed on the other side thereof. A transport part 40 which transports the substrate W is provided in the substrate transport path 3. Further, the substrate processing apparatus 1 includes a control part 50 (control panel) which integrally controls operations of the load/unload part 10, the polishing part 20, the cleaning part 30, and the transport part 40.

The load/unload part 10 includes a front load part 11 which accommodates the substrate W. Multiple front load parts 11 are provided on one side surface in the longitudinal direction of the housing 2. The multiple front load parts 11 are arranged in the width direction of the housing 2. The front load part 11, for example, mounts an open cassette, a Standard Manufacturing Interface (SMIF) pod, or a Front Opening Unified Pod (FOUP). The SMIF and FOUP are sealed containers that house a cassette of the substrate W internally and are covered by a partition wall, and can maintain an environment independent of the external space.

Further, the load/unload part 10 includes two transport robots 12 which load and unload the substrate W to and from the front load part 11, and a traveling mechanism 13 which causes each of the transport robots 12 to travel along the arrangement of the front load parts 11. Each of the transport robots 12 is provided with two hands, one above and one below, and uses the hands differently for the substrate W before processing and the substrate W after processing. For example, in the case of returning the substrate W to the front load part 11, the upper hand is used, and in the case of taking out the substrate W before processing from the front load part 11, the lower hand is used.

The polishing part 20 includes multiple substrate polishing apparatuses 21 (21A, 21B, 21C, and 21D) which perform polishing (planarization) of the substrate W. The substrate polishing apparatuses 21 are arranged in the longitudinal direction of the substrate transport path 3. The substrate polishing apparatus 21 includes a polishing table 23 which rotates a polishing pad 22 having a polishing surface, a polishing head 24 for holding the substrate W and polishing the substrate W while pressing the substrate W against the polishing pad 22 on the polishing table 23, a polishing liquid supply nozzle 25 for supplying a polishing liquid or a dressing liquid (for example, pure water) to the polishing pad 22, a dresser 26 for performing dressing of the polishing surface of the polishing pad 22, and an atomizer 27 which sprays a mixed fluid of a liquid (for example, pure water) and a gas (for example, nitrogen gas) or a liquid (for example, pure water) in a mist form onto the polishing surface.

In the substrate polishing apparatus 21, while supplying a polishing liquid from the polishing liquid supply nozzle 25 onto the polishing pad 22, the substrate W is pressed against the polishing pad 22 by the polishing head 24, and further, by causing relative movement between the polishing head 24 and the polishing table 23, the substrate W is polished and the surface thereof is planarized. The dresser 26 has hard particles such as diamond particles or ceramic particles fixed to a tip of a rotating part that contacts the polishing pad 22, and by rotating and swinging the rotating part, uniformly dresses the entire polishing surface of the polishing pad 22 and forms a flat polishing surface. The atomizer 27, by washing away polishing debris, abrasive grains, and the like remaining on the polishing surface of the polishing pad 22 with a high-pressure fluid, achieves purification of the polishing surface and conditioning of the polishing surface by the dresser 26, which is a mechanical contact, that is, regeneration of the polishing surface.

The cleaning part 30 includes multiple substrate cleaning apparatuses 31 (31A and 31B) which perform cleaning of the substrate W, and a substrate drying apparatus 32 which dries the cleaned substrate W. The substrate cleaning apparatuses 31 and the substrate drying apparatus 32 are arranged in the longitudinal direction of the substrate transport path 3. A first transport chamber 33 is provided between the substrate cleaning apparatus 31A and the substrate cleaning apparatus 31B. In the first transport chamber 33, a transport robot 35 is provided, which transports the substrate W between the transport part 40, the substrate cleaning apparatus 31A, and the substrate cleaning apparatus 31B. Further, a second transport chamber 34 is provided between the substrate cleaning apparatus 31B and the substrate drying apparatus 32. In the second transport chamber 34, a transport robot 36 is provided, which transports the substrate W between the substrate cleaning apparatus 31B and the substrate drying apparatus 32.

The substrate cleaning apparatus 31A, for example, includes a module (hereinafter referred to as a roll-type cleaning module) including a roll-type substrate cleaning member (a surface of which is a polyvinyl alcohol (PVA) sponge or a urethane sponge), and performs primary cleaning of the substrate W. Further, the substrate cleaning apparatus 31B also includes a roll-type cleaning module, and performs secondary cleaning of the substrate W. It should be noted that the substrate cleaning apparatus 31A and the substrate cleaning apparatus 31B may be of the same type or different types of cleaning modules, and may be, for example, a cleaning module including a pencil-type substrate cleaning member, or a cleaning module including a two-fluid jet type two-fluid jet nozzle that ejects a gaseous medium and gas, or the like.

The substrate drying apparatus 32, for example, includes a drying module that performs Rotagoni drying (Iso-Propyl Alcohol (IPA) drying). After drying, a shutter 1a provided on the partition wall between the substrate drying apparatus 32 and the load/unload part 10 is opened, and the substrate W is taken out from the substrate drying apparatus 32 by the transport robot 12.

It should be noted that “cleaning” includes not only normal cleaning using a liquid such as a chemical liquid or pure water (referred to as wet cleaning in the embodiment) but also cleaning that does not use a liquid during cleaning (referred to as dry cleaning). In other words, one of the substrate cleaning apparatus 31A and the substrate cleaning apparatus 31B may be a wet cleaning part, and the other may be a dry cleaning part. Further, in the case of performing wet cleaning before performing dry cleaning, the above-described substrate drying apparatus 32 may be disposed in order to dry the substrate W.

The transport part 40 includes a lifter 41, a first linear transporter 42, a second linear transporter 43, and a swing transporter 44. In the substrate transport path 3, a first transport position TP1, a second transport position TP2, a third transport position TP3, a fourth transport position TP4, a fifth transport position TP5, a sixth transport position TP6, and a seventh transport position TP7 are set in order from the load/unload part 10 side.

The lifter 41 is a mechanism that transports the substrate W up and down at the first transport position TP1. The lifter 41 receives the substrate W from the transport robot 12 of the load/unload part 10 at the first transport position TP1. Further, the lifter 41 delivers the substrate W received from the transport robot 12 to the first linear transporter 42. On the partition wall between the first transport position TP1 and the load/unload part 10, a shutter 1b is provided, and during transport of the substrate W, the shutter 1b is opened, and the substrate W is delivered from the transport robot 12 to the lifter 41.

The first linear transporter 42 is a mechanism that transports the substrate W between the first transport position TP1, the second transport position TP2, the third transport position TP3, and the fourth transport position TP4. The first linear transporter 42 includes multiple transport hands 45 (45A, 45B, 45C, and 45D), and a linear guide mechanism 46 that moves each of the transport hands 45 in a horizontal direction at multiple heights. The transport hand 45A moves between the first transport position TP1 and the fourth transport position TP4 by the linear guide mechanism 46. The transport hand 45A is a pass hand for receiving the substrate W from the lifter 41 and delivering the substrate W to the second linear transporter 43.

The transport hand 45B moves between the first transport position TP1 and the second transport position TP2 by the linear guide mechanism 46. The transport hand 45B receives the substrate W from the lifter 41 at the first transport position TP1, and delivers the substrate W to the substrate polishing apparatus 21A at the second transport position TP2. The transport hand 45B is provided with a lifting drive part, and in the case of delivering the substrate W to the polishing head 24 of the substrate polishing apparatus 21A, the lifting drive part rises, and after delivering the substrate W to the polishing head 24, the lifting drive part lowers. Note that the transport hand 45C and the transport hand 45D are also provided with a similar lifting drive part.

The transport hand 45C moves between the first transport position TP1 and the third transport position TP3 by the linear guide mechanism 46. The transport hand 45C receives the substrate W from the lifter 41 at the first transport position TP1, and delivers the substrate W to the substrate polishing apparatus 21B at the third transport position TP3. Also, the transport hand 45C also functions as an access hand that receives the substrate W from the polishing head 24 of the substrate polishing apparatus 21A at the second transport position TP2, and delivers the substrate W to the substrate polishing apparatus 21B at the third transport position TP3.

The transport hand 45D moves between the second transport position TP2 and the fourth transport position TP4 by the linear guide mechanism 46. The transport hand 45D functions as an access hand that receives the substrate W from the polishing head 24 of the substrate polishing apparatus 21A or the substrate polishing apparatus 21B at the second transport position TP2 or the third transport position TP3, and delivers the substrate W to the swing transporter 44 at the fourth transport position TP4.

The swing transporter 44 has a hand movable between the fourth transport position TP4 and the fifth transport position TP5, and delivers the substrate W from the first linear transporter 42 to the second linear transporter 43. Also, the swing transporter 44 delivers the substrate W polished in the polishing part 20 to the cleaning part 30. A temporary placement stand 47 for the substrate W is provided on a side of the swing transporter 44. The swing transporter 44 turns over the substrate W received at the fourth transport position TP4 or the fifth transport position TP5 and places the substrate W on the temporary placement stand 47. The substrate W placed on the temporary placement stand 47 is transported to the first transport chamber 33 by the transport robot 35 of the cleaning part 30.

The second linear transporter 43 is a mechanism that transports the substrate W between the fifth transport position TP5, the sixth transport position TP6, and the seventh transport position TP7. The second linear transporter 43 includes multiple transport hands 48 (48A, 48B, and 48C), and a linear guide mechanism 49 that moves each of the transport hands 45 in the horizontal direction at multiple heights. The transport hand 48A moves between the fifth transport position TP5 and the sixth transport position TP6 by the linear guide mechanism 49. The transport hand 45A functions as an access hand that receives the substrate W from the swing transporter 44 and delivers the substrate W to the substrate polishing apparatus 21C.

The transport hand 48B moves between the sixth transport position TP6 and the seventh transport position TP7. The transport hand 48B functions as an access hand that receives the substrate W from the substrate polishing apparatus 21C and delivering the substrate W to the substrate polishing apparatus 21D. The transport hand 48C moves between the seventh transport position TP7 and the fifth transport position TP5. The transport hand 48C functions as an access hand for receiving the substrate W from the polishing head 24 of the substrate polishing apparatus 21C or the substrate polishing apparatus 21D at the sixth transport position TP6 or the seventh transport position TP7, and delivering the substrate W to the swing transporter 44 at the fifth transport position TP5. Although the description is omitted, the operation of the transport hand 48 at the time of delivering the substrate W is similar to the operation of the first linear transporter 42 described above.

FIG. 2 is a perspective view of the substrate polishing apparatus 21 according to an embodiment.

The substrate polishing apparatus 21, as shown in FIG. 2, includes the polishing table 23 which rotates around a central axis line O1, the polishing head 24 which holds the substrate W and presses the substrate W against the polishing table 23, and a swinging arm 60 which swings the polishing head 24 around a swinging axis line O2. The swinging axis line O2 of the swinging arm 60 extends parallel to the central axis line O1 of the polishing table 23.

The polishing head 24 is configured to be able to hold the substrate W on a lower surface thereof by vacuum suction. The swinging arm 60 is configured to be swingable around an arm shaft 61. An opening part 62 is formed on an upper surface of the swinging arm 60 on the swinging axis line O2. From the opening part 62, pure water supply piping 100 described later, various piping (air piping, etc.) other than the pure water supply piping 100, and various electrical wiring are introduced into the inside of the swinging arm 60.

FIG. 3 is a configuration diagram of the substrate polishing apparatus 21 according to an embodiment.

The swinging arm 60 includes an arm body 60A connected to the upper end of the arm shaft 61, and an arm cover 60B covering the arm body 60A. Inside the swinging arm 60, a rotating device 70 which rotates the polishing head 24, a bearing device 80 which rotatably supports the polishing head 24, and a lifting device 90 which lifts and lowers the polishing head 24 are provided.

On the lower surface of the polishing head 24, a retaining ring 24a, which is movable up and down to adjust a polishing amount of the substrate W, is provided. A polishing head shaft 24b is connected to an upper surface of the polishing head 24. The polishing head shaft 24b is coupled to a rotating cylinder 73 via a key (not shown) extending in an up-down direction. The rotating device 70 rotates the rotating cylinder 73 via a polishing head motor 71, a timing pulley 72, and a timing belt 74. As the rotating cylinder 73 rotates, the polishing head 24 connected to the polishing head shaft 24b rotates.

The bearing device 80 includes a bearing 81 which supports the polishing head shaft 24b, and a rotary joint 82 attached to the upper end of the polishing head shaft 24b. The bearing 81 is supported by the lifting device 90 so as to be movable up and down. The pure water supply piping 100, which will be described later, is connected to the rotary joint 82 via a piping connector 110 and connection piping 111. The pure water supply piping 100 supplies pure water as quench water (cooling water) to the rotary joint 82. Note that air piping (not shown), etc., which generate a negative pressure on a lower surface of the polishing head 24 via the polishing head shaft 24b, are connected to the rotary joint 82.

The lifting device 90 includes a lifting motor 91, a ball screw device 92, and a bridge 93. The lifting motor 91 is fixed to the arm body 60A via a support stand 94. The ball screw device 92 includes a screw shaft coupled to the lifting motor 91, and a nut with which the screw shaft is screwed. The nut is coupled to the bridge 93. In response to rotation of the lifting motor 91, the bridge 93 moves up and down via the ball screw device 92, whereby the polishing head shaft 24b and the polishing head 24 move up and down. Note that the height of the polishing head 24 can be measured by a height sensor facing the bridge 93.

FIG. 4 is a plan view of the swinging arm 60 according to an embodiment. FIG. 5 is a perspective view of the pure water supply piping 100 according to an embodiment.

The swinging arm 60 swings as shown in FIG. 4. Specifically, the swinging arm 60 swings at an angle θ1 during polishing of the substrate W. Also, the swinging arm 60 swings at an angle θ2 in the case of delivering the substrate W. That is, the swinging arm 60 swings at an angle θ3, which is a sum of the angle θ1 and the angle θ2. Specifically, the angle θ3 is set within a range of 110° to 150°, preferably within a range of 120° to 140°, and more preferably within a range of 125° to 135°.

The pure water supply piping 100 has a shape that mitigates the influence due to the swinging of the swinging arm 60. Specifically, the pure water supply piping 100, as shown in FIG. 5, includes a spiral part 101, a first straight line part 102, and a second straight line part 103. The pure water supply piping 100 is formed from, for example, perfluoroalkoxy alkane (PFA) which is exemplary in heat resistance, water repellency, chemical resistance, and flexibility. Note that the pure water supply piping 100 may be formed from a fluororesin other than PFA, or other materials having chemical resistance, heat resistance, and ease of processing, if the pure water supply piping 100 includes predetermined flexibility.

At the lower end of the spiral part 101, a fixed part 101a connectable with the piping connector 110 (see FIG. 3) inside the swinging arm 60 is attached. The spiral part 101 is wound so as to go around the swinging axis line O2 of the swinging arm 60. This allows the pure water supply piping 100 to flexibly follow twisting around the swinging axis line O2. Also, the spiral part 101 is extendable and retractable in the up-down direction. Therefore, the pure water supply piping 100 can flexibly accommodate not only the swinging of the swinging arm 60 but also minute vibrations during polishing of the substrate W and individual differences in the mounting position of the piping. Note that the diameter of the spiral part 101 may be within a range that can be accommodated in the space of the installation location. Also, the pitch of the spiral part 101 may be uniform or may be non-uniform.

The first straight line part 102 is disposed along the swinging axis line O2. The first straight line part 102, as shown in FIG. 3, extends upward from the spiral part 101 and is provided so as to pass through the opening part 62 of the arm cover 60B. The second straight line part 103 extends from the upper end of the first straight line part 102 in a direction intersecting with the swinging axis line O2 (in the embodiment, a perpendicular direction). At an end part of the second straight line part 103, a fixed part 103a is provided. The fixed part 103a is, for example, fixed to a connection connector (not shown) provided in a housing enclosing the substrate polishing apparatus 21, and is connected to a pure water supply apparatus (not shown) via the connection connector.

According to the substrate polishing apparatus 21 of the above configuration, since the pure water supply piping 100 includes the spiral part 101 wound so as to go around the swinging axis line O2 of the swinging arm 60, as shown in FIG. 4, even in the case where the swinging arm 60 swings, twisting of the piping due to the swinging can be absorbed. For this reason, blockage of the flow path in the pure water supply piping 100 due to twisting is prevented, and furthermore, since excessive force is no longer continuously applied to the pure water supply piping 100, damage to the piping itself can also be prevented.

As described above, the substrate polishing apparatus 21 according to the embodiment includes: the polishing table 23 which rotates; the polishing head 24 which holds the substrate W and presses the substrate W against the polishing table 23; the swinging arm 60 which swings the polishing head 24; the bearing device 80 which is disposed in an inside of the swinging arm 60 and pivotally supports the polishing head 24; and the pure water supply piping 100 which is introduced into the inside of the swinging arm 60 and supplies pure water to the bearing device 80. The pure water supply piping 100 includes the spiral part 101 wound so as to go around the swinging axis line O2 of the swinging arm 60. According to the configuration, the influence of twisting on the pure water supply piping 100 can be mitigated.

Further, in the embodiment, the opening part 62 is formed on the upper surface of the swinging arm 60 on the swinging axis line O2, and the pure water supply piping 100 includes the first straight line part 102 extending upward from the spiral part 101 and passing through the opening part 62, and a second straight line part 103 extending from the upper end of the first straight line part 102 in the direction intersecting with the swinging axis line O2 and fixed to the outside of the swinging arm 60. According to the configuration, from a limited space in an upper part of the swinging arm 60, the pure water supply piping 100 can be introduced into the inside of the swinging arm 60, and pure water can be stably supplied to the bearing device 80. Note that, in the embodiment, pure water is supplied to the rotary joint 82, but in order to cool the bearing 81, pure water may also be supplied to the bearing 81.

Further, in the embodiment, the first straight line part 102 is disposed along the swinging axis line O2. According to the configuration, because a center of the spiral part 101 coincides with the swinging axis line O2, and also a part above the spiral part 101 becomes slim, it is less likely to interfere with other piping or electrical wiring.

Further, in the embodiment, the spiral part 101 is extendable and retractable in the up-down direction. According to the configuration, minute vibrations during polishing of the substrate W and also individual differences in the mounting position of the piping can be flexibly accommodated and absorbed.

Further, in the embodiment, the pure water supply piping 100 is formed from perfluoroalkoxy alkane. According to the configuration, the pure water supply piping 100 can include exemplary heat resistance, water repellency, chemical resistance, and flexibility.

Further, the substrate processing apparatus 1 according to the embodiment includes a substrate polishing apparatus 21 which polishes the substrate W, and a substrate cleaning apparatus 31 which cleans the substrate W polished by the substrate polishing apparatus 21. According to the configuration, the influence of twisting on the pure water supply piping 100 can be mitigated.

While exemplary embodiments of the disclosure have been described and illustrated above, it should be understood that the embodiments are illustrative of the disclosure and should not be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the disclosure. Accordingly, the disclosure should not be deemed to be limited by the foregoing description, but is limited by the scope of claims.

For example, in the above-described embodiment, the spiral part 101 is provided at a lower part of the pure water supply piping 100, but the spiral part 101 may be provided at any position of apart of the pure water supply piping 100 extending in the up-down direction. Further, the spiral part 101 may be provided over an entire part of the pure water supply piping 100 extending in the up-down direction.

Further, the number of turns of the spiral part 101 may be at least one.

Further, for example, a hollow cylinder may be disposed inside the spiral part 101, and by supporting the spiral part 101 from an inside thereof, an inclination of the pure water supply piping 100 with respect to a vertical direction may be suppressed. In addition, in the case of disposing the hollow cylinder inside the spiral part 101, in order to prevent rubbing between the spiral part 101 and the hollow cylinder, it is preferable that an outer diameter of the hollow cylinder is made slightly smaller than an inner diameter of the spiral part 101.

Incidentally, since providing a hollow cylinder increases the number of parts and cost, as in the above-described embodiment, it is preferable to provide the spiral part 101 at a lower part of the pure water supply piping 100 so that an inclination with respect to a vertical direction can also be accommodated.

For example, in the above-described embodiment, although a configuration is exemplified in which the substrate polishing apparatus of the disclosure is disposed in a substrate processing apparatus for CMP, it may be a standalone substrate polishing apparatus, and the configuration can also be applied to apparatuses other than a CMP apparatus (for example, a back surface polishing apparatus, a bevel polishing apparatus and the like).