44780 ⎘
Lapping machines or devices; Accessories; Lapping tools Lapping pads for working plane surfaces
Sub-classes:POLISHING SYSTEM FOR SEMICONDUCTING WAFER SUBSTRATES
#2TOOLS FOR CHEMICAL PLANARIZATION
#3POLISHING PAD FOR SEMICONDUCTOR HYBRID BONDING AND PREPARATION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#4AUTOMATED CMP PAD CHANGE FOR CMP SYSTEM
#5SUBSTRATE POLISHING APPARATUS
#6DOUBLE-SIDE GRINDING APPARATUS AND METHODS HAVING A WHEELBASE WITH POROUS ABRASIVE MEMBERS
#7SUBSTRATE POLISHING APPARATUS
#8INTEGRATED WET PASSIVATION ON CMP FOR HYBRID BONDING POST-CU PAD POLISH CAPPING
#9POLISHING PAD CONDITIONING APPARATUS
#10CHEMICAL MECHANICAL POLISHING SYSTEM WITH CONDITIONING RING
#11AUTOMATIC POLISHING PAD REPLACEMENT DEVICE AND POLISHING DEVICE INCLUDING THE SAME
#12CHEMICAL MECHANICAL POLISHING APPARATUS, METHOD OF CONDITIONING POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING, CONDITIONING ASSEMBLY FOR CONDITIONING POLISHING PAD USED IN CHEMICAL MECHANICAL POLISHING
#13CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#14PROCESSING APPARATUS AND POLISHING SURFACE SHAPING METHOD
#15SUBSTRATE LAPPING APPARATUS AND SUBSTRATE LAPPING METHOD USING THE SAME
#16SYSTEMS AND METHODS FOR PANEL POLISHING
#17PLANARIZATION METHOD OF WAFER
#18MODULAR CHEMICAL MECHANICAL POLISHER WITH SIMULTANEOUS POLISHING AND PAD TREATMENT
#19POLISHING DEVICE AND METHOD FOR DETECTING POLISHING END POINT IN POLISHING DEVICE
#20CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#21APPARATUS FOR POLISHING A WAFER
#22POLISHING HEAD AND POLISHING APPARATUS
#23COLD LIQUID POLISHING CONTROL
#24INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP
#25LEVERAGED POROMERIC POLISHING PAD
#26Tungsten Chemical Mechanical Polishing Slurries
#27POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING SEMICONDUCTOR DEVICE USING SAME
#28POLISHING HEAD AND SEGMENTATION TYPE HEAD MODULE OF A CHEMICAL MECHANICAL POLISHING APPARATUS
#29Perpendicularly Magnetized Ferromagnetic Layers Having an Oxide Interface Allowing for Improved Control of Oxidation
#30SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#31COMPRESSION GAP CONTROL FOR PAD-BASED CHEMICAL BUFF POST CMP CLEANING
#32POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
#33POLISHING APPARATUS
#34CMP System and Method of Use
#35CONDITIONING APPARATUS
#36Temperature control in chemical mechanical polish
#37Polishing head, and polishing treatment device
#38PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APPARATUS, AND POLISHING APPARATUS
#39Modular chemical mechanical polisher with simultaneous polishing and pad treatment
#40SLURRY ARM AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
#41MULTIPLE DISK PAD CONDITIONER
#42Apparatus and methods for susceptor deposition material removal
#43POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY
#44POLISHING PAD CONDITIONING SYSTEM AND METHOD OF USING
#45Chemical mechanical polishing apparatus and method
#46Novel CMP Pad Design and Method of Using the Same
#47Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk
#48SINGLE-SIDE POLISHING APPARATUS, SINGLE-SIDE POLISHING METHOD, AND POLISHING PAD
#49Chemical mechanical planarization tool
#50EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SYSTEM
#51Polishing Pad with Secondary Window Seal
#52PAD CARRIER ASSEMBLY FOR HORIZONTAL PRE-CLEAN MODULE
#53Chemical mechanical polishing apparatus and method
#54USING SACRIFICIAL MATERIAL IN ADDITIVE MANUFACTURING OF POLISHING PADS
#55STEAM CLEANING OF CMP COMPONENTS
#56POLISHING PAD CONDITIONING APPARATUS
#57POLISHING APPARATUS
#58Wafer surface chemical distribution sensing system and methods for operating the same
#59POLISHING SLURRY DISPENSE NOZZLE
#60CMP polishing head design for improving removal rate uniformity
#61TOOLS FOR CHEMICAL PLANARIZATION
#62APPARATUS FOR POLISHING A WAFER
#63Integrated abrasive polishing pads and manufacturing methods
#64TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
#65FACE-UP WAFER EDGE POLISHING APPARATUS
#66Polishing apparatus and polishing member dressing method
#67Polishing system with annular platen or polishing pad
#68Method for polishing semiconductor substrate
#69Wafer polishing head, method for manufacturing wafer polishing head, and wafer polishing apparatus comprising same
#70Substrate processing apparatus, substrate processing system, and substrate processing method
#71POLISHING APPARATUS, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND PROGRAM
#72Methods to clean chemical mechanical polishing systems
#73Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus
#74SUBSTRATE POLISHING SYSTEM AND SUBSTRATE POLISHING METHOD
#75Polishing system with contactless platen edge control
#76Method for polishing single-crystal diamond
#77Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk
#78METHOD OF MANUFACTURE OF POLISHING PADS HAVING TWO OR MORE ENDPOINT DETECTION WINDOWS
#79Chemical mechanical polishing method
#80Apparatus and method for manufacturing display device
#81Chemical mechanical polishing with applied magnetic field
#82Chemical mechanical planarization membrane
#83SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING PHOTOCATALYST
#84SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#85Polishing head and polishing apparatus
#86Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor device
#87Substrate polishing apparatus with contact extension or adjustable stop
#88METHOD FOR POLISHING A SEMICONDUCTIOR WAFER
#89Pad-temperature regulating apparatus, method of regulating pad-temperature, polishing apparatus, and polishing system
#90POLISHING PAD AND METHOD FOR PREPARING SEMICONDUCTOR DEVICE USING THE SAME
#91Apparatus and methods for susceptor deposition material removal
#92POLISHING APPARATUS AND POLISHING METHOD
#93Dressing apparatus and polishing apparatus
#94POLISHING APPARATUS AND POLISHING METHOD
#95Multi-Motion Appliance
#96Retaining ring
#97Correction of fabricated shapes in additive manufacturing
#98Polishing pad, preparation method thereof and method for preparing semiconductor device using same
#99SEMICONDUCTOR SUBSTRATE POLISHING WITH POLISHING PAD TEMPERATURE CONTROL
#100Chemical mechanical polishing system and method of using
#101CMP system and method of use
#102OFFSET PORE POROMERIC POLISHING PAD
#103FOCUS RING AND SUBSTRATE PROCESSING APPARATUS
#104DOUBLE-SIDED POLISHING OR SANDING MEMBER FOR ATTACHMENT TO A HAND-GUIDED POWER TOOL AND POWER TOOL WITH SUCH A POLISHING OR SANDING MEMBER
#105One or more conformal members used in the manufacture of a lapping plate, and related apparatuses and methods of making
#106CHEMICAL MECHANICAL POLISHING USING FLUORESCENCE-BASED ENDPOINT DETECTION
#107Apparatus and method for manufacturing display device
#108Wafer polishing head, system thereof, and method using the same
#109Chemical Mechanical Polishing Apparatus and Method
#110LCD glass lapping apparatus
#111Substrate processing apparatus and substrate processing method
#112Polishing pads having selectively arranged porosity
#113RFID part authentication and tracking of processing components
#114System for adjusting pad surface temperature and polishing apparatus
#115Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device
#116SUBSTRATE HOLDING APPARATUS AND METHOD OF MANUFACTURING A DRIVE RING
#117Small batch polishing fluid delivery for CMP
#118Using sacrificial material in additive manufacturing of polishing pads
#119Polishing apparatus
#120CLEANING APPARATUS, CHEMICAL MECHANICAL POLISHING SYSTEM INCLUDING THE SAME, CLEANING METHOD AFTER CHEMICAL MECHANICAL POLISHING, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING THE SAME
#121Chemical mechanical polishing (CMP) polishing head with improved vacuum sealing
#122Multifunctional robotic device
#123External heating system for use in chemical mechanical polishing system
#124Polishing apparatus
#125Polishing pad conditioning apparatus
#126System for cleaning wafer in CMP process of semiconductor manufacturing fabrication
#127Chemical mechanical planarization tool
#128Novel CMP Pad Design and Method of Using the Same
#129Method for repairing polishing pad in real time
#130Device and methods for chemical mechanical polishing
#131CHEMICAL MECHANICAL POLISHING METHOD AND CHEMICAL MECHANICAL POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#132Article transporter in semiconductor fabrication
#133CMP system and method of use
#134Rotary body module and chemical mechanical polishing apparatus having the same
#135SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM
#136Cleaning method for optical surface monitoring device
#137Liquid supplying device and method for draining liquid thereof
#138Steam cleaning of CMP components
#139POLISHING APPARATUS AND POLISHING METHOD
#140Body obtained by processing solid carbon-containing material, producing method thereof, and producing apparatus thereof
#141Polishing pad with secondary window seal
#142Chemical-mechanical polishing system and method
#143Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus
#144Polishing pad that minimizes occurrence of defects and process for preparing the same
#145Cleaning apparatus for heat exchanger and polishing apparatus
#146POLISHING APPARATUS AND POLISHING METHOD
#147Polishing apparatus and polishing method
#148Substrate processing apparatus, substrate processing system, and substrate processing method
#149Semiconductor wafer thinning systems and related methods
#150Polishing apparatus and polishing method
#151MODULE AND SYSTEM FOR TRIMMING WAFER EDGE
#152Polishing apparatus and polishing member dressing method
#153Polishing machine and a polishing method for a substrate
#154Polishing pad comprising window similar in hardness to polishing layer
#155Apparatus and methods for chemical mechanical polishing
#156Correction of fabricated shapes in additive manufacturing
#157DEVICE FOR CONDITIONING CHEMICAL MECHANICAL POLISHING
#158Methods to clean chemical mechanical polishing systems
#159Chemical mechanical polishing apparatus and method
#160Chemical mechanical polishing apparatus having scraping fixture
#161Systems and methods for chemical mechanical polish and clean
#162Polishing system with support post and annular platen or polishing pad
#163Carrier wafers and methods of forming carrier wafers
#164PLATEN ASSEMBLY AND METHOD OF ASSEMBLING A PLATEN ASSEMBLY
#165Wafer surface beveling method, method of manufacturing wafer, and wafer
#166Perpendicularly magnetized ferromagnetic layers having an oxide interface allowing for improved control of oxidation
#167Chemical mechanical planarization system and a method of using the same
#168Apparatus and method of forming a polishing article that has a desired zeta potential
#169Substrate holding device, substrate polishing apparatus, and method of manufacturing the substrate holding device
#170Compositions for use in chemical mechanical polishing
#171Method of double-side polishing semiconductor wafer
#172Direct bond method providing thermal expansion matched devices
#173POLISHING APPARATUS AND POLISHING METHOD
#174Polishing apparatus and polishing method
#175Temperature control of chemical mechanical polishing
#176Temperature Control of Chemical Mechanical Polishing
#177Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system
#178Method of using a polishing system
#179Temperature control in chemical mechanical polish
#180Semiconductor wafer thinning systems and related methods
#181Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
#182METHOD FOR POLISHING WAFER
#183Method and apparatus for polishing a substrate
#184Polishing pad and polishing method using same
#185Polishing apparatus
#186Semiconductor wafer, and method for polishing semiconductor wafer
#187System, control method and apparatus for chemical mechanical polishing
#188Article transferring method in semiconductor fabrication
#189Chemical mechanical polishing apparatus and method
#190Predictive filter for polishing pad wear rate monitoring
#191Polishing method and polishing apparatus
#192SUBSTRATE TREATMENT APPARATUS
#193CMP polishing head design for improving removal rate uniformity
#194SUBSTRATE PROCESSING APPARATUS
#195Process for spraying back-adhesive on CMP pad
#196Polishing pad, method for manufacturing polishing pad, and polishing method
#197Chemical mechanical polishing apparatus and method
#198SEMICONDUCTOR FABRICATION USING PROCESS CONTROL PARAMETER MATRIX
#199SEMICONDUCTOR FABRICATION USING MACHINE LEARNING APPROACH TO GENERATING PROCESS CONTROL PARAMETERS
#200Chemical mechanical planarization membrane
#201Chattering correction for accurate sensor position determination on wafer
#202Method and system for monitoring polishing pad
#203One or more conformal members used in the manufacture of a lapping plate, and related apparatuses and methods of making
#204SUBSTRATE POLISHING APPARATUS AND METHOD
#205Polishing device, polishing method, and record medium
#206SUBSTRATE PROCESSING APPARATUS
#207Integrated abrasive polishing pads and manufacturing methods
#208Temperature control in chemical mechanical polish
#209WORKPIECE POLISHING APPARATUS
#210Wafer polishing method and apparatus
#211Correction of fabricated shapes in additive manufacturing using modified edge
#212Correction of fabricated shapes in additive manufacturing using sacrificial material
#213Correction of fabricated shapes in additive manufacturing using initial layer
#214Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same
#215Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same
#216Polishing apparatus and polishing method
#217Chemical mechanical polishing apparatus
#218CLEANING APPARATUS, CHEMICAL MECHANICAL POLISHING SYSTEM INCLUDING THE SAME, CLEANING METHOD AFTER CHEMICAL MECHANICAL POLISHING, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING THE SAME
#219System for chemical mechanical polishing of Ge-based materials and devices
#220Method for polishing wafer and polishing apparatus
#221ADHESIVE-LESS CARRIERS FOR CHEMICAL MECHANICAL POLISHING
#222Method and apparatus for within-wafer profile localized tuning
#223Polishing apparatus with a waste liquid receiver
#224Actuator tilt interposer for within-row lapping mount tool for magnetic recording read-write heads
#225Within-row stripe height and wedge angle control for magnetic recording read-write heads
#226Method and system for monitoring polishing pad before CMP process
#227RFID part authentication and tracking of processing components
#228Formulations for chemical mechanical polishing pads and CMP pads made therewith
#229Polishing apparatus and polishing method
#230Techniques for processing a polycrystalline layer using an angled ion beam
#231Direct bond method providing thermal expansion matched devices
#232Grinding apparatus and wafer processing method
#233ADDITIVE MANUFACTURING OF POLISHING PADS ON A CONVEYOR
#234TREATMENT COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND CLEANING METHOD
#235Tiltable platform for additive manufacturing of a polishing pad
#236Two step curing of polishing pad material in additive manufacturing
#237CMP pad conditioning assembly
#238Polishing pad with secondary window seal
#239Polishing system with annular platen or polishing pad for substrate monitoring
#240Method of processing thin layer
#241Surface planarization system and method
#242Chemical mechanical polishing apparatus
#243Chemical mechanical polishing head
#244Perpendicularly magnetized ferromagnetic layers having an oxide interface allowing for improved control of oxidation
#245Film thickness signal processing apparatus, and polishing apparatus
#246Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates
#247System and method of delivering slurry for chemical mechanical polishing
#248Chemical mechanical polishing (CMP) apparatus and method
#249RETAINER RING FOR SEMICONDUCTOR MANUFACTURING PROCESSES
#250Substrate processing system
#251Polishing system
#252Chemical mechanical polishing apparatus and method
#253Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same
#254CLEANING APPARATUS AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME
#255Substrate processing apparatus
#256Polishing system with local area rate control and oscillation mode
#257Substrate polishing method, top ring, and substrate polishing apparatus
#258Polishing apparatus and polishing method
#259Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
#260Correction of fabricated shapes in additive manufacturing
#261POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE
#262Polishing apparatus
#263MOUNTING SHEET, POLISHING APPARATUS, AND METHOD FOR MAKING THE SAME
#264Apparatus and method for regulating surface temperature of polishing pad
#265CMP PAD CONDITIONERS WITH MOSAIC ABRASIVE SEGMENTS AND ASSOCIATED METHODS
#266Chemical-mechanical wafer polishing device
#267POLISHING MEMBER AND SEMICONDUCTOR MANUFACTURING METHOD
#268Systems, apparatus, and methods for chemical polishing
#269Polishing apparatus
#270Grinding tool
#271CHEMICAL MECHANICAL POLISHING CONDITIONER AND FABRICATION METHOD THEREOF
#272METHOD FOR POLISHING GERMANIUM WAFER
#273Polishing layer analyzer and method
#274Slurry composition and method of use
#275Carrier for small pad for chemical mechanical polishing
#276Method of polishing work and method of dressing polishing pad
#277Polisher, polishing tool, and polishing method
#278System for cleaning wafer in CMP process of semiconductor manufacturing fabrication
#279Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system
#280Semiconductor substrate polishing methods with dynamic control
#281Polishing apparatus, control method and recording medium
#282Work processing apparatus and liquid chemical bag for the same
#283Polishing pad
#284pH-adjuster free chemical mechanical planarization slurry
#285Polishing table replacement apparatus, polishing table replacement method, and apparatus for replacing a component of semiconductor-device manufacturing machine
#286Polishing pad, method for manufacturing polishing pad, and polishing method
#287Calibration method of substrate polishing apparatus, calibration apparatus of the same, and non-transitory computer readable recording medium for recording calibration program of the same
#288CMP polishing head design for improving removal rate uniformity
#289Chemical mechanical polishing method
#290MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SLURRY FOR CHEMICAL MECHANICAL POLISHING
#291Apparatus for forming a polishing article that has a desired zeta potential
#292Vibration assistant polishing module
#293Chemical mechanical polishing system
#294Substrate holding device, and substrate polishing apparatus
#295POLISHING DEVICE
#296Polishing endpoint detection method
#297Polishing apparatus including pad contact member with baffle in liquid flow path therein
#298Polishers
#299Polishing method and polishing apparatus
#300Slurry composition for chemical mechanical polishing of GE-based materials and devices