Low-pressure ultraviolet radiator with multiple filaments
#7802 ✅ Patent 11,830,730 granted on 2023-11-28Layer forming method and apparatus
#7803 ✅ Patent 11,164,737 granted on 2021-11-02Integrated epitaxy and preclean system
#7804 ✅ Patent 10,692,714 granted on 2020-06-23Method for cleaning semiconductor wafer
#7805 ✅ Patent 10,861,698 granted on 2020-12-08Pattern fidelity enhancement
#7806 ✅ Patent 11,107,680 granted on 2021-08-31Mask assembly and method for fabricating a chip package
#7807 ✅ Patent 10,770,293 granted on 2020-09-08Method for manufacturing a semiconductor device
#7808METHODS FOR DEPOSITING A MOLYBDENUM METAL FILM ON A DIELECTRIC SURFACE OF A SUBSTRATE AND RELATED SEMICONDUCTOR DEVICE STRUCTURES
#7809 ✅ Patent 10,236,177 granted on 2019-03-19Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
#7810 ✅ Patent 10,811,254 granted on 2020-10-20Method for fabricating metal chalcogenide thin films
#7811 ✅ Patent 11,049,719 granted on 2021-06-29Epitaxy system integrated with high selectivity oxide removal and high temperature contaminant removal
#7812 ✅ Patent 10,553,428 granted on 2020-02-04Reflection mode photomask and fabrication method therefore
#7813SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
#7814 ✅ Patent 10,748,766 granted on 2020-08-18Workpiece processing method
#7815 ✅ Patent 10,566,195 granted on 2020-02-18Multiple patterning with variable space mandrel cuts
#7816 ✅ Patent 10,522,358 granted on 2019-12-31FinFET device and methods of forming same
#7817 ✅ Patent 10,535,525 granted on 2020-01-14Method for forming semiconductor device structure
#7818 ✅ Patent 10,475,654 granted on 2019-11-12Wrap-around contact plug and method manufacturing same
#7819METHODS FOR FILLING A GAP FEATURE ON A SUBSTRATE SURFACE AND RELATED SEMICONDUCTOR DEVICE STRUCTURES
#7820 ✅ Patent 10,811,264 granted on 2020-10-20Film-forming method and film-forming apparatus
#7821 ✅ Patent 11,056,344 granted on 2021-07-06Layer forming method
#7822 ✅ Patent 10,249,504 granted on 2019-04-02Etching and mechanical grinding film-layers stacked on a semiconductor substrate
#7823 ✅ Patent 10,896,822 granted on 2021-01-19Grinding apparatus
#7824 ✅ Patent 10,559,472 granted on 2020-02-11Workpiece processing method
#7825 ✅ Patent 10,395,937 granted on 2019-08-27Fin patterning for semiconductor devices
#7826 ✅ Patent 10,998,197 granted on 2021-05-04Polymer and composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process
#7827 ✅ Patent 10,861,705 granted on 2020-12-08Reduction of line wiggling
#7828 ✅ Patent 10,325,777 granted on 2019-06-18Utilizing multiple layers to increase spatial frequency
#7829 ✅ Patent 10,325,778 granted on 2019-06-18Utilizing multiple layers to increase spatial frequency
#7830 ✅ Patent 10,381,229 granted on 2019-08-13Three-dimensional memory device with straddling drain select electrode lines and method of making thereof
#7831 ✅ Patent 10,892,165 granted on 2021-01-12Semiconductor manufacturing device and method of polishing semiconductor substrate
#7832 ✅ Patent 10,497,577 granted on 2019-12-03Fin field-effect transistor device and method
#7833 ✅ Patent 10,607,851 granted on 2020-03-31Vapor-etch cyclic process
#7834 ✅ Patent 10,446,409 granted on 2019-10-15Method of manufacturing semiconductor device
#7835 ✅ Patent 11,043,391 granted on 2021-06-22Etching method and etching processing apparatus
#7836 ✅ Patent 10,672,622 granted on 2020-06-02Etching method and etching apparatus
#7837 ✅ Patent 10,418,254 granted on 2019-09-17Etching method and etching apparatus
#7838 ✅ Patent 11,728,179 granted on 2023-08-15Surface mount semiconductor device and method of manufacture
#7839HYBRID ADDITIVE STRUCTURE STACKABLE MEMORY DIE USING WIRE BOND
#7840 ✅ Patent 10,515,825 granted on 2019-12-24Semiconductor device and manufacturing method thereof
#7841 ✅ Patent 10,643,863 granted on 2020-05-05Semiconductor package and method of manufacturing the same
#7842 ✅ Patent 10,811,279 granted on 2020-10-20Flip-chip high speed components with underfill
#7843 ✅ Patent 10,593,568 granted on 2020-03-17Thrumold post package with reverse build up hybrid additive structure
#7844 ✅ Patent 10,276,404 granted on 2019-04-30Integrated fan-out package
#7845 ✅ Patent 10,622,236 granted on 2020-04-14Apparatus and method for handling wafer carrier doors
#7846SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
#7847 ✅ Patent 10,867,812 granted on 2020-12-15Semiconductor manufacturing system and control method
#7848 ✅ Patent 10,699,919 granted on 2020-06-30Coating processing apparatus and coating liquid collecting member
#7849 ✅ Patent 10,475,680 granted on 2019-11-12Wafer shipping box and a lower retaining member thereof
#7850 ✅ Patent 10,672,627 granted on 2020-06-02Substrate processing method and substrate processing apparatus
#7851 ✅ Patent 10,784,126 granted on 2020-09-22Substrate processing method and substrate processing apparatus
#7852 ✅ Patent 10,854,481 granted on 2020-12-01Substrate processing method and substrate processing apparatus
#7853 ✅ Patent 11,158,525 granted on 2021-10-26Substrate processing apparatus and substrate processing method
#7854RADIATIVE WAFER CUTTING USING SELECTIVE FOCUSING DEPTHS
#7855 ✅ Patent 10,403,520 granted on 2019-09-03Multi-blade and processing method of workpiece
#7856 ✅ Patent 10,679,874 granted on 2020-06-09Light irradiation type heat treatment apparatus and heat treatment method
#7857 ✅ Patent 10,242,891 granted on 2019-03-26Apparatus and method for securing components of an integrated circuit
#7858 ✅ Patent 10,410,891 granted on 2019-09-10Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
#7859 ✅ Patent 10,566,221 granted on 2020-02-18Apparatus for transferring substrate and apparatus for processing substrate including the same
#7860 ✅ Patent 10,978,322 granted on 2021-04-13Transfer device, substrate processing apparatus, and transfer method
#7861 ✅ Patent 10,475,677 granted on 2019-11-12Parallel test structure
#7862 ✅ Patent 10,714,364 granted on 2020-07-14Apparatus and method for inspecting wafer carriers
#7863 ✅ Patent 11,152,235 granted on 2021-10-19Apparatus and method for manufacture of semiconductor devices
#7864 ✅ Patent 10,622,232 granted on 2020-04-14Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same
#7865 ✅ Patent 10,699,926 granted on 2020-06-30Identifying nuisances and defects of interest in defects detected on a wafer
#7866RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
#7867SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
#7868 ✅ Patent 10,847,394 granted on 2020-11-24Wafer container with a seal
#7869 ✅ Patent 11,257,700 granted on 2022-02-22Separators for handling, transporting, or storing semiconductor wafers
#7870 ✅ Patent 10,510,571 granted on 2019-12-17Reticle transfer system and method
#7871 ✅ Patent 10,403,531 granted on 2019-09-03Semiconductor manufacturing apparatus with supporting columns and tables
#7872 ✅ Patent 10,854,489 granted on 2020-12-01Tower lift
#7873 ✅ Patent 10,522,378 granted on 2019-12-31Storage rack
#7874 ✅ Patent 10,770,330 granted on 2020-09-08Wafer contact surface protrusion profile with improved particle performance
#7875 ✅ Patent 11,114,327 granted on 2021-09-07ESC substrate support with chucking force control
#7876 ✅ Patent 10,570,515 granted on 2020-02-25Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
#7877 ✅ Patent 11,362,025 granted on 2022-06-14Tape carrier assemblies having an integrated adhesive film
#7878 ✅ Patent 10,269,612 granted on 2019-04-23Holding device having robot arms for supporting and clamping substrate
#7879 ✅ Patent 10,847,405 granted on 2020-11-24Method for manufacturing semiconductor device
#7880 ✅ Patent 10,283,395 granted on 2019-05-07Substrate gripping hand and substrate transfer apparatus
#7881 ✅ Patent 10,840,124 granted on 2020-11-17Vacuum adjustment device having a collet coupling
#7882 ✅ Patent 10,622,242 granted on 2020-04-14Substrate inverting device, substrate processing apparatus, and substrate supporting device, and substrate inverting method, substrate processing method, and substrate supporting method
#7883 ✅ Patent 10,535,550 granted on 2020-01-14Protection of low temperature isolation fill
#7884 ✅ Patent 10,586,700 granted on 2020-03-10Protection of low temperature isolation fill
#7885 ✅ Patent 11,239,109 granted on 2022-02-01Semiconductor memory having reduced interference between bit lines and word lines
#7886WAFER EDGE PROTECTION FOR CRACK-FREE MATERIAL GROWTH
#7887 ✅ Patent 10,811,302 granted on 2020-10-20Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
#7888 ✅ Patent 10,685,867 granted on 2020-06-16Method of semiconductor integrated circuit fabrication
#7889 ✅ Patent 10,763,155 granted on 2020-09-01Semiconductor constructions comprising dielectric material, and methods of forming dielectric fill within openings extending into semiconductor constructions
#7890 ✅ Patent 11,114,332 granted on 2021-09-07Semiconductor on insulator structure comprising a plasma nitride layer and method of manufacture thereof
#7891 ✅ Patent 10,276,428 granted on 2019-04-30Semiconductor package and method of fabricating semiconductor package
#7892 ✅ Patent 10,629,478 granted on 2020-04-21Dual-damascene formation with dielectric spacer and thin liner
#7893 ✅ Patent 10,685,870 granted on 2020-06-16Semiconductor device and method of manufacture
#7894 ✅ Patent 11,088,020 granted on 2021-08-10Structure and formation method of interconnection structure of semiconductor device
#7895 ✅ Patent 10,679,895 granted on 2020-06-09Interconnect structure and method of forming the same
#7896 ✅ Patent 11,328,951 granted on 2022-05-10Transistor cells including a deep via lined wit h a dielectric material
#7897 ✅ Patent 10,522,398 granted on 2019-12-31Modulating metal interconnect surface topography
#7898 ✅ Patent 10,553,481 granted on 2020-02-04Vias for cobalt-based interconnects and methods of fabrication thereof
#7899 ✅ Patent 11,295,980 granted on 2022-04-05Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
#7900LAYER FORMING METHOD
#7901 ✅ Patent 10,475,700 granted on 2019-11-12Etching to reduce line wiggling
#7902 ✅ Patent 10,515,850 granted on 2019-12-24Method and IC design with non-linear power rails
#7903 ✅ Patent 10,453,747 granted on 2019-10-22Double barrier layer sets for contacts in semiconductor device
#7904 ✅ Patent 10,685,880 granted on 2020-06-16Methods for reducing contact depth variation in semiconductor fabrication
#7905 ✅ Patent 10,804,148 granted on 2020-10-13Buried contact to provide reduced VFET feature-to-feature tolerance requirements
#7906 ✅ Patent 10,796,957 granted on 2020-10-06Buried contact to provide reduced VFET feature-to-feature tolerance requirements
#7907 ✅ Patent 10,510,602 granted on 2019-12-17Methods of producing self-aligned vias
#7908 ✅ Patent 10,573,555 granted on 2020-02-25Methods of producing self-aligned grown via
#7909 ✅ Patent 10,510,603 granted on 2019-12-17Conductive vias in semiconductor packages and methods of forming same
#7910 ✅ Patent 10,651,087 granted on 2020-05-12Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#7911 ✅ Patent 10,607,887 granted on 2020-03-31Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#7912 ✅ Patent 10,784,162 granted on 2020-09-22Method of making a semiconductor component having through-silicon vias
#7913 ✅ Patent 10,665,508 granted on 2020-05-26Cutting apparatus and groove detecting method
#79143D SEMICONDUCTOR DEVICE AND SYSTEM
#79153D SEMICONDUCTOR DEVICE AND SYSTEM
#7916 ✅ Patent 10,522,409 granted on 2019-12-31Fin field effect transistor (FinFET) device structure with dummy fin structure and method for forming the same
#7917 ✅ Patent 10,651,090 granted on 2020-05-12Fin critical dimension loading optimization
#7918 ✅ Patent 10,699,956 granted on 2020-06-30Method of manufacturing a semiconductor device and a semiconductor device
#7919 ✅ Patent 11,069,575 granted on 2021-07-20Semiconductor device and manufacture thereof
#7920GATE CUT METHOD FOR REPLACEMENT METAL GATE
#7921 ✅ Patent 10,276,445 granted on 2019-04-30Leakage reduction methods and structures thereof
#7922 ✅ Patent 10,497,626 granted on 2019-12-03Structure and method for metal gates with roughened barrier layer
#7923 ✅ Patent 10,446,448 granted on 2019-10-15Semiconductor device and method for fabricating the same
#7924 ✅ Patent 10,354,924 granted on 2019-07-16Semiconductor memory device and method of manufacturing the same
#7925 ✅ Patent 10,943,830 granted on 2021-03-09Self-aligned structure for semiconductor devices
#7926 ✅ Patent 10,290,548 granted on 2019-05-14Semiconductor device structure with semiconductor wire
#7927 ✅ Patent 10,297,508 granted on 2019-05-21Semiconductor device and method
#7928 ✅ Patent 10,679,905 granted on 2020-06-09Semiconductor structures and fabrication methods thereof
#7929 ✅ Patent 10,699,963 granted on 2020-06-30Structure and formation method of semiconductor device structure with isolation feature
#7930 ✅ Patent 10,403,550 granted on 2019-09-03Method of manufacturing a semiconductor device and a semiconductor device
#7931 ✅ Patent 10,453,753 granted on 2019-10-22Using a metal-containing layer as an etching stop layer and to pattern source/drain regions of a FinFET
#7932 ✅ Patent 10,692,731 granted on 2020-06-23Semiconductor structure and fabrication method with precise patterning thereof
#7933 ✅ Patent 10,236,220 granted on 2019-03-19Fin field-effect transistor device and method
#7934 ✅ Patent 10,504,797 granted on 2019-12-10Method for forming semiconductor device and resulting device
#7935 ✅ Patent 10,490,459 granted on 2019-11-26Method for source/drain contact formation in semiconductor devices
#7936 ✅ Patent 10,522,423 granted on 2019-12-31Interconnect structure for fin-like field effect transistor
#7937 ✅ Patent 10,361,134 granted on 2019-07-23Method for lithographic process and lithographic system
#7938 ✅ Patent 10,262,909 granted on 2019-04-16Semiconductor device and method for manufacturing the same
#7939 ✅ Patent 10,504,805 granted on 2019-12-10Method of examining defects in a semiconductor specimen and system thereof
#7940 ✅ Patent 10,600,699 granted on 2020-03-24Apparatus for inspection of a package assembly with a thermal solution
#7941 ✅ Patent 10,553,510 granted on 2020-02-04Stacked semiconductor apparatus being electrically connected through through-via and monitoring method
#7942 ✅ Patent 10,580,710 granted on 2020-03-03Semiconductor device with a protection mechanism and associated systems, devices, and methods
#7943 ✅ Patent 10,692,788 granted on 2020-06-23Device to decrease flicker noise in conductor-insulator-semiconductor (CIS) devices
#7944 ✅ Patent 10,622,270 granted on 2020-04-14Integrated circuit package with stress directing material
#7945 ✅ Patent 10,304,750 granted on 2019-05-28Package structure and its fabrication method
#7946 ✅ Patent 10,490,472 granted on 2019-11-26Air cavity mold
#7947 ✅ Patent 10,269,672 granted on 2019-04-23Semiconductor package device and method of manufacturing the same
#7948 ✅ Patent 10,559,510 granted on 2020-02-11Molded wafer level packaging
#7949 ✅ Patent 11,075,132 granted on 2021-07-27Integrated fan-out package, package-on-package structure, and manufacturing method thereof
#7950SEMICONDUCTOR DEVICE
#7951 ✅ Patent 10,699,981 granted on 2020-06-30Non-vertical through-via in package
#7952 ✅ Patent 10,600,707 granted on 2020-03-24Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment
#7953 ✅ Patent 10,490,474 granted on 2019-11-26Die-on-interposer assembly with dam structure and method of manufacturing the same
#7954 ✅ Patent 10,665,521 granted on 2020-05-26Planar passivation layers
#7955 ✅ Patent 10,510,637 granted on 2019-12-17Devices and methods for heat dissipation of semiconductor integrated circuits
#7956 ✅ Patent 10,354,937 granted on 2019-07-16Three-dimensional packaging structure and packaging method of power devices
#7957 ✅ Patent 10,431,517 granted on 2019-10-01Arrangement and thermal management of 3D stacked dies
#7958 ✅ Patent 11,062,970 granted on 2021-07-13Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
#7959 ✅ Patent 10,461,010 granted on 2019-10-29Power module, power semiconductor device and power module manufacturing method
#7960 ✅ Patent 10,446,463 granted on 2019-10-15Semiconductor structures and fabrication methods thereof
#7961 ✅ Patent 10,573,575 granted on 2020-02-25Semiconductor package with thermal fins
#7962 ✅ Patent 10,461,014 granted on 2019-10-29Heat spreading device and method
#7963MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
#7964 ✅ Patent 10,825,751 granted on 2020-11-03Semiconductor device
#7965 ✅ Patent 10,403,558 granted on 2019-09-03Power module with multi-layer substrate
#7966 ✅ Patent 10,748,836 granted on 2020-08-18Semiconductor laser module and method for manufacturing the same
#7967 ✅ Patent 10,217,693 granted on 2019-02-26Methods and systems for high voltage component cooling in electric vehicle for fast charge
#7968 ✅ Patent 10,332,821 granted on 2019-06-25Partially molded direct chip attach package structures for connectivity module solutions
#7969 ✅ Patent 10,535,585 granted on 2020-01-14Integrated passive device and fabrication method using a last through-substrate via
#7970 ✅ Patent 10,741,478 granted on 2020-08-11Power module and method of manufacturing the same, and power electronic apparatus and method of manufacturing the same
#7971 ✅ Patent 10,629,517 granted on 2020-04-21Semiconductor device and fabrication method thereof
#7972 ✅ Patent 10,720,378 granted on 2020-07-21Component structure, power module and power module assembly structure
#7973 ✅ Patent 10,777,498 granted on 2020-09-15Chip on film package with reinforcing sheet
#7974 ✅ Patent 10,861,773 granted on 2020-12-08Semiconductor package and manufacturing method thereof
#7975 ✅ Patent 10,971,433 granted on 2021-04-06Surface mounted type leadframe and photoelectric device with multi-chips
#7976 ✅ Patent 10,943,855 granted on 2021-03-09Electronic device packaging with galvanic isolation
#7977 ✅ Patent 10,242,935 granted on 2019-03-26Packaged semiconductor device and method for forming
#7978TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
#7979 ✅ Patent 10,319,669 granted on 2019-06-11Packaged fast inverse diode component for PFC applications
#7980 ✅ Patent 10,396,019 granted on 2019-08-27Molded intelligent power module and method of making the same
#7981VOID REDUCTION IN SOLDER JOINTS USING OFF-EUTECTIC SOLDER
#7982 ✅ Patent 10,217,701 granted on 2019-02-26Semiconductor device
#7983FINE PITCH AND SPACING INTERCONNECTS WITH RESERVE INTERCONNECT PORTION
#7984 ✅ Patent 10,998,259 granted on 2021-05-04Semiconductor device and method of manufacture
#7985 ✅ Patent 10,811,349 granted on 2020-10-20Electronic device including at least one electronic chip and electronic package
#7986 ✅ Patent 10,867,899 granted on 2020-12-15Semiconductor packages
#7987 ✅ Patent 10,685,914 granted on 2020-06-16Semiconductor device and manufacturing method thereof
#7988 ✅ Patent 10,872,858 granted on 2020-12-22Semiconductor memory device
#7989 ✅ Patent 10,446,489 granted on 2019-10-15Interconnect structure
#7990 ✅ Patent 10,727,177 granted on 2020-07-28Semiconductor device and layout design thereof
#7991 ✅ Patent 10,373,904 granted on 2019-08-06Semiconductor devices including capacitors, related electronic systems, and related methods
#7992 ✅ Patent 10,714,421 granted on 2020-07-14Structure and formation method of semiconductor device with self-aligned conductive features
#7993 ✅ Patent 10,923,416 granted on 2021-02-16Interconnect structure with insulation layer and method of forming the same
#7994 ✅ Patent 10,410,965 granted on 2019-09-10Layout technique for middle-end-of-line
#7995 ✅ Patent 10,262,938 granted on 2019-04-16Semiconductor structure having conductive layer overlapping field oxide
#7996 ✅ Patent 10,461,029 granted on 2019-10-29Hybrid material electrically programmable fuse and methods of forming
#7997 ✅ Patent 10,361,158 granted on 2019-07-23Integrated assemblies having structures along a first pitch coupled with structures along a second pitch different from the first pitch
#7998 ✅ Patent 10,381,305 granted on 2019-08-13Integrated assemblies having structures along a first pitch coupled with structures along a second pitch different from the first pitch, and methods of forming integrated assemblies
#7999 ✅ Patent 10,515,896 granted on 2019-12-24Interconnect structure for semiconductor device and methods of fabrication thereof
#8000 ✅ Patent 10,388,606 granted on 2019-08-20Integrated assemblies having structures along a first pitch coupled with structures along a second pitch different from the first pitch, and methods of forming integrated assemblies
#8001 ✅ Patent 10,679,941 granted on 2020-06-09Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#8002 ✅ Patent 10,777,504 granted on 2020-09-15Interconnect structure for semiconductor device and methods of fabrication thereof
#8003 ✅ Patent 10,985,105 granted on 2021-04-20Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements
#8004WIRING BOARD AND ELECTRONIC DEVICE
#8005 ✅ Patent 10,566,288 granted on 2020-02-18Structure for standard logic performance improvement having a back-side through-substrate-via
#8006 ✅ Patent 10,847,463 granted on 2020-11-24Seed layers for copper interconnects
#8007 ✅ Patent 10,381,308 granted on 2019-08-13Electrically conductive laminate structures
#8008 ✅ Patent 10,204,867 granted on 2019-02-12Semiconductor metrology target and manufacturing method thereof
#8009 ✅ Patent 10,566,290 granted on 2020-02-18Alignment mark and measurement method thereof
#8010 ✅ Patent 10,410,971 granted on 2019-09-10Thermal and electromagnetic interference shielding for die embedded in package substrate
#8011 ✅ Patent 10,446,502 granted on 2019-10-15Apparatuses and methods for shielded memory architecture
#8012 ✅ Patent 10,453,802 granted on 2019-10-22Semiconductor package structure, semiconductor device and method for manufacturing the same
#8013CIRCUIT BOARD AND CHIP PACKAGE
#8014 ✅ Patent 10,304,782 granted on 2019-05-28Compressive interlayer having a defined crack-stop edge extension
#8015 ✅ Patent 10,546,822 granted on 2020-01-28Seal ring structure of integrated circuit and method of forming same
#8016 ✅ Patent 10,424,547 granted on 2019-09-24Semiconductor device package and a method of manufacturing the same
#8017 ✅ Patent 10,529,672 granted on 2020-01-07Package with interlocking leads and manufacturing the same
#8018 ✅ Patent 10,546,823 granted on 2020-01-28Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon material
#8019 ✅ Patent 10,262,953 granted on 2019-04-16Semiconductor device
#8020 ✅ Patent 10,424,549 granted on 2019-09-24Trench structure and method
#8021 ✅ Patent 10,446,507 granted on 2019-10-15Semiconductor devices and semiconductor dice including electrically conductive interconnects between die rings
#8022 ✅ Patent 10,236,263 granted on 2019-03-19Methods and structures for mitigating ESD during wafer bonding
#8023 ✅ Patent 10,700,020 granted on 2020-06-30Thin film transistor substrate and display device
#8024 ✅ Patent 10,685,924 granted on 2020-06-16Antenna-on-package arrangements
#8025 ✅ Patent 10,879,197 granted on 2020-12-29Package structure and method of fabricating package structure
#8026 ✅ Patent 10,734,332 granted on 2020-08-04High aspect ratio interconnects in air gap of antenna package
#8027 ✅ Patent 10,475,755 granted on 2019-11-12Semiconductor structure
#8028 ✅ Patent 10,692,824 granted on 2020-06-23Radar module with wafer level package and underfill
#8029 ✅ Patent 10,340,238 granted on 2019-07-02Wiring substrate and semiconductor device
#8030SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8031 ✅ Patent 10,636,757 granted on 2020-04-28Integrated circuit component package and method of fabricating the same
#8032 ✅ Patent 10,685,929 granted on 2020-06-16Fan-out semiconductor package
#8033 ✅ Patent 10,833,032 granted on 2020-11-10Semiconductor device
#8034 ✅ Patent 10,797,012 granted on 2020-10-06Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices
#8035 ✅ Patent 10,818,627 granted on 2020-10-27Electronic component including a conductive pillar and method of manufacturing the same
#8036 ✅ Patent 10,340,242 granted on 2019-07-02Semiconductor device and method of manufacturing the same
#8037Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects
#8038 ✅ Patent 10,325,874 granted on 2019-06-18Device module having a plurality of dies electrically connected by posts
#8039ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
#8040 ✅ Patent 10,636,761 granted on 2020-04-28Method of fabricating a semiconductor package
#8041 ✅ Patent 10,727,196 granted on 2020-07-28Chip packaging structure and packaging method
#8042 ✅ Patent 10,461,058 granted on 2019-10-29Method and apparatus for manufacturing electronic device using device chip
#8043 ✅ Patent 10,700,038 granted on 2020-06-30Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool
#8044 ✅ Patent 10,553,555 granted on 2020-02-04Non-porous copper to copper interconnect
#8045 ✅ Patent 10,622,330 granted on 2020-04-14Flexible display panel and preparation method thereof, flexible display device
#8046 ✅ Patent 11,075,187 granted on 2021-07-27Semiconductor device and method of forming insulating layers around semiconductor die
#8047 ✅ Patent 10,483,232 granted on 2019-11-19Method for fabricating bump structures on chips with panel type process
#8048 ✅ Patent 10,811,383 granted on 2020-10-20Apparatus and method for manufacturing plurality of electronic circuits
#8049 ✅ Patent 10,510,718 granted on 2019-12-17Semiconductor structure and manufacturing method thereof
#8050 ✅ Patent 10,748,872 granted on 2020-08-18Integrated semiconductor assemblies and methods of manufacturing the same
#8051SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#8052 ✅ Patent 10,304,805 granted on 2019-05-28Dual sided fan-out package having low warpage across all temperatures
#8053SEMICONDUCTOR DEVICE HAVING LATERALLY OFFSET STACKED SEMICONDUCTOR DIES
#8054 ✅ Patent 10,290,610 granted on 2019-05-14PoP device and method of forming the same
#8055 ✅ Patent 10,510,726 granted on 2019-12-17Semiconductor device, method for manufacturing semiconductor device, and method for manufacturing semiconductor package
#8056 ✅ Patent 10,361,174 granted on 2019-07-23Electronic device
#8057 ✅ Patent 10,304,809 granted on 2019-05-28Methods and systems for improving power delivery and signaling in stacked semiconductor devices
#8058 ✅ Patent 10,446,527 granted on 2019-10-15Stacked semiconductor dies including inductors and associated methods
#8059 ✅ Patent 10,373,936 granted on 2019-08-06Pixel elements including light emitters of variable heights
#8060 ✅ Patent 10,622,338 granted on 2020-04-14Light-emitting element package and display device having same
#8061 ✅ Patent 10,804,249 granted on 2020-10-13Light-emitting device with light-reflective and light-absorbing pieces layered on a surface
#8062 ✅ Patent 10,497,683 granted on 2019-12-03Light-emitting diode (LED) device
#8063 ✅ Patent 10,361,177 granted on 2019-07-23Semiconductor package having a molding layer including a molding cavity and method of fabricating the same
#8064 ✅ Patent 10,714,461 granted on 2020-07-14Electronic unit
#8065SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#8066 ✅ Patent 10,861,840 granted on 2020-12-08Integrated passive component and method for manufacturing the same
#8067 ✅ Patent 10,497,692 granted on 2019-12-03SRAM structure with alternate gate pitches
#8068 ✅ Patent 10,475,780 granted on 2019-11-12Level shifter spare cell
#8069 ✅ Patent 10,964,683 granted on 2021-03-30Memory array circuit and method of manufacturing the same
#8070 ✅ Patent 10,629,582 granted on 2020-04-21Semiconductor device and method for manufacturing the same
#8071 ✅ Patent 10,658,351 granted on 2020-05-19Electronic device including a transistor having structures with different characteristics
#8072 ✅ Patent 10,714,465 granted on 2020-07-14Motor drive circuit, semiconductor apparatus, and electronic device
#8073 ✅ Patent 10,396,064 granted on 2019-08-27Layout pattern for SRAM and manufacturing methods thereof
#8074 ✅ Patent 10,535,648 granted on 2020-01-14TVS semiconductor device and method therefor
#8075 ✅ Patent 10,396,066 granted on 2019-08-27Electro-static discharge transistor array apparatus
#8076 ✅ Patent 10,679,982 granted on 2020-06-09Circuit-protection devices
#8077 ✅ Patent 10,930,643 granted on 2021-02-23Filter circuit based on a MOS field effect transistor and chip including the same
#8078 ✅ Patent 10,916,539 granted on 2021-02-09Semiconductor device having a transistor portion that includes an output resistive portion
#8079 ✅ Patent 10,879,233 granted on 2020-12-29Process for fabricating capacitive elements in trenches
#8080 ✅ Patent 11,069,678 granted on 2021-07-20Logic gate cell structure
#8081 ✅ Patent 10,510,751 granted on 2019-12-17FinFET isolation structure and method for fabricating the same
#8082 ✅ Patent 10,535,654 granted on 2020-01-14Cut metal gate with slanted sidewalls
#8083 ✅ Patent 10,811,408 granted on 2020-10-20Semiconductor device including a gate insulation pattern and a gate electrode pattern
#8084 ✅ Patent 10,741,400 granted on 2020-08-11Gate replacement structures in semiconductor devices
#8085 ✅ Patent 10,381,349 granted on 2019-08-13Stacked complementary junction FETs for analog electronic circuits
#8086 ✅ Patent 10,366,992 granted on 2019-07-30Semiconductor device including transistors sharing gates
#8087 ✅ Patent 10,553,583 granted on 2020-02-04Boundary region for high-k-metal-gate(HKMG) integration technology
#8088 ✅ Patent 10,504,898 granted on 2019-12-10Fin field-effect transistor structure and method for forming the same
#8089 ✅ Patent 10,269,803 granted on 2019-04-23Hybrid scheme for improved performance for P-type and N-type FinFETs
#8090 ✅ Patent 10,304,834 granted on 2019-05-28Semiconductor devices and method of fabricating the same
#8091 ✅ Patent 10,811,414 granted on 2020-10-20Semiconductor structure and fabrication method thereof
#8092 ✅ Patent 10,847,514 granted on 2020-11-24Semiconductor device with fin field effect transistors
#8093 ✅ Patent 10,872,894 granted on 2020-12-22Memory circuitry having a pair of immediately-adjacent memory arrays having space laterally-there-between that has a conductive interconnect in the space
#8094 ✅ Patent 10,644,001 granted on 2020-05-05Semiconductor memory device having an electrically floating body transistor
#8095 ✅ Patent 10,446,555 granted on 2019-10-15Buried metal track and methods forming same
#8096 ✅ Patent 10,818,669 granted on 2020-10-27Integrated circuit with vertically structured capacitive element, and its fabricating process
#8097 ✅ Patent 10,475,795 granted on 2019-11-12Insulating structure and method of forming the same
#8098 ✅ Patent 10,217,750 granted on 2019-02-26Buried word line structure and method of making the same
#8099 ✅ Patent 10,644,008 granted on 2020-05-05Semiconductor device
#8100 ✅ Patent 10,411,017 granted on 2019-09-10Multi-component conductive structures for semiconductor devices