ELECTRONIC ATOMIZATION DEVICE AND CONTROL METHOD AND APPARATUS THEREOF

Description

RELATED APPLICATIONS

This application is a continuation application of International application No. PCT/CN2024/091005, filed on April 30, 2024, which claims priority to Chinese Patent Application No. 202310756791.X, filed on June 25, 2023. The entire disclosure of the prior applications is hereby incorporated by reference.

TECHNICAL FIELD

This disclosure relates to the technical field of atomization devices, including to an electronic atomization device and a control method and apparatus thereof.

BACKGROUND

In conventional technologies, an electronic atomization device usually includes components such as a heating element, a battery, and a control circuit. The heating element is a core element of an electronic cigarette, and an atomization effect and use experience of the electronic cigarette depends on characteristics of the heating element.

A cotton core heating element is an existing heating element. Most cotton core heating elements are of a structure of a metal heating wire wrapped on a cotton rope or a fiber rope. A to-be-atomized liquid aerosol-forming substrate is absorbed by two ends of the cotton rope, and then transferred to a central metal heating wire to be heated and atomized. Because an area of an end portion of the cotton rope is limited, the absorption efficiency and the transmission efficiency of the aerosol-forming substrate are low. In addition, the structure stability of the cotton rope is poor. As a result, phenomena such as dry heating, carbon accumulation, and a burnt flavor are prone to occur after a plurality of times of thermal cycling.

A porous ceramic heating element is another widely used heating element, and includes a porous ceramic substrate and a metal heating film. The porous ceramic plays a role of liquid guiding and liquid storage, and the metal heating film heats and atomizes the liquid aerosol- forming substrate. However, it is hard for a porous ceramic manufactured through high-temperature sintering to accurately control position distribution and size precision of micropores.

To resolve the foregoing problem, developers attempt to replace a disordered porous structure with a through microporous structure. However, a heating element with through micropores, especially a heating element with thin through micropores is likely to generate noise.

SUMMARY

According to an aspect, this disclosure provides an electronic atomization device. The electronic atomization device includes:

a heating element including a ceramic substrate, the ceramic substrate being provided with a plurality of through micropores that penetrate the ceramic substrate;

a power supply module; and

a processing module, configured to: when the heating element performs heating, control the power supply module to provide energy to the heating element based on a preset frequency, where a duty cycle of the preset frequency is greater than or equal to 70% and less than or equal to 100%.

In an example, the duty cycle of the preset frequency is less than 100%, and the processing module controls the power supply module to provide, based on the preset frequency, energy to the heating element through a capacitor in the electronic atomization device.

In an example, the duty cycle of the preset frequency is greater than or equal to 85%.

In an example, the thickness of the ceramic substrate is greater than or equal to 0.1 mm and less than or equal to 2 mm. In an example, the pore diameter of the through micropore is greater than or equal to 1 um and less than or equal to 100 um. In an example, the thickness of the ceramic substrate is greater than or equal to 0.3 mm and less than or equal to 0.8 mm. In an example, the pore diameter of the through micropore is greater than or equal to 10 um and less than or equal to 50 um.

In an example, a ratio of the thickness of the ceramic substrate to a pore diameter of the through micropore is greater than or equal to 50:1 and less than or equal to 3:1.

In an example, the through micropores are provided on the ceramic substrate in a form of an array, and a ratio of a distance between pore centers of the through micropores to the pore diameter is greater than or equal to 3:1 and less than or equal to 1.5:1.

In an example, the heating element includes a first heating sub-element and a second heating sub-element, the first heating sub-element and the second heating sub-element each are provided with a plurality of through micropores that penetrate the ceramic substrate, and the through micropores on the first heating sub-element are in communication with the through micropores on the second heating sub-element.

According to an aspect, this disclosure further provides a control method of an electronic atomization device. The electronic atomization device includes a heating element and a power supply module, and a ceramic substrate of the heating element is provided with a plurality of through micropores that penetrate the ceramic substrate. The method includes:

when the heating element performs heating, controlling the power supply module to provide energy to the heating element based on a preset frequency, where a duty cycle of the preset frequency is greater than or equal to 70% and less than or equal to 100%

In an example, the duty cycle of the preset frequency is less than 100%. The method further includes:

when the heating element performs heating, controlling the power supply module to provide, based on the preset frequency, energy to the heating element through a capacitor in the electronic atomization device.

In an example, the duty cycle of the preset frequency is greater than or equal to 85%.

According to an aspect, this disclosure further provides a control apparatus of an electronic atomization device. The electronic atomization device includes a heating element and a power supply module, and a ceramic substrate of the heating element is provided with a plurality of through micropores that penetrate the ceramic substrate. The apparatus includes:

a control module, configured to: when the heating element performs heating, control the power supply module to provide energy to the heating element based on a preset frequency, where a duty cycle of the preset frequency is greater than or equal to 70% and less than or equal to 100%.

In an example, the duty cycle of the preset frequency is less than 100%, and the control module is further configured to control the power supply module to provide, based on the preset frequency, energy to the heating element through a capacitor in the electronic atomization device.

Details of one or more examples of this disclosure are provided in the subsequent accompanying drawings and descriptions. Other features, objectives, and advantages of this disclosure become apparent with reference to the specification, accompanying drawings, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

To describe the technical solutions in the examples of this disclosure or conventional technologies more clearly, the following briefly describes the accompanying drawings required for describing the examples or conventional technologies. Apparently, the accompanying drawings in the following descriptions show merely some examples of this disclosure, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.

FIG. 1 is a schematic diagram of a three-dimensional structure of a heating element according to an example;

FIG. 2 is a schematic diagram of a generation process of an explosive boiling phenomenon according to an example;

FIG. 3 is a schematic structural diagram of an electronic atomization device according to an example;

FIG. 4 is a schematic diagram of a test result of comparison of vibration and noise between direct current heating and impulse heating according to an example;

FIG. 5 is a schematic diagram of a change of a voltage of a heating element according to an example;

FIG. 6 is a schematic side view of a heating element according to another example.

FIG. 7 is a schematic flowchart of a control method of an electronic atomization device according to an example; and

FIG. 8 is a schematic structural diagram of modules of a control apparatus of an electronic atomization device according to an example

DETAILED DESCRIPTION

The technical solutions in the examples of this disclosure are clearly and completely described below with reference to the accompanying drawings in the examples of this disclosure. Apparently, the described examples are merely some rather than all of the examples of this disclosure. All other examples obtained by a person of ordinary skill in the art based on the examples of this disclosure without creative efforts shall fall within the protection scope of this disclosure.

It should be noted that, compared with a heating element of a disordered porous structure, air enters a heating element with through micropores more easily, and a sound similar to water boiling is generated in a process of entering air. If explosive boiling that is low-frequency and consistent stepwise continuously occurs, vibration is caused, generating noise and affecting user experience. The heating element with through micropores is a pore whose center line is basically a straight line and that pass through the substrate.

As shown in FIG. 1, the heating element 130 is a thin heating element (where the thin heating element is a heating element whose thickness is less than 3 mm), and includes a ceramic substrate 131, a heating film 132, and an electrode 133. The ceramic substrate 131 has an atomization surface 1311 and a liquid absorbing surface 1312 that are opposite to each other. The ceramic substrate 131 is provided with a plurality of through micropores 1313, the through micropores 1313 are through holes that pass through the ceramic substrate 131, and the through micropores 1313 are in communication with the liquid absorbing surface 1312 and the atomization surface 1311.

The through micropores 1313 are configured to guide an atomization substrate from the liquid absorbing surface 1312 to the atomization surface 1311. To be specific, an atomization substrate in an electronic atomization device flows to the liquid absorbing surface 1312 of the ceramic substrate 131 through a liquid drain channel, and is guided to the atomization surface 1311 under the action of capillarity of the through micropores 1313. In other words, the atomization substrate flows from the liquid absorbing surface 1312 to the atomization surface 1311 under the action of gravity and/or capillarity, and the atomization substrate is heated on the atomization surface 1311 of the heating element 130 to generate an aerosol.

However, during use, the inventor finds that the use of the heating element 130 shown in FIG. 1 causes loud noise and large vibration. The substrate is manifested as that the electronic atomization device performs atomization in a manner of pulse-type heating at a constant power and 100 Hz. Pulse-type heating means that the electronic atomization device does not continuously output power, but performs output in a form of a duty cycle, so that it is convenient to adjust the duty cycle to adjust an output power. For example, when the output power is 15 W, if constant power output at 7.5 W is intended to be achieved, the duty cycle is adjusted to 50%. In this case, the heating element 130 is normally heated in 50% of time, and the heating element 130 is not heated in other 50% of time, and addition of the atomization substrate causes the heating film 132 of the heating element 130 to cool down in non-heating time. Such a pulse control manner can ensure that the temperature of the heating element 130 is not excessively high, but a pulse control manner at a constant power easily causes an instantaneous high power. The instantaneous high power may cause an explosive boiling phenomenon of the atomization substrate.

To better understand the explosive boiling phenomenon, the explosive boiling phenomenon is first described. During heating, pulse control causes an instantaneous high power. In this case, the high power causes the heating element 130 to rapidly increase in temperature, and the atomization substrate is heated to rapidly reach a boiling point. Due to lack of a gasification core, atomization substrate does not boil but continues to increase in temperature to form an overheated liquid. Once the overheated liquid is triggered to boil (which may be triggered due to a change of an external environment, for example, jitter), the overheated liquid is very violent, that is, explosive boiling occurs. The gasification core is an object that can trigger the liquid to boil, for example, bubbles. If heating is performed by using zeolite with many fine pores, air in the pores flows out due to heating, and small bubbles are formed. These small bubbles may be used as the gasification center. In this way, a solution can boil in time after the temperature reaches the boiling point, and the temperature of the solution does not increase again, so that an overheated liquid is not generated, that is, explosive boiling does not occur. It can be learned from the foregoing descriptions that a smoother surface of the heating film indicates that an explosive boiling phenomenon is more likely to occur.

In addition, compared with a porous structure, air enters the through micropores 1313 more easily. When the temperature of the liquid is much higher than the boiling point, the saturated vapor pressure of the small bubbles inside the through micropores 1313 is higher than the external pressure. It is preset that the bubbles rapidly expand, and push the through micropores 1313 to perform ejection to the external, that is, liquid spraying occurs. As shown in FIG. 2, the air entering the through micropores 1313 forms small bubbles inside. During the increase in temperature, vapor inside the bubbles increasingly expands from left to right and is ejected from the through micropores 1313, to drive another atomization substrate to cause liquid spraying. As a result, for a user, obvious vibration and noise may be felt. The electronic atomization device generally uses a pulse control manner. As a result, periodic liquid spraying occurs, and vibration and noise periodically occur, affecting inhaling experience.

To resolve the foregoing problems, the following examples are provided.

In an example, an electronic atomization device is provided. As shown in FIG. 3, the electronic atomization device includes:

a processing module 120, a power supply module 110, and a heating element 130. The heating element 130 includes a ceramic substrate 131, the ceramic substrate 131 is provided with a plurality of through micropores 1313 that pass through the ceramic substrate 131, and an axis of the through micropores 1313 is perpendicular to the ceramic substrate 131, that is, an extension direction of the through micropores 1313 is perpendicular to the ceramic substrate 131. In this example, the ceramic substrate 131 is in a sheet shape, for example, a rectangular sheet. It may be understood that the sheet shape is relative to a block shape, and a ratio of the length to the thickness of the sheet shape is greater than a ratio of the length to the thickness of the block shape. The ceramic substrate 131 may alternatively be in a shape of a plate, an arc, a cylinder, or the like, which is specifically designed as required. Other structures of the electronic atomization device are arranged by matching with the shape of the ceramic substrate 131.

In an example, the power supply module 110 may be connected to the processing module 120 and a capacitor 140, and the capacitor 140 is connected to the heating element 130. In this case, the processing module 120 may send a control instruction to the power supply module 110, to control an output power and a battery frequency of the power supply module 110. In another example, the power supply module 110, the processing module 120, a capacitor 140, and the heating element 130 may be sequentially connected. In this case, the processing module 120 may implement on or off of the processing module 120, to control on or off between the processing module 120 and the heating element 130, so as to control a battery frequency of the power supply module 110. In still another example, the power supply module 110 may be connected to the processing module 120 and the heating element 130. In this case, the processing module 120 may send a control instruction to the power supply module 110, to control an output power of the power supply module 110, and provide energy to the heating element 130 in a direct current manner. In yet another example, the power supply module 110, the processing module 120, and the heating element 130 may be sequentially connected, to control an output power of the power supply module 110, and provide energy to the heating element 130 in a direct current manner. It should be noted that when a duty cycle of a preset frequency is 100%, the duty cycle is a limit duty cycle, that is, the output power of the power supply module 110 is a direct current.

The battery frequency is a quantity of times that the direction of an alternating current output by the power supply module 110 changes per unit time (1 second).

The power supply module 110 is configured to separately provide energy to the processing module 120 and the heating element 130, so that the processing module 120 and the heating element 130 can operate normally.

In this disclosure, the heating element 130 is a thin heating element. The thickness of the ceramic substrate 131 of the heating element 130 is greater than or equal to 0.1 mm and less than or equal to 2 mm. The thickness of the ceramic substrate 131 is a distance between the liquid absorbing surface 1312 and the atomization surface 1311. When the thickness of the ceramic substrate 131 is greater than 2 mm, a liquid supply requirement cannot be met. As a result, a quantity of aerosols decreases, a large heat loss is caused, and costs of disposing the ceramic substrate 131 are high. When the thickness of the ceramic substrate 131 is less than 0.1 mm, the strength of the ceramic substrate 131 cannot be ensured, which is not beneficial to enhancement of the performance of the electronic atomization device. In some examples, the thickness of the ceramic substrate 131 is greater than or equal to 0.3 mm and less than or equal to 0.8 mm. During specific implementation, a suitable thickness may be selected based on an actual requirement.

The pore diameter of the through micropore 1313 on the ceramic substrate 131 is greater than or equal to 1 um and less than or equal to 100 um. When the pore diameter of the through micropore 1313 is less than 1 um, a liquid supply requirement cannot be met, resulting in a decrease in the quantity of aerosols. When the pore diameter of the through micropore 1313 is greater than 100 um, an aerosol forming substrate is likely to flow out of the through micropore 1313, causing liquid leakage. Preferably, the pore diameter of the through micropore 1313 is greater than or equal to 10 um and less than or equal to 50 um. During specific implementation, a suitable pore diameter may be selected based on an actual requirement.

A ratio of the thickness of the ceramic substrate 131 to the pore diameter of the through micropore 1313 is greater than or equal to 50:1 and less than or equal to 3:1, to improve a liquid supply capability. When the ratio of the thickness of the ceramic substrate 131 to the pore diameter of the through micropore 1313 is greater than 50:1, it is difficult for the atomization substrate supplied under the action of capillarity of the through micropores 1313 to meet an atomization requirement, and consequently, dry heating is likely to occur, and a quantity of aerosols generated through each atomization decreases. When the ratio of the thickness of the ceramic substrate 131 to the pore diameter of the through micropore 1313 is less than 3:1, the aerosol forming substrate is likely to flow out of the through micropores 1313, causing a waste and causing reduction in the atomization efficiency, and reducing a total quantity of aerosols. Preferably, the through micropores are provided on the ceramic substrate in a form of an array, and a ratio of a distance between pore centers of the through micropores to the pore diameter is greater than or equal to 3:1 and less than or equal to 1.5:1. The ratio may be selected based on an actual requirement during specific implementation.

The thickness of the heating film 132 is greater than or equal to 200 nm and less than or equal to 5 um. The material of the heating film 132 is one or more of the following: aluminum or aluminum alloy, copper or copper alloy, silver or silver alloy, nickel or nickel alloy, chromium or chromium alloy, platinum or platinum alloy, titanium or titanium alloy, zirconium or zirconium alloy, palladium or palladium alloy, iron or iron alloy, gold or gold alloy, molybdenum or molybdenum alloy, niobium or niobium alloy, and tantalum or tantalum alloy. In some examples, the thickness of the heating film 132 ranges from 200 nm to 10 um. The material of the heating film 132 is one or more of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy. The heating film 132 allows a corresponding through micropore 1313 to be exposed.

The processing module 120 is configured to: when the heating element 130 performs heating, control the power supply module 110 to provide energy to the heating element 130 based on a preset frequency, where a duty cycle of the preset frequency is greater than or equal to 70% and less than or equal to 100%

When the user inhales the electronic atomization device, the processing module 120 detects a drawing action through an airflow sensor in the electronic atomization device. In an example, after detecting an inhaling action, the airflow sensor sends, to the processing module 120, information that the electronic atomization device is inhaled, or the processing module 120 obtains, from the airflow sensor, a signal detected by the airflow sensor, and detects, based on the signal detected by the airflow sensor, whether the electronic atomization device is inhaled. In another example, the user may alternatively trigger a heating start signal/an inhaling start signal through a physical/virtual button in the electronic atomization device, so that the processing module 120 detects that the electronic atomization device is inhaled.

After it is detected that the electronic atomization device is inhaled, the power supply module 110 is controlled to provide energy to the heating element 130 through the capacitor 140, so that the heating element 130 performs heating; or the power supply module 110 is controlled to provide energy to the heating element 130 in a direct current manner, so that the heating element 130 performs heating. It may be understood that when energy is provided in a direct current manner, the capacitor 140 may not be disposed in the electronic atomization device.

Currently, the electronic atomization device usually uses a pulse control manner, that is, the electronic atomization device heats for some time and does not heat for some time within a unit time period. In this way, the heating film 132 may cool down in non-power-supply time. Therefore, pulsed aerosol generation (smoke injection/liquid spraying) occurs. To reduce drop in the temperature of the heating film 132 in non-heating time, and ensure that the heating film 132 keeps at a high temperature that can be atomized, in this disclosure, the power supply module 110 provides energy to the heating element 130 through the capacitor 140. The capacitor 140 may be a single capacitor or a capacitor array. A discharging characteristic (time needed for discharging) of the capacitor 140 is used, so that non-power supply time is shortened. This is equivalent to an increase in a duty cycle, so that cooling time of the heating film is shortened. As shown in FIG. 4, testing is performed after a constant power of 7.5 W is used, and a cartridge tube is partially cut to expose an atomization cavity. One is performed by using a direct current, and the other is performed by using 100 Hz. Vibration is obviously found in a detection result of an impulse test, but no obvious vibration is found in a detection result of the direct current test, that is, vibration and noise detected in the direct current test are obviously alleviated. Therefore, by analogy, based on a characteristic of time-consuming discharge of the capacitor 140, it can be clearly ensured that vibration and noise can be alleviated. As shown in FIG. 5, the power supply module 110 provides energy to the heating element 130 in a pulse manner, a waveform in which the voltage of the power supply module 110 changes with time is a square wave, and the voltage on the heating element 130 is to be in a wave form. In this way, time in which the voltage of the heating element 130 reaches 0 (that is, non-heating time) is greatly shortened. In this disclosure, the duty cycle of the preset frequency is greater than or equal to 70% and less than or equal to 100%, to shortened the non-heating time. Preferably, the duty cycle of the preset frequency is greater than or equal to 85% and less than or equal to 100%.

The electronic atomization device includes: a processing module a power supply module, and a heating element. The heating element includes a ceramic substrate, and the ceramic substrate is provided with a plurality of through micropores that penetrate the ceramic substrate. The processing module is configured to: when the heating element performs heating, control the power supply module to provide energy to the heating element based on a preset frequency, where a duty cycle of the preset frequency is greater than or equal to 70% and less than or equal to 100%. In the foregoing manner of using a high duty cycle, cooling time of the heating element can be shortened, to shorten temperature-dropping time of the heating film in non-heating time, and ensure that the heating film keeps at a relatively high temperature suitable for atomization. Specifically, when the heating element performs heating, the power supply module is controlled to provide energy based on the preset frequency, for example, when the duty cycle of the preset frequency is greater than or equal to 70% and less than 100%, the power supply module is controlled to provide energy to the heating element through the capacitor, so that in a process of providing energy to the heating element, temperature-dropping time of the heating element is shortened by using a discharging characteristic of the capacitor. Alternatively, if the duty cycle of the preset frequency is equal to 100%, the temperature-lowering time of the heating element is eliminated in a direct current manner, to alleviate noise generated due to vibration of the heating element caused in a pulse control process.

In an example, as shown in FIG. 6, the heating element 130 includes a first heating sub-element1301 and a second heating sub-element 1302. The first heating sub-element 1301 and the second heating sub-element 1302 each are provided with a plurality of through micropores 1313 that pass through the ceramic substrate (where the through micropores 1313 on the second heating sub-element 1302 are not shown). The through micropores 1313 on the first heating sub-element 1301 are in communication with the through micropores 1313 on the second heating sub-element 1302, to facilitate guidance of the atomization substrate from a liquid absorbing surface of the second heating sub-element 1302 to an atomization surface of the first heating sub-element 1301. Based on a same inventive concept, an example of this disclosure further provides a control method of an electronic atomization device for implementing the foregoing electronic atomization device. An implementation solution provided by the method to resolve a problem is similar to the implementation solution described in the foregoing electronic atomization device. Therefore, for specific limitations of one or more examples of the control method of an electronic atomization device below, refer to the foregoing limitations for the electronic atomization device. Details are not described herein again.

In an example, as shown in FIG. 7, this disclosure provides a control method of an electronic atomization device. The electronic atomization device includes a heating element and a power supply module, and a ceramic substrate of the heating element is provided with a plurality of through micropores that penetrate the ceramic substrate. Based on the foregoing example, the method includes:

Step 710: When the heating element performs heating, control the power supply module to provide energy to the heating element based on a preset frequency, where a duty cycle of the preset frequency is greater than or equal to 70% and less than or equal to 100%.

For an execution process of each step in this example, refer to the foregoing example. Details are not described herein again.

According to the foregoing control method of an electronic atomization device, in this disclosure, when the heating element performs heating, the power supply module is controlled to provide energy to the heating element based on the preset frequency, so that when energy is provided to the heating element, temperature-dropping time of the heating element is shortened by using a discharge characteristic of the capacitor, or temperature-dropping time of the heating element is eliminated in a direct current manner, thereby alleviating noise generated by vibration of the heating element caused in a pulse control process.

In an example, the duty cycle of the preset frequency is greater than or equal to 85% and less than or equal to 100%.

In an example, the thickness of the ceramic substrate is greater than or equal to 0.1 mm and less than or equal to 2 mm, and the pore diameter of the through micropore is greater than or equal to 1 um and less than or equal to 100 um.

In an example, the thickness of the ceramic substrate is greater than or equal to 0.3 mm and less than or equal to 0.8 mm, and the pore diameter of the through micropore is greater than or equal to 10 um and less than or equal to 50 um.

In an example, a ratio of the thickness of the ceramic substrate to a pore diameter of the through micropore is greater than or equal to 50:1 and less than or equal to 3:1.

In an example, the through micropores are provided on the ceramic substrate in a form of an array, and a ratio of a distance between pore centers of the through micropores to the pore diameter is greater than or equal to 3:1 and less than or equal to 1.5:1.

In an example, the heating element includes a first heating sub-element and a second heating sub-element, the first heating sub-element and the second heating sub-element each are provided with a plurality of through micropores that penetrate the ceramic substrate, and the through micropores on the first heating sub-element are in communication with the through micropores on the second heating sub-element.

It is to be understood that although the steps in the flowcharts of the examples are displayed in sequence according to arrows, the steps are not necessarily performed in the sequence indicated by the arrows. Unless explicitly specified in this specification, execution of the steps is not strictly limited in the sequence, and the steps may be performed in other sequences. In addition, at least some of the steps in the flowcharts of the examples may include a plurality of steps or a plurality of stages. These steps or stages are not necessarily performed at the same time point, but may be performed at different time points. These steps or stages are not necessarily executed sequentially, but may be performed in turn or alternately with another step or at least some of steps or stages of the another step.

Based on a same inventive concept, an example of this disclosure further provides a control apparatus of an electronic atomization device configured to implement the foregoing control method of an electronic atomization device. An implementation solution provided by the apparatus to resolve a problem is similar to the implementation solution described in the foregoing control method of an electronic atomization device. Therefore, for specific limitations of one or more examples of the control apparatus of an electronic atomization device below, refer to the foregoing limitations for the control method of an electronic atomization device. Details are not described herein again.

In an example, as shown in FIG. 8, a control apparatus of an electronic atomization device is further provided. The electronic atomization device includes a heating element and a power supply module, and a ceramic substrate of the heating element is provided with a plurality of through micropores that penetrate the ceramic substrate. The apparatus includes:

a control module 810, configured to: when the heating element performs heating, control the power supply module to provide energy to the heating element based on a preset frequency, where a duty cycle of the preset frequency is greater than or equal to 70% and less than or equal to 100%.

In an example, the duty cycle of the preset frequency is greater than or equal to 85% and less than or equal to 100%.

In an example, the thickness of the ceramic substrate is greater than or equal to 0.1 mm and less than or equal to 2 mm, and the pore diameter of the through micropore is greater than or equal to 1 um and less than or equal to 100 um.

In an example, the thickness of the ceramic substrate is greater than or equal to 0.3 mm and less than or equal to 0.8 mm, and the pore diameter of the through micropore is greater than or equal to 10 um and less than or equal to 50 um.

In an example, a ratio of the thickness of the ceramic substrate to a pore diameter of the through micropore is greater than or equal to 50:1 and less than or equal to 3:1.

In an example, the through micropores are provided on the ceramic substrate in a form of an array, and a ratio of a distance between pore centers of the through micropores to the pore diameter is greater than or equal to 3:1 and less than or equal to 1.5:1.

In an example, the heating element includes a first heating sub-element and a second heating sub-element, the first heating sub-element and the second heating sub-element each are provided with a plurality of through micropores that penetrate the ceramic substrate, and the through micropores on the first heating sub-element are in communication with the through micropores on the second heating sub-element.

The modules in the foregoing control apparatus of an electronic atomization device may be implemented entirely or partially by software, hardware, or a combination thereof. The foregoing modules may be built in or independent of a processing module of a computer device in a hardware form (that is, the control module 810 is equivalent to the processing module 120), or may be stored in a memory of the computer device in a software form, so that the processing module invokes and performs an operation corresponding to each of the foregoing modules.

In an example, a computer-readable storage medium is provided, storing a computer program, and when the computer program is executed by the processor, the steps of the foregoing control method of an electronic atomization device according to any example is performed.

For an execution process of each step in this example, refer to the foregoing example. Details are not described herein again.

A person of ordinary skill in the art may understand that all or some of procedures of the method in the foregoing examples may be implemented by a computer program instructing relevant hardware. The computer program may be stored in a non-volatile computer-readable storage medium. When the computer program is executed, the procedures of the foregoing method examples may be implemented. Any reference to a memory, a database, or another medium used in the examples provided in this disclosure may include at least one of a non-volatile memory and a volatile memory. The non-volatile memory may include a read-only memory (ROM), a magnetic tape, a floppy disk, a flash memory, an optical memory, a high-density embedded non-volatile memory, a resistance change random access memory (ReRAM), a magnetoresistive random access memory (MRAM), a ferroelectric random access memory (FRAM), a phase change memory (PCM), a grapheme memory, and the like. The volatile memory may include a random access memory (RAM), an external cache, or the like. For the purpose of description instead of limitation, the RAM is available in a plurality of forms, such as a static RAM (SRAM) or a dynamic RAM (DRAM). The database involved in the examples provided in this disclosure may include at least either of a relational database and a non-relational database. The non-relational database may include a blockchain-based distributed database, and is not limited thereto. The processing module involved in the examples provided in this disclosure may be a general processing module, a central processing module, a graphics processing module, a digital signal processing module, a programmable logic device, a quantum computing-based data processing logic device, and the like, and is not limited thereto.

Various technical features in the foregoing examples may be combined randomly. For a concise description, possible combinations of various technical features in the foregoing examples are not all described. However, the combinations of the technical features are to be considered as falling within the scope recorded in this specification provided that the combinations of the technical features do not conflict with each other.

The foregoing examples merely express several implementations of this disclosure. The descriptions thereof are relatively specific and detailed, but should not be understood as limitations to the scope of this disclosure. For a person of ordinary skill in the art, several transformations and improvements can be made without departing from the idea of this disclosure, and such transformations and improvements all fall within the protection scope of this disclosure. Therefore, the protection scope of this disclosure shall be subject to the protection scope of the appended claims.