Tokyo
Japan
8
2018-07-12
8
2019-01-15
These are the the leading inventors for applications assigned to SH MATERIALS CO., LTD.:
SH MATERIALS CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Lead frame and method of manufacturing the same
#2 | 2017-08-17 ✅ Patent 9,735,096 granted on 2017-08-15Lead frame and method for manufacturing the same
#3 | 2016-11-24 ✅ Patent 9,735,106 granted on 2017-08-15Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#4 | 2016-10-13 ✅ Patent 10,204,801 granted on 2019-02-12Method for producing substrate for semiconductor element mounting
#5 | 2016-09-22 ✅ Patent 9,691,689 granted on 2017-06-27Lead frame for mounting semiconductor element and method for manufacturing the same
#6 | 2016-07-28 ✅ Patent 9,583,422 granted on 2017-02-28Lead frame
#7 | 2016-03-17 ✅ Patent 9,870,930 granted on 2018-01-16Method for producing substrate for mounting semiconductor element
#8 | 2013-11-21 ✅ Patent 9,054,116 granted on 2015-06-09Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
Also check out SH MATERIALS CO., LTD.'s (Tokyo, Japan) applicant profile with 6 patent applications submitted.
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