Tokyo
Japan
3
2013-11-21
The entities that hold a legal rights for patent applications filed by inventor Hamada Yoichiro:
Yoichiro Hamada from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
#2 | 2012-03-15MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
#3 | 2010-08-26Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
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