Multilayer ceramic capacitor including external electrode having tin-plated layers alternately stacked with nickel-plated layer(s)
#6002 ✅ Patent 11,410,816 granted on 2022-08-09Multilayer ceramic electronic component including metal terminals connected to outer electrodes
#6003 ✅ Patent 10,910,163 granted on 2021-02-02Multilayer electronic component and board having the same mounted thereon
#6004 ✅ Patent 11,532,436 granted on 2022-12-20Multilayer ceramic electronic component including outer electrodes connected to metal terminals
#6005 ✅ Patent 11,651,902 granted on 2023-05-16Patterning of thin film capacitors in organic substrate packages
#6006 ✅ Patent 11,527,364 granted on 2022-12-13Multilayer ceramic electronic component including a plurality of bodies and metal terminals connected to outer electrodes
#6007 ✅ Patent 10,903,016 granted on 2021-01-26Voltage tunable multilayer capacitor
#6008 ✅ Patent 11,062,852 granted on 2021-07-13Solid electrolytic capacitor having an anode terminal and a cathode terminal formed from a single metal plate and method for manufacturing same
#6009ELECTRICITY STORAGE DEVICE AND METHOD FOR MANUFACTURING SOLID ELECTROLYTE LAYER
#6010 ✅ Patent 10,790,095 granted on 2020-09-29Electrolytic capacitor
#6011 ✅ Patent 11,222,753 granted on 2022-01-11Electrode, electrolytic capacitor, and method for manufacturing those
#6012 ✅ Patent 11,195,666 granted on 2021-12-07Electrically insulating continuous film for an aluminum electrolytic capacitor
#6013 ✅ Patent 11,127,538 granted on 2021-09-21Multi-cell multi-layer high voltage supercapacitor apparatus including graphene electrodes
#6014 ✅ Patent 10,854,394 granted on 2020-12-01Stretchable capacitor electrode-conductor structure
#6015 ✅ Patent 10,784,053 granted on 2020-09-22Graphene supercapacitor design and manufacture
#6016 ✅ Patent 11,087,933 granted on 2021-08-10Safety switch
#6017 ✅ Patent 10,741,341 granted on 2020-08-11Method of controlling an appliance door position switch for sabbath mode operation
#6018REDUNDANT, PRIORITY-BASED, ROBUST GEAR SHIFTER
#6019 ✅ Patent 10,707,030 granted on 2020-07-07Switch
#6020 ✅ Patent 10,930,448 granted on 2021-02-23Push-button switch member
#6021 ✅ Patent 12,010,799 granted on 2024-06-11Electronic switch module with oppositely-arranged power switches and discrete heat sinks
#6022 ✅ Patent 10,622,175 granted on 2020-04-14In-line motorized double break disconnect switch
#6023 ✅ Patent 10,818,457 granted on 2020-10-27Wall-mounted smart switches and outlets for use in building wiring for load control, home automation, and/or security purposes
#6024Switch Self-Actuation Mitigation Using A Tracking Signal
#6025 ✅ Patent 11,227,736 granted on 2022-01-18Electromagnetic device and electromagnetic relay equipped with electromagnetic device
#6026 ✅ Patent 11,276,539 granted on 2022-03-15Electromagnetic device and electromagnetic relay equipped with electromagnetic device
#6027 ✅ Patent 11,195,681 granted on 2021-12-07Circuit breaker with addable tripped indicator
#6028Method, System, and Apparatus to Prevent Electrical or Thermal Based Hazards in Conduits
#6029 ✅ Patent 11,270,860 granted on 2022-03-08Self-supported actuation device for an electromechanical switch
#6030 ✅ Patent 11,145,480 granted on 2021-10-12Fuse device
#6031 ✅ Patent 10,796,877 granted on 2020-10-06Charged particle beam image acquisition apparatus
#6032 ✅ Patent 10,872,742 granted on 2020-12-22Charged particle beam device
#6033 ✅ Patent 11,087,956 granted on 2021-08-10Detection systems in semiconductor metrology tools
#6034CHARACTERIZATION OF REGIONS WITH DIFFERENT CRYSTALLINITY IN MATERIALS
#6035 ✅ Patent 10,714,310 granted on 2020-07-14Methods and apparatus for high throughput SEM and AFM for characterization of nanostructured surfaces
#6036 ✅ Patent 10,790,153 granted on 2020-09-29Methods and apparatus for electron beam etching process
#6037 ✅ Patent 11,127,565 granted on 2021-09-21Electron-beam lithography process adapted for a sample comprising at least one fragile nanostructure
#6038 ✅ Patent 10,796,883 granted on 2020-10-06Discrete capacitance switching circuit and capacitor array circuit including the same
#6039 ✅ Patent 10,607,815 granted on 2020-03-31Methods and apparatuses for plasma chamber matching and fault identification
#6040DRY ETCHING DEVICE AND ELECTRODE THEREOF
#6041ELECTRODE UNIT HAVING AN INTERNAL ELECTRICAL NETWORK FOR SUPPLYING HIGH-FREQUENCY VOLTAGE, AND CARRIER ARRANGEMENT FOR A PLASMA TREATMENT SYSTEM
#6042 ✅ Patent 11,037,770 granted on 2021-06-15Differential coating of high aspect ratio objects through methods of reduced flow and dosing variations
#6043 ✅ Patent 10,663,428 granted on 2020-05-26Systems and methods for ion separation using IMS-MS with multiple ion exits
#6044ION INLET ASSEMBLY
#6045 ✅ Patent 11,373,850 granted on 2022-06-28Ion guide
#6046 ✅ Patent 11,177,123 granted on 2021-11-16Compound semiconductor laminate substrate, method for manufacturing same, and semiconductor element
#6047 ✅ Patent 11,361,959 granted on 2022-06-14Method for manufacturing wafer
#6048 ✅ Patent 11,442,364 granted on 2022-09-13Materials and methods for forming resist bottom layer
#6049 ✅ Patent 11,094,539 granted on 2021-08-17Method for manufacturing nitride semiconductor substrate and nitride semiconductor substrate
#6050 ✅ Patent 10,854,442 granted on 2020-12-01Orientation chamber of substrate processing system with purging function
#6051 ✅ Patent 11,450,528 granted on 2022-09-20Process for growing nanowires or nanopyramids on graphitic substrates
#6052 ✅ Patent 11,282,697 granted on 2022-03-22Integrate rinse module in hybrid bonding platform
#6053 ✅ Patent 10,879,595 granted on 2020-12-29Tools and methods for producing nanoantenna electronic devices
#6054SUPPORT ASSEMBLY
#6055 ✅ Patent 10,755,917 granted on 2020-08-25Treatment for adhesion improvement
#6056 ✅ Patent 11,289,328 granted on 2022-03-29Deposition and etch processes of chromium-containing thin films for semiconductor manufacturing
#6057 ✅ Patent 10,790,138 granted on 2020-09-29Method and system for selectively forming film
#6058 ✅ Patent 10,804,097 granted on 2020-10-13Conductive feature formation and structure
#6059 ✅ Patent 11,062,901 granted on 2021-07-13Low-k dielectric and processes for forming same
#6060 ✅ Patent 11,069,526 granted on 2021-07-20Using a self-assembly layer to facilitate selective formation of an etching stop layer
#6061 ✅ Patent 11,342,177 granted on 2022-05-24Treatment to control deposition rate
#6062 ✅ Patent 10,950,434 granted on 2021-03-16Methods of reducing gate spacer loss during semiconductor manufacturing
#6063 ✅ Patent 11,037,781 granted on 2021-06-15Device and method for high pressure anneal
#6064 ✅ Patent 10,957,532 granted on 2021-03-23Method and apparatus for deposition of low-k films
#6065 ✅ Patent 11,355,339 granted on 2022-06-07Forming nitrogen-containing layers as oxidation blocking layers
#6066 ✅ Patent 11,031,238 granted on 2021-06-08Silicon carbide stacked substrate and manufacturing method thereof
#6067 ✅ Patent 11,031,239 granted on 2021-06-08Germanium nanosheets and methods of forming the same
#6068 ✅ Patent 12,040,183 granted on 2024-07-16Glass-based article with engineered stress distribution and method of making same
#6069 ✅ Patent 11,508,577 granted on 2022-11-22Channel layer formation for III-V metal-oxide-semiconductor field effect transistors (MOSFETs)
#6070 ✅ Patent 10,903,076 granted on 2021-01-26Material selective regrowth structure and method
#6071THIN FILM STRUCTURE
#6072 ✅ Patent 11,373,866 granted on 2022-06-28Dielectric material and methods of forming same
#6073 ✅ Patent 10,643,846 granted on 2020-05-05Selective growth of metal-containing hardmask thin films
#6074 ✅ Patent 11,124,889 granted on 2021-09-21Methods for fabricating and etching porous silicon carbide structures
#6075 ✅ Patent 11,081,356 granted on 2021-08-03Method for metal gate cut and structure thereof
#6076 ✅ Patent 10,672,621 granted on 2020-06-02Pattern forming material, pattern forming method, and method for manufacturing semiconductor device
#6077 ✅ Patent 10,964,548 granted on 2021-03-30Fin field-effect transistor device and method
#6078 ✅ Patent 10,790,155 granted on 2020-09-29Method of manufacturing semiconductor devices
#6079 ✅ Patent 10,872,779 granted on 2020-12-22Plasma etching method and plasma etching apparatus
#6080 ✅ Patent 10,847,376 granted on 2020-11-24In-situ deposition and etch process and apparatus for precision patterning of semiconductor devices
#6081 ✅ Patent 10,937,662 granted on 2021-03-02Method of isotropic etching of silicon oxide utilizing fluorocarbon chemistry
#6082 ✅ Patent 10,867,804 granted on 2020-12-15Patterning method for semiconductor device and structures resulting therefrom
#6083 ✅ Patent 10,867,805 granted on 2020-12-15Selective removal of an etching stop layer for improving overlay shift tolerance
#6084 ✅ Patent 11,302,535 granted on 2022-04-12Performing annealing process to improve fin quality of a FinFET semiconductor
#6085 ✅ Patent 11,094,556 granted on 2021-08-17Method of manufacturing semiconductor devices using directional process
#6086 ✅ Patent 10,861,710 granted on 2020-12-08Methods of manufacturing semiconductor devices
#6087 ✅ Patent 10,825,694 granted on 2020-11-03Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection
#6088 ✅ Patent 10,777,430 granted on 2020-09-15Photonic integrated package and method forming same
#6089 ✅ Patent 10,825,696 granted on 2020-11-03Cross-wafer RDLs in constructed wafers
#6090 ✅ Patent 11,676,837 granted on 2023-06-13Substrate holder
#6091 ✅ Patent 11,887,867 granted on 2024-01-30Vacuum arrangement and method
#6092 ✅ Patent 11,373,883 granted on 2022-06-28Substrate processing apparatus, substrate processing system and substrate processing method
#6093 ✅ Patent 12,074,041 granted on 2024-08-27Wet bench structure
#6094 ✅ Patent 11,869,781 granted on 2024-01-09Substrate processing apparatus and substrate processing method
#6095 ✅ Patent 11,631,597 granted on 2023-04-18Holding apparatus
#6096 ✅ Patent 10,950,474 granted on 2021-03-16Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
#6097 ✅ Patent 10,784,128 granted on 2020-09-22Apparatus and method for securing components of an integrated circuit
#6098 ✅ Patent 10,679,877 granted on 2020-06-09Carrier tape system and methods of using carrier tape system
#6099 ✅ Patent 11,587,804 granted on 2023-02-21Component mounting system
#6100SELF-AWARE AND CORRECTING HETEROGENOUS PLATFORM INCORPORATING INTEGRATED SEMICONDUCTOR PROCESSING MODULES AND METHOD FOR USING SAME
#6101 ✅ Patent 10,943,804 granted on 2021-03-09Monitoring of process chamber
#6102 ✅ Patent 10,964,566 granted on 2021-03-30Machine learning on overlay virtual metrology
#6103 ✅ Patent 11,232,962 granted on 2022-01-25Alignment device, semiconductor wafer processing device, and alignment method
#6104 ✅ Patent 11,282,728 granted on 2022-03-22Contamination control in semiconductor manufacturing systems
#6105 ✅ Patent 10,964,569 granted on 2021-03-30Semiconductor die carrier structure
#6106 ✅ Patent 11,011,402 granted on 2021-05-18Transport system of semiconductor fabrication facility, associated movable container and method
#6107 ✅ Patent 11,443,969 granted on 2022-09-13Automated substrate holder loading device
#6108 ✅ Patent 10,998,215 granted on 2021-05-04Monitoring dry-etching of polymer layer for transferring semiconductor devices
#6109 ✅ Patent 11,521,884 granted on 2022-12-06Electrostatic chuck sidewall gas curtain
#6110 ✅ Patent 11,049,759 granted on 2021-06-29Micro LED transfer head
#6111 ✅ Patent 10,504,768 granted on 2019-12-10Contact structures to deep trench isolation structures and method of nanufacturing the same
#6112 ✅ Patent 11,309,210 granted on 2022-04-19Self aligned buried power rail
#6113 ✅ Patent 10,790,185 granted on 2020-09-29Methods of sealing openings, and methods of forming integrated assemblies
#6114 ✅ Patent 10,636,695 granted on 2020-04-28Negatively sloped isolation structures
#6115 ✅ Patent 10,665,499 granted on 2020-05-26Integrated circuit with airgaps to control capacitance
#6116 ✅ Patent 11,075,113 granted on 2021-07-27Metal capping layer and methods thereof
#6117 ✅ Patent 11,101,165 granted on 2021-08-24Method for fabricating semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate
#6118 ✅ Patent 11,171,035 granted on 2021-11-09Selective etches for reducing cone formation in shallow trench isolations
#6119 ✅ Patent 11,201,081 granted on 2021-12-14Method for separating thin layers of solid material from a solid body
#6120 ✅ Patent 11,398,405 granted on 2022-07-26Method and apparatus for back end of line semiconductor device processing
#6121 ✅ Patent 11,004,729 granted on 2021-05-11Method of manufacturing semiconductor devices
#6122INTEGRATED CIRCUITS (ICS) MADE USING EXTREME ULTRAVIOLET (EUV) PATTERNING AND METHODS FOR FABRICATING SUCH ICS
#6123 ✅ Patent 10,840,131 granted on 2020-11-17Patterning methods for semiconductor devices and structures resulting therefrom
#6124 ✅ Patent 10,796,948 granted on 2020-10-06Pattern forming method and imprint apparatus
#6125 ✅ Patent 11,121,028 granted on 2021-09-14Semiconductor devices formed using multiple planarization processes
#6126 ✅ Patent 11,749,563 granted on 2023-09-05Interlayer dielectric layer
#6127 ✅ Patent 11,018,053 granted on 2021-05-25Semiconductor structure with material modification and low resistance plug
#6128 ✅ Patent 11,004,733 granted on 2021-05-11Protection structures for bonded wafers
#6129 ✅ Patent 10,923,392 granted on 2021-02-16Interconnect structure and method of forming the same
#6130 ✅ Patent 10,796,954 granted on 2020-10-06Semiconductor structure and method for forming the same
#6131 ✅ Patent 10,818,545 granted on 2020-10-27Contact via structure including a barrier metal disc for low resistance contact and methods of making the same
#6132 ✅ Patent 10,672,652 granted on 2020-06-02Gradient atomic layer deposition
#6133 ✅ Patent 10,510,591 granted on 2019-12-17Package-on-package structure and method of manufacturing package
#6134 ✅ Patent 10,796,956 granted on 2020-10-06Contact fabrication to mitigate undercut
#6135Method and Plater Arrangement for Failure-Free Copper Filling of a Hole in a Component Carrier
#6136 ✅ Patent 11,257,715 granted on 2022-02-22Integrated fan-out packages and methods of forming the same
#6137 ✅ Patent 11,222,820 granted on 2022-01-11Self-aligned gate cap including an etch-stop layer
#6138 ✅ Patent 11,335,598 granted on 2022-05-17Grating replication using helmets and topographically-selective deposition
#6139 ✅ Patent 10,665,506 granted on 2020-05-26Semiconductor device with reduced via bridging risk
#6140 ✅ Patent 11,031,287 granted on 2021-06-08Fully self-aligned via with selective bilayer dielectric regrowth
#6141 ✅ Patent 11,101,176 granted on 2021-08-24Method of fabricating redistribution circuit structure
#6142 ✅ Patent 10,811,315 granted on 2020-10-20Method for producing a through semiconductor via connection
#6143 ✅ Patent 10,978,346 granted on 2021-04-13Conductive vias in semiconductor packages and methods of forming same
#6144 ✅ Patent 10,923,398 granted on 2021-02-16Wafer processing method
#6145 ✅ Patent 10,734,285 granted on 2020-08-04Bonding support structure (and related process) for wafer stacking
#6146 ✅ Patent 10,699,967 granted on 2020-06-30Co-integration of high carrier mobility PFET and NFET devices on the same substrate using low temperature condensation
#6147 ✅ Patent 10,923,403 granted on 2021-02-16Co-integration of high carrier mobility PFET and NFET devices on the same substrate using low temperature condensation
#6148 ✅ Patent 10,840,153 granted on 2020-11-17Notched gate structure fabrication
#6149 ✅ Patent 11,056,394 granted on 2021-07-06Methods for fabricating FinFETs having different fin numbers and corresponding FinFETs thereof
#6150 ✅ Patent 11,101,178 granted on 2021-08-24Semiconductor integrated circuit
#6151 ✅ Patent 10,692,773 granted on 2020-06-23Forming nitrogen-containing low-K gate spacer
#6152 ✅ Patent 10,699,960 granted on 2020-06-30Methods for improving interlayer dielectric layer topography
#6153 ✅ Patent 10,566,244 granted on 2020-02-18Semiconductor device and method for fabricating the same
#6154 ✅ Patent 10,872,825 granted on 2020-12-22Method of manufacturing a semiconductor device and a semiconductor device
#6155 ✅ Patent 10,861,750 granted on 2020-12-08Method of manufacturing a semiconductor device and a semiconductor device
#6156 ✅ Patent 11,145,553 granted on 2021-10-12Nonplanar device and strain-generating channel dielectric
#6157 ✅ Patent 11,171,061 granted on 2021-11-09Method for patterning a lanthanum containing layer
#6158 ✅ Patent 11,694,933 granted on 2023-07-04Methods of forming metal gate spacer
#6159 ✅ Patent 11,410,890 granted on 2022-08-09Epitaxial layers in source/drain contacts and methods of forming the same
#6160 ✅ Patent 11,081,403 granted on 2021-08-03Methods of forming contact features in field-effect transistors
#6161 ✅ Patent 10,755,988 granted on 2020-08-25Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
#6162 ✅ Patent 11,205,582 granted on 2021-12-21Methods and apparatuses for effluent monitoring for brush conditioning
#6163 ✅ Patent 11,355,403 granted on 2022-06-07Semiconductor device including through-package debug features
#6164 ✅ Patent 10,672,674 granted on 2020-06-02Method of forming semiconductor device package having testing pads on a topmost die
#6165 ✅ Patent 11,335,612 granted on 2022-05-17Apparatus and method for electrical test prediction
#6166MICROELECTRONIC ASSEMBLIES
#6167SEALING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#6168 ✅ Patent 11,798,856 granted on 2023-10-24Ceramic/aluminum bonded body, insulating substrate, LED module, ceramic member, method for producing ceramic/aluminum bonded body, and method for producing insulating substrate
#6169MICRO-ELECTRONIC PACKAGE WITH BARRIER STRUCTURE
#6170SEMICONDUCTOR MODULE
#6171 ✅ Patent 11,127,644 granted on 2021-09-21Planarization of semiconductor packages and structures resulting therefrom
#6172 ✅ Patent 11,171,067 granted on 2021-11-09Module having a sealing resin layer with radiating member filled depressions
#6173 ✅ Patent 11,018,066 granted on 2021-05-25Integrated circuit package and method of forming same
#6174 ✅ Patent 11,145,563 granted on 2021-10-12Semiconductor devices having cutouts in an encapsulation material and associated production methods
#6175 ✅ Patent 11,342,238 granted on 2022-05-24Rotatable architecture for multi-chip package (MCP)
#6176 ✅ Patent 11,682,599 granted on 2023-06-20Chip package structure with molding layer and method for forming the same
#6177 ✅ Patent 11,257,729 granted on 2022-02-22Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP)
#6178 ✅ Patent 11,201,097 granted on 2021-12-14Method of manufacture of a semiconductor device
#6179 ✅ Patent 11,018,069 granted on 2021-05-25Underfill control structures and method
#6180 ✅ Patent 11,508,636 granted on 2022-11-22Multi-layer solution based deposition of dielectrics for advanced substrate architectures
#6181 ✅ Patent 11,075,133 granted on 2021-07-27Underfill structure for semiconductor packages and methods of forming the same
#6182 ✅ Patent 10,755,995 granted on 2020-08-25Warpage control of semiconductor die
#6183 ✅ Patent 11,145,564 granted on 2021-10-12Multi-layer passivation structure and method
#6184 ✅ Patent 11,393,735 granted on 2022-07-19Semiconductor device including reinforced corner supports
#6185 ✅ Patent 11,393,736 granted on 2022-07-19Method of manufacturing a semiconductor device having an integrated pn diode temperature sensor
#6186 ✅ Patent 10,629,512 granted on 2020-04-21Integrated circuit die with in-chip heat sink
#6187Heat Dissipation Device, Semiconductor Packaging System and Method of Manufacturing Thereof
#6188 ✅ Patent 10,950,521 granted on 2021-03-16Thermal interface material layer and package-on-package device including the same
#6189 ✅ Patent 10,811,335 granted on 2020-10-20Satellite communication transmitter with improved thermal management
#6190HEAT TRANSFER STRUCTURE, POWER ELECTRONICS MODULE, COOLING ELEMENT, METHOD OF MANUFACTURING A HEAT TRANSFER STRUCTURE AND METHOD OF MANUFACTURING A POWER ELECTRONICS COMPONENT
#6191 ✅ Patent 10,978,370 granted on 2021-04-13Integrated fan-out packages with embedded heat dissipation structure
#6192 ✅ Patent 11,791,237 granted on 2023-10-17Microelectronic assemblies including a thermal interface material
#6193 ✅ Patent 11,217,507 granted on 2022-01-04RF devices with enhanced performance and methods of forming the same
#6194 ✅ Patent 11,094,608 granted on 2021-08-17Heat dissipation structure including stacked chips surrounded by thermal interface material rings
#6195 ✅ Patent 11,075,140 granted on 2021-07-27Heat conduction structure or semiconductor apparatus
#6196 ✅ Patent 10,916,488 granted on 2021-02-09Semiconductor package having thermal conductive pattern surrounding the semiconductor die
#6197 ✅ Patent 10,985,089 granted on 2021-04-20Semiconductor cooling arrangement
#6198 ✅ Patent 11,527,458 granted on 2022-12-13Power electronics assemblies with CIO bonding layers and double sided cooling, and vehicles incorporating the same
#6199 ✅ Patent 10,867,908 granted on 2020-12-15Semiconductor device having buffer structure surrounding through via
#6200 ✅ Patent 10,636,726 granted on 2020-04-28Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#6201 ✅ Patent 11,056,419 granted on 2021-07-06Semiconductor device having backside interconnect structure on through substrate via and method of forming the same
#6202 ✅ Patent 10,741,653 granted on 2020-08-11Bond-over-active circuity gallium nitride devices
#6203 ✅ Patent 11,804,420 granted on 2023-10-31Core-shell particles for magnetic packaging
#6204 ✅ Patent 10,840,177 granted on 2020-11-17Interposer with flexible portion
#6205SWIRL INTERCONNECTION IN A FLEXIBLE CIRCUIT
#6206 ✅ Patent 10,720,381 granted on 2020-07-21Semiconductor device and method of manufacturing the same
#6207SEMICONDUCTOR DEVICE, CHIP-SHAPED SEMICONDUCTOR ELEMENT, ELECTRONIC DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#6208 ✅ Patent 10,937,721 granted on 2021-03-02Semiconductor structure
#6209 ✅ Patent 10,714,414 granted on 2020-07-14Planarizing RDLS in RDL—First Processes Through CMP Process
#6210CHIP PACKAGE AND METHOD OF MANUFACTURING
#6211SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER
#6212SEMICONDUCTOR PRODUCT SUBSTRATE INCLUDING STRESS RELIEF LAYER
#6213 ✅ Patent 10,818,585 granted on 2020-10-27Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board
#6214 ✅ Patent 11,075,151 granted on 2021-07-27Fan-out package with controllable standoff
#6215 ✅ Patent 11,127,668 granted on 2021-09-21Semiconductor device and method of forming double-sided fan-out wafer level package
#6216 ✅ Patent 11,114,372 granted on 2021-09-07Integrated circuit, circuit board with integrated circuit, and display device using the same
#6217 ✅ Patent 11,031,334 granted on 2021-06-08Semiconductor device including a conductive feature over an active region
#6218 ✅ Patent 10,665,536 granted on 2020-05-263D IC Decoupling capacitor structure and method for manufacturing the same
#6219 ✅ Patent 10,872,855 granted on 2020-12-22Chip package and method of fabricating the same
#6220 ✅ Patent 11,049,805 granted on 2021-06-29Semiconductor package and method
#6221 ✅ Patent 10,872,856 granted on 2020-12-22Semiconductor device including through vias in molded columns
#6222 ✅ Patent 10,861,786 granted on 2020-12-08Semiconductor device having a multilayer structure
#6223 ✅ Patent 10,957,640 granted on 2021-03-23Method for manufacturing a semiconductor structure
#6224 ✅ Patent 11,177,208 granted on 2021-11-16Interconnect structures and methods of forming the same
#6225 ✅ Patent 11,205,615 granted on 2021-12-21Semiconductor device and method of manufacture
#6226 ✅ Patent 10,818,590 granted on 2020-10-27Techniques to improve reliability in Cu interconnects using Cu intermetallics
#6227 ✅ Patent 10,943,863 granted on 2021-03-09Techniques to improve reliability in Cu interconnects using Cu intermetallics
#6228 ✅ Patent 11,244,898 granted on 2022-02-08Integrated circuit interconnect structures with air gaps
#6229 ✅ Patent 10,998,270 granted on 2021-05-04Local interconnect for group IV source/drain regions
#6230 ✅ Patent 11,004,794 granted on 2021-05-11Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof
#6231SEMICONDUCTOR MEMORY DEVICE
#6232 ✅ Patent 11,355,438 granted on 2022-06-07Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications
#6233PIN ASSEMBLIES FOR PLATED VIAS
#6234 ✅ Patent 11,456,257 granted on 2022-09-27Semiconductor package with dual sides of metal routing
#6235 ✅ Patent 11,462,480 granted on 2022-10-04Microelectronic assemblies having interposers
#6236 ✅ Patent 11,387,187 granted on 2022-07-12Embedded very high density (VHD) layer
#6237 ✅ Patent 11,069,621 granted on 2021-07-20Semiconductor device
#6238SEMICONDUCTOR MODULE
#6239 ✅ Patent 11,527,483 granted on 2022-12-13Package including fully integrated voltage regulator circuitry within a substrate
#6240 ✅ Patent 10,886,231 granted on 2021-01-05Method of forming RDLS and structure formed thereof
#6241 ✅ Patent 10,854,552 granted on 2020-12-01Semiconductor device and method of manufacture
#6242 ✅ Patent 10,818,603 granted on 2020-10-27Semiconductor package having redistribution layer
#6243 ✅ Patent 11,569,169 granted on 2023-01-31Semiconductor device comprising electronic components electrically joined to each other via metal nanoparticle sintered layer and method of manufacturing the same
#6244 ✅ Patent 10,700,159 granted on 2020-06-30Method of providing partial electrical shielding
#6245 ✅ Patent 11,088,083 granted on 2021-08-10DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure
#6246 ✅ Patent 10,978,407 granted on 2021-04-13Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same
#6247 ✅ Patent 11,205,622 granted on 2021-12-21Stiffener shield for device integration
#6248 ✅ Patent 11,532,567 granted on 2022-12-20Electric magnetic shielding structure in packages
#6249 ✅ Patent 10,950,556 granted on 2021-03-16EMI shielding structure in InFO package
#6250 ✅ Patent 11,527,489 granted on 2022-12-13Apparatus and system with package stiffening magnetic inductor core and methods of making the same
#6251 ✅ Patent 10,651,131 granted on 2020-05-12Supporting InFO packages to reduce warpage
#6252 ✅ Patent 11,004,803 granted on 2021-05-11Dummy dies for reducing warpage in packages
#6253 ✅ Patent 11,227,841 granted on 2022-01-18Stiffener build-up layer package
#6254 ✅ Patent 11,031,354 granted on 2021-06-08Mixing organic materials into hybrid packages
#6255SEMICONDUCTOR MODULE
#6256 ✅ Patent 10,998,275 granted on 2021-05-04Package with cathodic protection for corrosion mitigation
#6257 ✅ Patent 10,923,441 granted on 2021-02-16Implementing transient electronic circuits for security applications
#6258 ✅ Patent 11,495,552 granted on 2022-11-08Substrate integrated thin film capacitors using amorphous high-k dielectrics
#6259 ✅ Patent 11,075,176 granted on 2021-07-27Semiconductor device and method
#6260 ✅ Patent 11,011,480 granted on 2021-05-18Semiconductor device having a flat region with an outer peripheral shape including chamfer portions
#6261 ✅ Patent 11,469,189 granted on 2022-10-11Inductor and transmission line with air gap
#6262 ✅ Patent 10,916,515 granted on 2021-02-09Systems and methods using an RF circuit on isolating material
#6263 ✅ Patent 10,546,826 granted on 2020-01-28Device containing and method of providing carbon covered copper layer
#6264 ✅ Patent 11,164,829 granted on 2021-11-02Method of forming contact holes in a fan out package
#6265 ✅ Patent 11,735,541 granted on 2023-08-22Semiconductor device with protective protrusion
#6266 ✅ Patent 11,424,205 granted on 2022-08-23Semiconductor interconnect structure and method
#6267Molded Semiconductor Package
#6268 ✅ Patent 10,522,489 granted on 2019-12-31Manufacturing process for separating logic and memory array
#6269 ✅ Patent 10,978,655 granted on 2021-04-13Semiconductor devices
#6270 ✅ Patent 10,777,520 granted on 2020-09-15Semiconductor memory device
#6271 ✅ Patent 10,643,964 granted on 2020-05-05Structures for bonding a group III-V device to a substrate by stacked conductive bumps
#6272THROUGH-SILICON VIA PILLARS FOR CONNECTING DICE AND METHODS OF ASSEMBLING SAME
#6273MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE
#6274SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#6275SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#6276 ✅ Patent 11,355,468 granted on 2022-06-07Structure and method of forming a joint assembly
#6277 ✅ Patent 10,811,380 granted on 2020-10-20Semiconductor structure and forming method thereof
#6278 ✅ Patent 10,818,631 granted on 2020-10-27Semiconductor structure and method of forming the same
#6279METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVICE CHIP
#6280 ✅ Patent 10,937,755 granted on 2021-03-02Bond pads for low temperature hybrid bonding
#6281 ✅ Patent 10,714,450 granted on 2020-07-14Method of bonding terminal of semiconductor chip using solder bump and semiconductor package using the same
#6282 ✅ Patent 10,937,758 granted on 2021-03-02Semiconductor-device manufacturing method and manufacturing apparatus
#6283 ✅ Patent 10,756,048 granted on 2020-08-25Methods for improved die bonding
#6284SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#6285SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#6286 ✅ Patent 10,867,962 granted on 2020-12-15Packaging process and manufacturing method
#6287 ✅ Patent 11,437,346 granted on 2022-09-06Package structure having substrate thermal vent structures for inductor cooling
#6288 ✅ Patent 10,854,574 granted on 2020-12-01Forming metal bonds with recesses
#6289 ✅ Patent 11,171,113 granted on 2021-11-09Semiconductor package structure having an annular frame with truncated corners
#6290 ✅ Patent 10,593,647 granted on 2020-03-17Package structure and manufacturing method thereof
#6291 ✅ Patent 10,692,841 granted on 2020-06-23Semiconductor devices having through-stack interconnects for facilitating connectivity testing
#6292 ✅ Patent 11,710,720 granted on 2023-07-25Integrated multi-die partitioned voltage regulator
#6293 ✅ Patent 11,581,287 granted on 2023-02-14Chip scale thin 3D die stacked package
#6294 ✅ Patent 10,950,579 granted on 2021-03-16Integrated circuit package and method of forming same
#6295 ✅ Patent 11,189,598 granted on 2021-11-30Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
#6296 ✅ Patent 10,892,255 granted on 2021-01-12Method of manufacturing light emitting module
#6297 ✅ Patent 10,903,193 granted on 2021-01-26Light-emitting device
#6298 ✅ Patent 10,784,239 granted on 2020-09-22Light emitting diode package and light emitting diode module
#6299 ✅ Patent 10,797,028 granted on 2020-10-06Three-dimensional memory devices with stacked device chips using interposers
#6300 ✅ Patent 10,985,146 granted on 2021-04-20Semiconductor device with integrated heat distribution and manufacturing method thereof