AUTOMATED CMP PAD CHANGE FOR CMP SYSTEM

Description

BACKGROUND

Field

Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In particular, embodiments herein relate to CMP systems and methods for automatically changing a polishing pad of such CMP systems.

Description of the Related Art

Chemical mechanical polishing (CMP) is commonly used in the manufacturing of semiconductor devices to polish a layer of material deposited on a substrate surface. In a typical CMP process, a substrate is retained in a substrate carrier, which presses the backside of the substrate towards a rotating polishing pad in the presence of a polishing fluid. Generally, the polishing fluid includes an aqueous solution of one or more chemical constituents and nanoscale abrasive particles suspended in the aqueous solution. Material is removed across the material layer surface of the substrate in contact with the polishing pad through a combination of chemical and mechanical activity, which is provided by the polishing fluid and the relative motion of the substrate and the polishing pad. Polishing pads can progressively degrade in performance over time.

CMP is typically a labor-intensive process, primarily due to the need to frequently change consumables, such as polishing pads. Pad changes can occur daily, and each change can be quite time consuming. Further, for each pad change, pad break-in and qualification procedures are also performed, which adds to the turn time. Safety and floor contamination are also considerations with manual pad change processes.

Accordingly, there is a need in the art for CMP systems and related methods that solve one or more of the challenges noted above.

SUMMARY

The present disclosure provides chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices, with the CMP systems including features that enable automated polishing pad changes. Methods of automatically changing a polishing pad of a CMP system are also provided.

In one embodiment, a CMP system is provided. The CMP system includes a platen having a pad mounting surface and forming a plurality of apertures that extend to the pad mounting surface. The CMP system also includes a pad handler arranged to selectively move a pad onto the pad mounting surface during pad installation, and to selectively move the pad from the pad mounting surface during pad removal. Further, the CMP system includes a vacuum arranged to selectively apply a vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface.

In another embodiment, a controller for use in a chemical mechanical polishing (CMP) system is provided. The controller includes one or more processors and one or more memory devices storing a program, which, when executed by any combination of the one or more processors, causes the one or more processors to perform an operation. The operation includes moving, using a pad handler, a pad onto, or from, a pad mounting surface of a platen, wherein the platen forms a plurality of apertures that extend to the pad mounting surface. The operation also includes selectively controlling a vacuum pump to apply vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface or to release the pad from the pad mounting surface.

In yet another embodiment, a method is provided. The method includes moving, using a pad handler, a pad onto, or from, a pad mounting surface of a platen, wherein the platen forms a plurality of apertures that extend to the pad mounting surface. The method also includes selectively controlling a vacuum pump to apply vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface or to release the pad from the pad mounting surface.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of the disclosure and are therefore not to be considered limiting of its scope, as the disclosure may admit to other equally effective embodiments.

FIG. 1 illustrates an example chemical mechanical polishing (CMP) system, according to one or more embodiments of the disclosure.

FIG. 2 illustrates a schematic view of an example automated pad change system for a CMP system, according to one or more embodiments of the disclosure.

FIG. 3 illustrates a top plan view of an example platen for the automated pad change system of FIG. 2, according to one or more embodiments of the disclosure.

FIGS. 4 and 5 illustrate cross-sectional views of example pads for the automated pad change system of FIG. 2, according to one or more embodiments of the disclosure.

FIG. 6 illustrates a perspective view of an example pad holder for the automated pad change system of FIG. 2, according to one or more embodiments of the disclosure.

FIGS. 7A through 7F illustrate a pad installation process using the automated pad change system of FIG. 2, according to one or more embodiments of the disclosure.

FIGS. 8A through 8F illustrate a pad removal process using the automated pad change system of FIG. 2, according to one or more embodiments of the disclosure.

FIG. 9 is a flow diagram for an example method, according to one or more embodiments of the disclosure.

To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

The present disclosure provides an automated pad change system for a chemical mechanical polishing (CMP) system, as well as a controller and method of automatically changing polishing pads of a CMP system. Automating the pad change process using the automated pad change system and techniques disclosed herein can advantageously increase pad change times, and consequently, substrate polishing throughput for a given time frame. Moreover, using the automated pad change system and techniques disclosed herein can reduce labor needed for CMP processing, safety incidents, and contamination on a factory floor. Other advantages, benefits, and/or technical effects are contemplated.

In one example aspect, an automated pad change system for a CMP system is provided. The system can include at least one platen having a pad mounting surface upon which a pad can be mounted. The platen forms a plurality of apertures that extend to the pad mounting surface. The plurality of apertures are in fluid communication with a vacuum pump. The vacuum pump can be arranged to selectively apply a vacuum within the plurality of apertures. For instance, during CMP processing of a substrate, the vacuum pump can be controlled to apply a vacuum within the apertures to “vacuum hold” the pad to the platen. During an automated pad change process, however, the vacuum pump can be controlled to cease applying the vacuum so as to “release” the pad from the platen. The system can also include a pad handler arranged to selectively move a pad onto the pad mounting surface during a pad installation process, and to selectively move the pad from the pad mounting surface during pad removal.

To install a new pad on the platen, the pad handler can use a plurality of rollers to retrieve the new pad from a new pad cartridge of a pad storage unit, and the rollers can guide the new pad onto the platen, with at least one pair of the rollers moving to discrete positions to guide the new pad onto the platen. Pad stops can be deployed to stop the leading end of the new pad so that the new pad is aligned on the platen in a satisfactory manner. With the new platen in position on the platen, the vacuum pump can apply a vacuum to hold the new pad to the platen.

To remove a used pad from the platen, the vacuum pump can cease applying a vacuum to release the used pad from the platen. The pad handler can use the plurality of rollers to retrieve the used pad from the platen, and the rollers can guide the used pad into a used pad cartridge of the pad storage unit. The pad stops can also be deployed and rotated to urge the used pad toward the pad handler. At least one pair of the rollers can move to discrete positions to guide the used pad from the platen into the pad storage unit.

Referring now to the drawings, FIG. 1 is a schematic, partial cross-sectional, side view of a CMP system 100 that may be used to implement the methods and operations provided herein, according to one embodiment. For reference, the CMP system 100 defines a first direction X, a second direction Y, and a third direction Z, which are mutually perpendicular to one another. In some embodiments, the first direction X is a lateral direction, the second direction Y is a transverse direction, and the third direction Z is a vertical direction.

As shown in FIG. 1, the CMP system 100 features a frame (not shown) and a plurality of panels 101, which collectively form a processing chamber 103. The CMP system 100 includes a plurality of polishing stations 102 (one shown) and a plurality of substrate carrier assemblies 104 (one shown), which are disposed within the processing chamber 103.

The polishing station 102 includes a platen 106, a polishing pad 105 mounted on the platen 106 and secured thereto, a pad conditioner assembly 110 for cleaning and/or rejuvenating the polishing pad, a first fluid delivery arm 112 for dispensing polishing fluid onto the polishing pad 105, a second fluid delivery arm 138 for dispending one or more fluids (e.g., a polishing fluid or a water) onto the polishing pad 105, a rotating substrate carrier assembly 104 configured to be disposed on the polishing pad 105, and a controller 160. The controller 160 is communicatively coupled with each of the platen 106, the pad conditioner assembly 110, the first fluid delivery arm 112, and the second fluid delivery arm 138. The platen 106 is disposed above a base plate 114 and is circumscribed by a platen shield 120 (both shown in cross section) which collectively define a drainage basin 116. The drainage basin 116 is used to collect fluids spun radially outward from the platen 106 and to drain the fluids through a drain 118 in fluid communication therewith.

The pad conditioner assembly 110 is used to clean and/or rejuvenate the polishing pad 105 by sweeping polishing byproducts therefrom, such as with a brush (not shown), and/or by abrading the polishing pad 105 by urging an abrasive pad conditioning disk 124 (e.g., a diamond impregnated disk) there against. Pad conditioning operations may be done between polishing substrates, i.e., ex-situ conditioning, concurrently with polishing a substrate, i.e., in-situ conditioning, or both.

The pad conditioner assembly 110 includes a first conditioner actuator 126 disposed on the base plate 114, a conditioner arm 128 coupled to the first conditioner actuator 126, and a conditioner mounting plate 130 having the conditioner disk 124 fixedly coupled thereto. A first end of the conditioner arm 128 is coupled to the first conditioner actuator 126, and the mounting plate 130 is coupled to a second end of the conditioner arm 128 that is distal from the first end. The first conditioner actuator 126 is used to sweep the conditioner arm 128, and thus the conditioner disk 124, about an axis C so that the conditioner disk 124 oscillates between an inner radius of the polishing pad 105 and an outer radius of the polishing pad 105 while the polishing pad 105 rotates there beneath. In some embodiments, the pad conditioner assembly 110 further includes a second conditioner actuator 132 disposed at, and coupled to, the second end of the conditioner arm 128, the second conditioner actuator 132 is used to rotate the conditioner disk 124 about an axis D. Typically, the mounting plate 130 is coupled to the second conditioner actuator 132 using a shaft 133 disposed therebetween.

Generally, the rotating substrate carrier assembly 104 is swept back and forth across a desired region of the platen 106 while the platen 106, and thus the polishing pad 105, rotate about a platen axis B there beneath. In some configurations, the substrate carrier assembly 104 rotates and moves in a radial direction relative to the polishing pad 105 and platen 106, such that the substrate carrier assembly 104 can move along the radius of the rotating polishing pad 105. In other configurations, the substrate carrier assembly 104 rotates and moves in an arcuate path relative to the center of the CMP polishing system, and thus in a non-radial direction across the polishing pad 105 and platen 106. The substrate carrier assembly 104 is rotated and moved using a first actuator 170. The first actuator 170 is connected to the substrate carrier assembly 104 at a shaft and may include a track or a set of tracks (not shown) to enable movement of the substrate carrier assembly 104 in either of a radial or an arcuate path across the surface of the pad. The substrate carrier assembly 104 features a carrier head 146, a carrier ring assembly 149 coupled to the carrier head 146, and a flexible membrane 150 disposed radially inward of the carrier ring assembly 149 to retain and urge the substrate 148 against the polishing pad 105 as the substrate carrier assembly 104 rotates about the carrier axis A during processing.

The polishing fluid is delivered to the polishing pad 105 using the first fluid delivery arm 112 and is further delivered to a polishing interface between polishing pad 105 and the substrate 148 by the rotation of the polishing pad 105 about the platen axis B. Often, the first fluid delivery arm 112 further includes a first delivery extension member 136 and a plurality of nozzles that include a first delivery nozzle 134. The plurality of nozzles are used to deliver polishing fluid or relatively high pressure streams of a cleaner fluid, e.g., deionized water, to one or more positions along the surface of the polishing pad 105.

The second fluid delivery arm 138 includes a second actuator 140, a second delivery extension member 142, and a second delivery nozzle 144. The second actuator 140 enables movement about the second delivery arm axis E, such that the second delivery extension member 142 swings about the second delivery arm axis E. The second delivery extension member 142 is coupled to the second actuator 140 at a first distal end of the second delivery extension member 142. The second delivery nozzle 144 is disposed on the opposite end of the second delivery extension member 142, such that the second delivery nozzle 144 is disposed on a second distal end of the second delivery extension member 142. The second delivery nozzle 144 is pointed downwards towards the polishing pad 105. The second delivery nozzle 144 is configured to provide a fluid, such as either a polishing fluid or water onto the polishing pad 105 near the outside edge of the substrate carrier assembly 104.

A metrology unit 165 includes a measurement unit 162, a first window opening 164 formed through the platen 106, a second window opening 166 formed through the polishing pad 105 and a window 168 disposed within the second opening 166 within the polishing pad 105. The measurement unit 162 may be attached to the bottom of the platen 106 or may be disposed within the first window opening 164. The measurement unit 162 is configured to measure the thickness of the substrate, including the substrate edge, and determine a removal rate across the substrate and the substrate edge during polishing. The measurement unit 162 may measure the thickness of the substrate edge by projecting radiation beams through the window 168 and onto the substrate 148 as the substrate passes over the window 168. The radiation beams are then reflected back to the measurement unit 162 and a thickness and/or removal rate at the edge of the substrate 148 is determined. The window 168 is an optically transparent window, such as a clear quartz window or transparent polymer.

The controller 160 is communicatively coupled with each of the platen 106, the pad conditioner assembly 110, the metrology unit 165, the first fluid delivery arm 112, the second fluid delivery arm 138, and the substrate carrier assembly 104. In some aspects of a CMP polishing process, the controller 160 coordinates the rotation of the platen 106 as well as the dispensing of polishing fluid or water onto the polishing pad 105 by either of the first or second fluid delivery arms 112, 138. In some embodiments, the controller 160 uses the measurements from the metrology unit 165 to determine when fluid will be delivered to the polishing pad 105. The controller 160 also controls the movement of the substrate carrier assembly 104 and may increase or decrease the amount of pressure exerted onto the substrate 148 by the substrate carrier assembly 104.

As will be explained below, a CMP system, such as the CMP system 100 of FIG. 1, can include features that enable automated changes of polishing pads thereof. For instance, when a polishing pad of a CMP system has degraded in performance to a predefined threshold (e.g., based on a predefined usage time and/or number of CMP cycles) or it is otherwise desired to change out the polishing pad, the used polishing pad can be changed out or swapped with a new polishing pad in an automated manner. In this regard, a CMP system can include an automated pad change system. An example automated pad change system for a CMP system is described below.

FIG. 2 is a schematic view of an automated pad change system 200 for a CMP system, according to an example embodiment of the present disclosure. The automated pad change system 200 can be incorporated into the CMP system 100 of FIG. 1, for example, as well as other CMP systems. Generally, the automated pad change system 200 is configured to automatically change out polishing pads of a CMP system. The automated pad change system 200 can include a platen 210 upon which a pad 230 can be mounted, a vacuum system 250, a pad handler 260, a pad storage unit 270, pad stops 280, and a controller 290. These features can collectively enable an automated pad change process, which can include installing a new pad on the platen 210 or removing a used pad therefrom.

The platen 210 of a CMP system can form a part of the automated pad change system 200. The platen 210 is rotatable about an axis of rotation AX1, or rather, a platen axis. The platen 210 is coupled with a platen shaft 212, which is rotatable in unison with the platen 210. The platen shaft 212 defines an interior 214, which can be hollow to define a channel along which fluid (e.g., air) can flow. Further, the platen 210 has a pad mounting surface 216 upon which the pad 230 (as well as replacement pads) can be mounted. In FIG. 2, the pad 230 is shown disposed on the pad mounting surface 216. The pad 230 can include a platen mounting surface 232 and a polishing surface 234. The platen mounting surface 232 interfaces with the pad mounting surface 216 of the platen 210. The polishing surface 234 can be used to polish a wafer or substrate during a CMP process. In this regard, at least the pad mounting surface 216 of the platen 210 and the pad 230 disposed thereon can be positioned at least in part in a processing chamber 202 of a CMP system. The processing chamber 202 can be arranged above a lower compartment 204. A base plate 206 can separate the processing chamber 202 and the lower compartment 204.

As further illustrated in FIG. 2, the platen 210 can form a plurality of apertures 218 that extend to the pad mounting surface 216. As will be explained more fully below, a vacuum pump can selectively apply a vacuum within the plurality of apertures 218 so as to hold the pad 230 to the pad mounting surface 216, or rather, to create a “vacuum hold” or “vacuum chucking” of the pad 230 to the platen 210. The apertures 218 can be arranged to ensure a uniform vacuum hold of the pad 230 to the platen 210. In at least one example embodiment, the plurality of apertures 218 can be concentrically arranged in at least two rows on the pad mounting surface 216 to ensure a uniform vacuum hold.

For instance, as shown in FIG. 3, the apertures 218 are arranged in a first row R1 (e.g., an outermost row with respect to a center point of the platen 210), a second row R2, and a third row R3 (e.g., an innermost row, which is coaxial with the center point of the platen 210 in this example). The rows can be radially spaced from one another as shown in FIG. 3. In some embodiments, the platen 210 can also form or define a manifold channel 220 as shown in FIG. 2. The manifold channel 220 can be in fluid communication with each of the plurality of apertures 218. The manifold channel 220 can in turn be in fluid communication with the interior 214 of the platen shaft 212.

With reference to FIG. 2, the automated pad change system 200 can include the vacuum system 250. The vacuum system 250 can include a vacuum pump 252. The vacuum pump 252 is arranged to selectively apply a vacuum within the plurality of apertures 218 so as to hold the pad 230 to the pad mounting surface 216 of the platen 210. For instance, during CMP processing of a substrate or during other modes of operation, the vacuum pump 252 can be operable to apply a vacuum within the apertures 218 so as to secure the pad 230 to the pad mounting surface 216, or rather, to “vacuum chuck” the pad 230 to the platen 210. Then, when it is desired to change the pad 230, the vacuum pump 252 can be controlled to cease providing a vacuum within the apertures 218, which allows the pad 230 to be removed from the platen 210, e.g., by the pad handler 260. Once the pad handler 260 installs a new pad on the platen 210, the vacuum pump 252 can be controlled to apply a vacuum within the apertures 218 once again to secure the new pad to the platen 210.

In at least some embodiments, the vacuum pump 252 can be in fluid communication with a vacuum conduit 254, which is in turn in fluid communication with a rotary union 256. The rotary union 256 can mechanically couple the platen 210, or platen shaft 212, with the vacuum conduit 254 so as to provide fluid communication between the vacuum pump 252 and the interior 214 of the platen shaft 212, which is in turn in fluid communication with the manifold channel 220 and the plurality of apertures 218 of the platen 210. The rotary union 256 can allow the platen 210 and platen shaft 212 to rotate whilst still providing fluid communication with the stationary vacuum conduit 254. Accordingly, the vacuum pump 252 can create a relatively low pressure region of fluid (e.g., air) proximate an inlet of the vacuum pump 252 that urges fluid at a relatively high pressure within the apertures 218 to move thereto. In this way, a vacuum can be applied within the apertures 218, which secures the pad 230 to the platen 210.

The pad 230 (and other pads) can be formed of a polyurethane sheet constructed of a plurality of layers disposed in a stacked arrangement. In at least some embodiments, as shown in FIG. 4, the pad 230 can include a top polishing layer 236, an adhesive layer 238, and a sub layer 240. The top polishing layer 236 can define the polishing surface 234 of the pad 230. In some embodiments, the sub layer 240 can be a closed-cell layer that can be disposed on (e.g., directly on) the pad mounting surface 216 of the platen 210 (FIG. 2). In this regard, the sub layer 240 can define a platen mounting surface 232 that engages the pad mounting surface 216 of the platen 210. The closed-cell arrangement of the sub layer 240 can facilitate the vacuum hold of the pad 230 to the pad mounting surface 216 of the platen 210, e.g., during a CMP process to polish a wafer or substrate.

In other embodiments, as shown in FIG. 5, the sub layer 240 can be an open-cell layer and the pad 230 can additionally include a sealant layer 242 disposed below and adjacent to the sub layer 240 configured as an open-cell layer. The sealant layer 242 can have a closed-cell arrangement and can be disposed on (e.g., directly on) the pad mounting surface 216. In this way, the sealant layer 242 can define the platen mounting surface 232 that engages the pad mounting surface of the platen 210. The closed-cell arrangement of the sealant layer 242 can facilitate the vacuum hold of the pad 230 to the pad mounting surface 216 of the platen 210. Advantageously, the use of the vacuum pump 252 to “vacuum hold” the pad 230 to the pad mounting surface 216 of the platen 210 can eliminate or reduce the need for the pad 230 (and other pads) to include a temporary adhesive layer and/or liner, which can reduce the cost and materials to produce the pad 230 and other pads, among other possible benefits.

Returning to FIG. 2, the automated pad change system 200 can also include the pad handler 260. The pad handler 260 is arranged to selectively move a pad onto the pad mounting surface 216 during a pad installation process, and to selectively move the pad from the pad mounting surface 216 during a pad removal process. Particularly, during a pad removal process, the pad handler 260 can retrieve a used pad disposed on the platen 210 and can move the used pad to the pad storage unit 270. Then, during a pad installation process, the pad handler 260 can retrieve a new pad form the pad storage unit 270 and can move the new pad onto the platen 210.

In at least some embodiments, during CMP processing of a substrate, the pad handler 260 can be stowed within the lower compartment 204, or rather, not in the processing chamber 202. The pad handler 260 can be stowed in a horizontally-oriented position within the lower compartment 204 as shown in FIG. 2, and when an automated pad change process is implemented, the pad handler 260 can be moved to deployed position, which can be a vertically-oriented position as represented by the phantom lines in FIG. 2. In the vertically-oriented position, the pad handler 260 can extend at least in part into the processing chamber 202. In some embodiments, the pad handler 260 can be rotatably coupled (e.g., by way of a hinge) with a structural member, such as the base plate 206, which can allow the pad handler 260 to transition between the horizontally-oriented position and the vertically-oriented position. In other embodiments, the pad handler 260 can be an end effector of a robotic arm, and the robotic arm can be controlled to adjust the position of the pad handler 260 from the horizontally-oriented position to the vertically-oriented position (and vice versa). A sliding door or window of the base plate 206 can be selectively opened to permit egress and ingress of the pad handler 260 out of and into the lower compartment 204.

As shown in FIG. 6, the pad handler 260 can include rollers 262 that can facilitate movement of a pad, e.g., from the pad storage unit 270 to the platen 210, or vice versa. The rollers 262 can be disposed between opposing end plates (not shown), for example. In some embodiments, at least one of the rollers 262 can be rotatably driven so as to move the pad 230 engaged therewith, e.g., toward the platen 210 (FIG. 2) during a pad installation process or away from the platen 210 during a pad removal process. In some other embodiments, all of the rollers 262 are rotatably driven, e.g., by an electric motor or belt-pulley system.

In at least some embodiments, the rollers 262 can be arranged in pairs, including a first pair 264, a second pair 266, and a third pair 268. The first pair 264 has a first roller 262A and a second roller 262B, the second pair 266 has a third roller 262C and a fourth roller 262D, and the third pair 268 has a fifth roller 262E and a sixth roller 262F. In other embodiments, the pad handler 260 can have more than three (3) pairs and/or more than six (6) rollers. In some embodiments, the pad handler 260 has at least six (6) rollers.

When the pad handler 260 is deployed in the vertically-oriented position, as shown in FIG. 6, the first, second, and third pairs 264, 266, 268 are spaced from one another, e.g., along the third direction Z. The first and second rollers 262A, 262B of the first pair 264 are arranged above the third and fourth rollers 262C, 262D of the second pair 266, while the third and fourth rollers 262C, 262D of the second pair 266 are arranged above the fourth and fifth rollers 262E, 262F of the third pair 268. The third and fourth rollers 262C, 262D of the second pair 266 are arranged at a same height as one another. Similarly, the fifth and sixth rollers 262E, 262F of the third pair 268 are arranged at a same height as one another. However, the first and second rollers 262A, 262B of the first pair 264 are arranged at staggered heights. The first roller 262A, which is positioned further from the platen 210 than the second roller 262B when the pad handler 260 is in the vertically-oriented position shown in FIG. 6, is arranged at a height above the second roller 262B.

Further, the rollers 262 of each of the first, second, and third pairs 264, 266, 268 are spaced from one another, e.g., along the first direction X, so that the pad 230 can be received between the rollers of each of the pairs 264, 266, 268 yet still make contact or engage each of the rollers of the pairs 264, 266, 268. As illustrated in FIG. 6, the pad 230 can be received between the first and second rollers 262A, 262B of the first pair 264, the pad 230 can be received between the third and fourth rollers 262C, 262D of the second pair 266, and the pad 230 can be received between the fifth and sixth rollers 262E, 262F of the third pair 268.

In some embodiments, with the pad handler 260 deployed and arranged in the vertically-oriented position, at least one pair of the rollers can be movable (e.g., along the first direction X, the second direction Y, the third direction Z, or some combination thereof) to various discrete positions to guide the pad 230 to or from the pad mounting surface 216 of the platen 210 (FIG. 2). For instance, the first and second rollers 262A, 262B of the first pair 264 can be movable between a first position (a base position), a second position (a bend position), and a third position (a platen-level position). The first and second rollers 262A, 262B, which can be disposed between opposing end plates, can be moved about by a robotic arm, for example. The rollers of the second and third pairs 266, 268 can remain stationary as the first and second rollers 262A, 262B of the first pair 264 move to guide a pad to or from the platen 210; however, the rollers of the second and third pairs 266, 268 can continue to rotate and/or drivingly rotate the pad during a pad change process.

In the first position, or base position, the first and second rollers 262A, 262B of the first pair 264 are arranged to facilitate movement of the pad 230 out of, or into, the pad storage unit 270, depending on whether a pad installation process or pad removal process is being implemented. In the first position, the first and second rollers 262A, 262B of the first pair 264 can be aligned with the third and fourth rollers 262C, 262D of the second pair 266, respectively, e.g., along the first direction X. In addition, in the first position, the first and second rollers 262A, 262B of the first pair 264 can be aligned with the fifth and sixth rollers 262E, 262F of the third pair 268, respectively, e.g., along the first direction X. In this regard, when the first and second rollers 262A, 262B of the first pair 264 are in the first position, the first roller 262A, the third roller 262C, and the fifth roller 262E can be aligned with one another along the first direction X and the second roller 262B, the fourth roller 262D, and the sixth roller 262F can be aligned with one another along the first direction X. The first and second rollers 262A, 262B of the first pair 264 are shown in the first position in FIG. 6, as well as in FIG. 7A during a pad installation process and in FIG. 8F during a pad removal process.

In the second position, or bend position, the first and second rollers 262A, 262B of the first pair 264 are arranged to guide the pad 230 onto, or off of, the platen 210, depending on whether a pad installation process or pad removal process is being implemented. As one example, as depicted in FIGS. 7B and 7C, during a pad installation process and with the first and second rollers 262A, 262B in the second position, the first and second rollers 262A, 262B can cause a bend in a new pad 230N and can guide a leading end 244N of the new pad 230N onto the pad mounting surface 216 of the platen 210. As another example, as depicted in FIG. 8D, during a pad removal process and with the first and second rollers 262A, 262B in the second position, the first and second rollers 262A, 262B can cause a bend in a used pad 230U and can guide a leading end 244U of the used pad 230U upward and away from the pad mounting surface 216 of the platen 210.

Accordingly, in the second position, the first and second rollers 262A, 262B can be offset with respect to the third and fourth rollers 262C, 262D along the first direction X. Further, in the second position, the first and second rollers 262A, 262B can be positioned closer to the pad mounting surface 216 of the platen 210 than they (the first and second rollers 262A, 262B) are in the first position. Further, in the second position, both the first and second rollers 262A, 262B can be positioned above the pad mounting surface 216 of the platen 210, e.g., along the third direction Z, and can remain at staggered heights, with the first roller 262A being positioned at a greater height than the second roller 262B. Moreover, in the second position, the first and second rollers 262A, 262B can be arranged so that the first roller 262A overlaps, at least in part, the platen 210 along the first direction X while the second roller 262B does not overlap the platen 210 along the first direction X.

In the third position, or platen-level position, the first and second rollers 262A, 262B are arranged to further guide the pad 230 onto, or off of, the platen 210, depending on whether a pad installation process or pad removal process is being implemented. As one example, as depicted in FIG. 7D, during a pad installation process and with the first and second rollers 262A, 262B of the first pair 264 in the third position, the first and second rollers 262A, 262B can slide the new pad 230N onto the pad mounting surface 216 of the platen 210, or rather, until the leading end 244N of the new pad 230N engages the pad stops 280. As another example, as depicted in FIG. 8B, during a pad removal process and with the first and second rollers 262A, 262B in the third position, the first and second rollers 262A, 262B can guide the sliding action of the used pad 230U off of the pad mounting surface 216 of the platen 210.

Accordingly, in the third position, the first and second rollers 262A, 262B can be offset with respect to the third and fourth rollers 262C, 262D along the first direction X. Further, in the third position, the first and second rollers 262A, 262B can be positioned closer to the pad mounting surface 216 of the platen 210 than they (the first and second rollers 262A, 262B) are in the second position. Further, in the third position, the first roller 262A is positioned at a height just above the pad mounting surface 216 while at least a portion of the second roller 262B is positioned at a height below the pad mounting surface 216 of the platen 210 along the third direction Z. In this regard, the first and second rollers 262A, 262B can remain at staggered heights, with the first roller 262A being positioned at a greater height than the second roller 262B. Moreover, in the third position, the first and second rollers 262A, 262B of the first pair 264 can be arranged so that the first roller 262A overlaps, at least in part, the platen 210 along the first direction X while the second roller 262B does not overlap the platen 210 along the first direction X.

With reference again to FIG. 2, the automated pad change system 200 can include the pad storage unit 270. The pad storage unit 270 can be disposed within the lower compartment 204 as shown in FIG. 2, for example. However, in other embodiments, the pad storage unit 270 can be disposed in other locations. Generally, the pad storage unit 270 can store a plurality of pads. For instance, the pad storage unit 270 can include a new pad cartridge 272N storing a plurality of new pads 230N and a used pad cartridge 272U storing a plurality of used pads 230U. During a pad installation process, the pad handler 260 can be arranged to selectively move one of the plurality of new pads 230N from the new pad cartridge 272N onto the pad mounting surface 216 of the platen 210. During a pad removal process, the pad handler 260 can be arranged to selectively move a used pad from the pad mounting surface 216 of the platen 210 into the used pad cartridge 272U.

The new pad cartridge 272N can include a support plate 274N that is biased against the plurality of new pads 230N so as to align one of the plurality of new pads 230N with a door 276N of the new pad cartridge 272N. By ensuring that one of the new pads 230N is aligned with the door 276N, the pad handler 260 can more easily and consistently retrieve one of the new pads 230N for placement on the platen 210. The support plate 274N can be biased by a plurality of springs 278N, for example. The door 276N can be a slidable door that can be controlled to slide open during a pad installation process so that one of the plurality of new pads 230N can be retrieved and ultimately placed on the platen 210 by the pad handler 260. In other embodiments, the door 276N can swing open via a hinge. By selectively opening and closing the door 276N, the plurality of new pads 230N can be protected from contamination, e.g., from dust, dirt, used polishing fluid, and/or other debris. An actuator or other controllable device can be controlled to open or close the door 276N.

In some embodiments, such as in the depicted embodiment of FIG. 2, the new pad cartridge 272N can include a cartridge roller 279N that is rotatable and operable to facilitate movement of the new pad engaged therewith. The support plate 274N is biased against the new pads 230N so as to press one of the new pads 230N against the cartridge roller 279N. Accordingly, when the pad handler 260 is controlled to retrieve one of the new pads 230N, the cartridge roller 279N can be controlled to rotatably drive the new pad engaged or in contact with the cartridge roller 279N to facilitate the exit of the new pad from the new pad cartridge 272N. From the perspective in FIG. 2, the cartridge roller 279N can be rotated clockwise to drive the new pad engaged therewith upward along the third direction Z. In some embodiments, the cartridge roller 279N can be a passive roller (i.e., rotatable but not actively driven).

The used pad cartridge 272U is configured in a similar manner as the new pad cartridge 272N. The used pad cartridge 272U can include a support plate 274U that is biased against the plurality of used pads 230U so as to align one of the plurality of used pads 230U with a door 276U of the used pad cartridge 272U. The support plate 274U can be biased by a plurality of springs 278U, for example. The door 276U can be a slidable door that can be controlled to slide open during a pad removal process so that a used pad retrieved from the platen 210 can be placed into the used pad cartridge 272U by the pad handler 260. In other embodiments, the door 276U can swing open via a hinge. By selectively opening and closing the door 276U, contamination or other debris from the plurality of used pads 230U can be contained within the used pad cartridge 272U. An actuator or other controllable device can be controlled to open or control the door 276U.

In some embodiments, such as in the depicted embodiment of FIG. 2, the used pad cartridge 272U can include a cartridge roller 279U that is rotatable and operable to facilitate movement of a used pad into the used pad cartridge 272U. The support plate 274U is biased against the used pads 230U so as to press one of the used pads 230U against the cartridge roller 279U. Thus, when the pad handler 260 is controlled to retrieve a used pad from the platen 210 and moves the used pad into the used pad cartridge 272U, the cartridge roller 279U can be controlled to rotatably drive the used pad engaged or in contact with the cartridge roller 279U to move the used pad into place within the used pad cartridge 272U. From the perspective in FIG. 2, the cartridge roller 279U can be rotated counterclockwise to drive the used pad engaged therewith downward along the third direction Z. In some embodiments, the cartridge roller 279U can be a passive roller (i.e., rotatable but not actively driven).

Further, the pad storage unit 270 can be selectively moved (e.g., translated along the first direction X) so that the new pad cartridge 272N is aligned with the pad handler 260 during a pad installation process or so that the used pad cartridge 272U is aligned with the pad handler 260 during a pad removal process. The pad storage unit 270 can include wheels 275 or the like to facilitate movement thereof. The wheels 275 can ride along a track 277 or other surface, for example. In some embodiments, an actuator can be controlled to control the position of the pad storage unit 270, e.g., along the first direction X. For instance, the actuator can push or pull the pad storage unit 270 to move the desired pad cartridge into position, depending on whether a pad installation or pad removal process is being implemented.

While the new pad cartridge 272N and the used pad cartridge 272U are depicted adjacent one another in the illustrated embodiment of FIG. 2, in other embodiments, the new pad cartridge 272N and the used pad cartridge 272U can be located in separate locations. For instance, in some embodiments, the new pad cartridge 272N can be located in the lower compartment 204 while the used pad cartridge 272U can be located in the processing chamber 202 or some other compartment.

With reference now to FIGS. 2 and 7F, the automated pad change system 200 can also include the pad stops 280. As illustrated in FIG. 7F, the pad stops 280 can include a first pad stop 280A and a second pad stop 280B (collectively pad stops 280). In some embodiments, the first and second pad stops 280A, 280B can be disposed approximately seventy degrees (70°) apart from one another, with respect to the axis of rotation AX1 of the platen 210. In this context, “approximately” means within at least ten degrees (10°) of the stated value. The pad stops 280 can each have a main body 282 and a web 284 projecting from the main body 282. For a given one of the pad stops 280, the main body 282 extends lengthwise along the third direction Z while the web 284, or eccentric, extends lengthwise along a direction orthogonal to the third direction Z, or rather, radially outward from the main body 282. That is, the web 284 projects outward from the main body 282 along a direction that is orthogonal to a long axis of the main body 282.

The pad stops 280 can each be rotatable, e.g., about respective axes of rotation AX2. For instance, the first and second pad stops 280A, 280B can be rotated by respective actuators, a same actuator, or other controllable devices operable to rotate the pads stops 280. In addition to being rotatable, the pad stops 280 can also be translatable along the third direction Z. For instance, during CMP processing of a substrate, the pad stops 280 can be stored in the lower compartment 204 below the processing chamber 202 in a stowed position, e.g., as shown in FIG. 2. When the pad 230 undergoes a pad change process, the pad stops 280 can be moved from the lower compartment 204 to a deployed position in which the pad stops 280 are positioned, at least in part, within the processing chamber 202 (as represented in FIG. 2 by the phantom lines outlining the pad stops 280). The pad stops 280 can then be used to implement the pad change process. The first and second pad stops 280 can be translated by respective actuators, a same actuator, or other controllable devices operable to translate the pad stops 280.

During pad installation, the pad stops 280 can be translated from their stowed position within the lower compartment 204 to the deployed position within the processing chamber 202 so that the pad stops 280 are at least at height even with a pad to be installed on the platen 210. Generally, the pad stops 280 are arranged to stop the pad 230 being installed into position on the pad mounting surface 216. In some embodiments, during pad installation, the pad stops 280 can be rotated or otherwise positioned so that the pad 230 engages the main bodies 282 of the pad stops 280 to stop the pad 230 in position on the pad mounting surface 216, or rather, in alignment with the pad mounting surface 216 of the platen 210. Once the pad 230 is installed on the platen 210 and aligned in a satisfactory manner with the pad mounting surface 216, the pad stops 280 can be returned to the lower compartment 204.

During pad removal, the pad stops 280 are arranged to urge the pad 230 from the pad mounting surface 216 and toward the pad handler 260. In some embodiments, during pad removal, the pad stops 280 can be rotated so that the webs 284 of the pad stops 280 engage the pad 230 so as to urge the pad 230 from the pad mounting surface 216 and to the pad handler 260. FIG. 8C depicts the webs 284 of the first and second pad stops 280A, 280B urging the used pad 230U toward the pad handler 260.

With reference again to FIG. 2, the automated pad change system 200 can include the controller 290. The controller 290 can be a dedicated controller for controlling aspects of the automated pad change system 200 or can be a part of, or integrated into, the main controller of a CMP system (e.g., controller 160 in FIG. 1). The controller 290 can include one or more processors 292 and one or more memory devices 294, such as one or more non-transitory memory devices. The one or more processors 292 can include any suitable processing device, such as a microprocessor, microcontroller, integrated circuit, logic device, or other suitable processing device. The one or more memory devices 294 can include one or more computer-readable medium, including, but not limited to, non-transitory computer-readable medium, RAM, ROM, hard drives, flash drives, and other memory devices.

The one or more memory devices 294 can store information accessible by the one or more processors 292, including a program that can be executed by the one or more processors 292. When the program is executed by any combination of the one or more processors 292, the one or more processors 292 can perform an operation, such as an automated pad change process, which can include pad removal and/or installation. The program can be software written in any suitable programming language or can be implemented in hardware. The memory devices 294 can also store data that can be accessed by the processors 292. For example, the data can include one or more table(s), function(s), algorithm(s), model(s), equation(s), libraries, etc. according to example aspects of the present disclosure.

Upon executing the program, the controller 290 can control various controllable devices of the automated pad change system 200, such as actuators, motors, robotic arms, an end effector of the robotic arm, etc. so as to control, among other things, the platen 210, the vacuum pump 252, the pad holder 260 and rollers 262 thereof, the pad storage unit 270, and the pad stops 280. The controller 290 can be communicatively coupled with the controllable devices, e.g., by one or more wired or wireless communication links. The controller 290 can include a communication interface used to communicate with other components, including the controllable devices. The communication interface can include any suitable components for interfacing with other components, including transmitters, receivers, ports, controllers, antennas, etc.

While the automated pad change system 200 has been described in relation to a single pad being changed, it will be appreciated that the automated pad change system 200 can be used to change polishing pads of a CMP system having a plurality of platens upon which pads can be disposed, and that the automated pad change system 200 can be used to change such pads, including changing out multiple pads at once or in a single turn of a pad change process.

Pad installation Process

With general reference to FIGS. 7A, 7B, 7C, 7D, 7E, and 7F, an example pad installation process will now be described. The pad installation process can be implemented to install a new pad on a platen.

As shown in FIG. 7A, the pad installation process can include retrieving, using the pad handler 260, a new pad 230N from the new pad cartridge 272N of the pad storage unit 270. For instance, upon initiation of the pad installation process, the controller 290 (FIG. 2) can cause the pad handler 260 to move from a stowed position (e.g., a horizontally-oriented position as shown in FIG. 2) to a deployed position (e.g., a vertically-oriented position shown in phantom lines in FIG. 2). The controller 290 can also cause the door 276N of the new pad cartridge 272N to open. The controller 290 can further cause the pad handler 260 to move, at least in part, within the new pad cartridge 272N. For instance, as shown in FIG. 7A, the fifth and sixth rollers 262E, 262F can be moved into the new pad cartridge 272N to facilitate retrieval of the new pad 230N. With the pad handler 260 in position, the controller 290 can then cause the cartridge roller 279N to rotatably drive the new pad 230N engaged therewith, e.g., in a clockwise direction from the perspective in FIG. 7A so that the new pad 230N is moved upward along the third direction Z. The new pad 230N can be received between the rollers 262A-262F of the pad handler 260, and one or more of rollers 262A-262F can be rotatably driven to move the new pad 230N out of the new pad cartridge 272N. From the perspective in FIG. 7, the third and fifth rollers 262C, 262E can be rotatably driven in a counterclockwise direction while the second, fourth, and sixth rollers 262B, 262D, 262F can be rotatably driven in a clockwise direction to move the new pad 230N.

Once the pad 230 reaches at least the second roller 262B, the controller 290 (FIG. 2) can cause the first and second rollers 262A, 262B to move from the first position to the second position, as represented in FIG. 7B. Specifically, once the new pad 230N reaches at least the second roller 262B, the first and second rollers 262A, 262B can be moved to the second position, and when this occurs, the first roller 262A can engage the new pad 230N as the first and second rollers 262A, 262B are moved to the second position, which causes the new pad 230N to bend in a desired direction as shown in FIG. 7B. The bending action of the new pad 230N can guide the leading end 244N of the new pad 230N downward to the pad mounting surface 216 of the platen 210.

As shown in FIG. 7C, as the new pad 230N is moved by the pad handler 260, the curvature of the new pad 230N flips or changes from downward concavity (FIG. 7B) to upward concavity (FIG. 7C), or rather, from negative to positive curvature. In some embodiments, after or at the time of this occurrence, the controller 290 (FIG. 2) can cause the first and second rollers 262A, 262B to move to the third position. For instance, as shown in FIG. 7D, the first and second rollers 262A, 262B can be translated downward along the third direction Z to the third position, or the platen-level position. From the third position, the first and second rollers 262A, 262B can slide the new pad 230N along the platen 210 until the new pad 230N hits the pad stops 280 (only the first pad stop 280A is depicted in FIG. 7D; see also FIG. 7F). The controller 290 can also move the pad stops 280 from their stowed position to the deployed position so as to be in place to stop the new pad 230N in place on the platen 210.

As shown in FIGS. 7E and 7F, the pad stops 280 can be rotated or otherwise positioned so that the new pad 230N engages the main bodies 282 of the pad stops 280 to stop the new pad 230N in position on the pad mounting surface 216, or rather, in alignment with the pad mounting surface 216 of the platen 210. When the new pad 230N engages the pad stops 280, three (3) points of contact are present on the new pad 230N, with the pad stops 280 and the first roller 262A engaging the new pad 230N. This three-point engagement can facilitate alignment of the new pad 230N on the platen 210.

In some embodiments, such as in the event a window opening of the new pad 230N is not aligned with a measurement unit and/or a window opening of the platen 210, the controller 290 (FIG. 2) can cause the platen 210 to rotate about its axis of rotation AX1 (FIG. 2), e.g. so that the window openings are aligned with the measurement unit, e.g., so that the window openings 164, 166 align with the measurement unit 162, as depicted in FIG. 1 The new pad 230N can include a notch or other distinct features that can facilitate alignment of the new pad 230N with the platen 210.

With reference to FIG. 2 and FIGS. 7A through 7F, once the new pad 230N is disposed on, and aligned with, the pad mounting surface 216 of the platen 210, the controller 290 can cause the vacuum pump 252 to apply a vacuum within the plurality of apertures 218 so as to hold the new pad 230N to the pad mounting surface 216 of the platen 210. Applying a vacuum within the apertures 218 of the platen 210 can create a “vacuum hold” or “vacuum chucking” of the pad 230 to the platen 210. This “vacuum hold” can hold the new pad 230N in place, e.g., during CMP processing of a substrate or wafer. Further, the controller 290 can cause the pad handler 260 and the pad stops 280 to retreat to their respective stowed positions, e.g., in the lower compartment 204. In some embodiments, the vacuum pump 252 can be adjustable so as to apply different vacuum pressures, such as one setting for holding the new pad 230N to the platen 210 during non-CMP processing times and another setting for holding the new pad 230N to the platen 210 during CMP processing of a substrate or wafer. Other settings are possible.

Further, once the new pad 230N is installed on the platen 210, the pad handler 260 can install other new pads on other platens, can commence a pad removal process to remove used pads from other platens, or the pad handler 260 and other movable components can be moved to their respective stowed positions.

Pad Removal Process

With general reference to FIGS. 8A, 8B, 8C, 8D, 8E, and 8F, an example pad removal process will now be described. The pad removal process can be implemented to remove a used pad from a platen.

As shown in FIG. 8A, when a pad (e.g., used pad 230U) is desired to be removed from the platen 210, the controller 290 (FIG. 2) can cause the pad stops 280 (only the first pad stop 280A is shown in FIG. 8A; see FIG. 8C) to move from the stowed position to the deployed position. For instance, the pad stops 280 can be translated along the third direction Z, e.g., from the stowed position within the lower compartment 204 (FIG. 2) to the deployed position in which the pad stops 280 are arranged at a height so that the webs 284 of the pad stops 280 are aligned with the used pad 230U along the third direction Z. In FIG. 8A, the web 284 of the first pad stop 280A is shown arranged at a height so that the web 284 is aligned with the used pad 230U along the third direction Z. The second pad stop 280B (not pictured in FIG. 8A; see FIG. 8C) can be similarly arranged.

As depicted in FIG. 8B, the controller 290 (FIG. 2) can cause the pad handler 260 to move from its stowed position to its deployed position, and particularly, so that the first and second rollers 262A, 262B are arranged in the third position, or rather, the platen-level position. The first roller 262A can be positioned in the third position so as to engage or contact the polishing surface 234 of the used pad 230U. The second roller 262B can be positioned below the pad mounting surface 216 along the third direction Z. The controller 290 can also cause the vacuum pump 252 (FIG. 2) to cease applying a vacuum within the plurality of apertures 218 (FIG. 2) to release the used pad 230U from the pad mounting surface 216 of the platen 210. That is, the vacuum pump 252 is controlled to release the “vacuum hold” of the used pad 230U to the platen 210, which allows the used pad 230U to be moved.

Accordingly, with the pad stops 280 and the pad handler 260 arranged in place and the used pad 230U released from the “vacuum hold”, the controller 290 (FIG. 2) can cause the pad stops 280 to rotate about their respective axes of rotation AX2 so that the webs 284 thereof move the used pad 230U toward the pad handler 260. In addition, the controller 290 can cause the first roller 262A and/or the second roller 262B to rotatably drive the used pad 230U. As depicted in FIGS. 8B and 8C, the used pad 230U can be received between the first and second rollers 262A, 262B, and the first roller 262A can rotate in a clockwise direction to rotatably drive the used pad 230U (from the perspective in FIG. 8B) while the second roller 262B can rotate in a counterclockwise direction (from the perspective in FIG. 8B) to rotatably drive the used pad 230U. The pad stops 280 can thus push a trailing end 246U of the used pad 230U toward the pad handler 260 while the pad handler 260 can pull the leading end 244U of the used pad 230U away from the pad stops 280. In this way, the used pad 230U can be slid along the pad mounting surface 216 of the platen 210 away from the pad stops 280.

As illustrated in FIG. 8D, as the pad handler 260 moves the used pad 230U along, the controller 290 (FIG. 2) can cause the first and second rollers 262A, 262B to move from the third position to the second position (or from the platen-level position to the bend position). The first and second rollers 262A, 262B can be translated upward along the third direction Z, e.g., as shown in FIG. 8D.

As the used pad 230U continues to be moved by the pad handler 260, the curvature of the used pad 230U flips or changes from upward concavity (FIG. 8D) to downward concavity, or rather, from positive to negative curvature. In this regard, the leading end 244U of the used pad 230U can point downward toward the other rollers of the pad handler 260 (e.g., toward the third and fourth rollers 262C, 262D). In some embodiments, after or at the time of this occurrence, the controller 290 (FIG. 2) can cause the first and second rollers 262A, 262B to move from the second position to the first position, or rather, upward along the third direction Z and away from the platen 210 along the first direction X, e.g., as shown in FIG. 8E. This effectively vertically orients the used pad 230U, as depicted in FIG. 8E. In other embodiments, the first and second rollers 262A, 262B can be moved from the second position to the first position based on some other condition or criteria, such as based on a predetermined time.

With reference to FIG. 8F, the controller 290 (FIG. 2) can cause the pad storage unit 270 to move, e.g., along the first direction X, so that the door 276U of the used pad cartridge 272U is aligned with the vertically-oriented used pad 230U. The controller 290 can cause the door 276U to open, and the pad handler 260 can move the used pad 230U into the used pad cartridge 272U. The cartridge roller 279U can also facilitate movement of the used pad 230U into the used pad cartridge 272U. The inserted used pad 230U can push against the other used pads 230U (if applicable), causing the springs 278U to compress and the support plate 274U to be moved away from the newly inserted used pad 230U, e.g., along the first direction X. Once the used pad 230U is arranged within the used pad cartridge 272U, the controller 290 can cause the door 276U to move closed.

Further, once the used pad 230U is removed from the platen 210 and stored in the used pad cartridge 272U, the pad handler 260 can remove other used pads from other platens, can commence a pad installation process to install a new pad on the platen 210, or the pad handler 260 and other movable components can be moved to their respective stowed positions.

FIG. 9 is a flow diagram for an example method 300 of performing an automated pad change process for a CMP system, according to an example embodiment of the present disclosure.

At 302, the method 300 can include moving, using a pad handler, a pad onto, or from, a pad mounting surface of a platen, with the platen forming a plurality of apertures that extend to the pad mounting surface.

At 304, the method 300 can include selectively controlling a vacuum pump to apply a vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface or to release the pad from the pad mounting surface.

For instance, at 302 during a pad installation process, the pad handler can move the pad onto the pad mounting surface of the platen by retrieving the pad from a pad cartridge using the pad handler. Once retrieved from the pad cartridge, the pad can be guided to the pad mounting surface of the platen by selectively moving a pair of rollers of the pad handler between discrete positions, e.g., from a first position to a second position, and then from the second position to a third position. In the first position, the pad can be initially received between the rollers of the pair, and in moving to the second position, the rollers of the pair can guide the pad into a bent position so as to guide the leading end of the pad downward toward the pad mounting surface of the platen. As the trailing end of the pad reaches the rollers of the pair, the pair of rollers can be moved to the third position so as to slide the pad onto the pad mounting surface, e.g., until the pad reaches pad stops. Once in position, the vacuum pump can be controlled to apply a vacuum within the apertures so as to hold the pad to the platen, e.g., at 304.

During a pad removal process, at 304, the vacuum pump can be controlled to cease applying vacuum within the plurality of apertures. This effectively releases the “vacuum hold” of the pad to the platen and allows the pad to be removed therefrom. With the pad ready for removal, at 302, the pad holder can retrieve the pad. Specifically, rollers of the pad handler can be used to rotatably drive the pad along the pad mounting surface and pad stops can be rotated to engage the pad and urge the pad toward the rollers of the pad handler. A pair of rollers of the pad handler can be selectively moved between discrete positions, such as from the third position to the second position, and then from the second position to the first position, or rather, a reversal of the pad installation process. The pad removed from the platen can be stored in a pad cartridge, e.g., a used pad cartridge that encloses used pads in an environment isolated from, e.g., a CMP processing chamber and a new pad cartridge in which new pads are stored.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.