Tokyo
Japan
32
2026-03-26
16
2025-10-14
These are the the leading inventors for applications assigned to TOYOCHEM CO., LTD.:
TOYOCHEM CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
ELECTROMAGNETIC WAVE SHIELDING SHEET, SHIELDED WAFER, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2 | 2025-12-04METHOD FOR SEPARATING AND RECOVERING LAMINATE
#3 | 2025-10-14 ✅ Patent 12,444,698 granted on 2025-10-14Electronic component-mounting substrate and electronic device
#4 | 2025-05-01BINDER FOR NON-AQUEOUS SECONDARY BATTERY SEPARATOR, RESIN COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY SEPARATOR, NON-AQUEOUS SECONDARY BATTERY SEPARATOR, NON-AQUEOUS SECONDARY BATTERY, ELECTRICITY STORAGE DEVICE AND BINDER, AQUEOUS DISPERSION, RESIN COMPOSITION AND SEPARATOR USED THEREFOR, AND METHOD FOR PREPARING BINDER
#5 | 2025-01-16ADHESIVE PATCH CONTAINING SELEXIPAG AS ACTIVE INGREDIENT
#6 | 2025-01-09METHOD FOR SEPARATION AND RECOVERY OF LAMINATE
#7 | 2024-11-14PACKAGING MATERIAL, RECYCLED MOLDING MATERIAL, AND METHODS FOR MANUFACTURING SAME
#8 | 2024-07-04BINDER DISPERSION FOR NON-AQUEOUS SECONDARY BATTERY SEPARATOR, SLURRY COMPOSITION, NON-AQUEOUS SECONDARY BATTERY SEPARATOR, AND NON-AQUEOUS SECONDARY BATTERY
#9 | 2024-06-13CAN INNER SURFACE COATING MATERIAL AND CAN WITH COATED INNER SURFACE
#10 | 2023-12-07ADHESIVE PATCH
#11 | 2023-11-16HOT-MELT MAGNETIC TAPE, CLOTH-LIKE MATERIAL FOR FOAM MOLDING AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING FOAM MOLDED COMPOSITE, AND VEHICLE SEAT
#12 | 2023-10-05 ✅ Patent 12,617,987 granted on 2026-05-05ADHESIVE FOR ELECTRICAL STORAGE DEVICE PACKAGING MATERIAL, ELECTRICAL STORAGE DEVICE PACKAGING MATERIAL, ELECTRICAL STORAGE DEVICE CONTAINER, AND ELECTRICAL STORAGE DEVICE
#13 | 2022-06-23DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET, POLISHING MEMBER, AND SURFACE PLATE WITH POLISHING PAD
#14 | 2021-08-12 ✅ Patent 11,172,599 granted on 2021-11-09Electromagnetic-wave shielding sheet and electronic component-mounted substrate
#15 | 2021-08-05 ✅ Patent 11,990,420 granted on 2024-05-21Electromagnetic wave shielding sheet
#16 | 2021-05-06 ✅ Patent 11,407,201 granted on 2022-08-09Composite member
#17 | 2020-12-31 ✅ Patent 11,533,833 granted on 2022-12-20Electromagnetic wave shielding sheet and printed wiring board
#18 | 2020-12-31AQUEOUS COATING COMPOSITION, MEMBER FOR CAN, AND CAN
#19 | 2020-10-27 ✅ Patent 10,820,457 granted on 2020-10-27Electromagnetic wave shielding sheet and printed wiring board
#20 | 2020-08-27 ✅ Patent 11,825,632 granted on 2023-11-21Thermally conductive insulating sheet, and composite member
#21 | 2020-06-25 ✅ Patent 11,434,396 granted on 2022-09-06Synthetic rubber pressure-sensitive adhesive, pressure-sensitive adhesive sheet, and polishing member laminate
#22 | 2019-10-10 ✅ Patent 11,084,192 granted on 2021-08-10Fabric-like material for reinforcement in urethane foam molding, and method for producing urethane foam molded body utilizing same
#23 | 2019-05-23 ✅ Patent 11,208,565 granted on 2021-12-28Water-soluble paint and coated can
#24 | 2019-03-14DECORATIVE FILM AND METHOD FOR PRODUCING SAME, AND DECORATED MOLDED ARTICLE
#25 | 2018-11-29ADHESIVE AND ADHESIVE TAPE
#26 | 2018-02-15 ✅ Patent 11,130,890 granted on 2021-09-28Adhesive composition, adhesive sheet, and method for producing same
#27 | 2018-01-04 ✅ Patent 10,858,557 granted on 2020-12-08Adhesive and adhesive tape
#28 | 2017-12-14 ✅ Patent 9,951,259 granted on 2018-04-24Adhesive composition and laminate
#29 | 2016-09-15 ✅ Patent 9,549,473 granted on 2017-01-17Printed wiring board, printed wiring board manufacturing method, and electronic device
#30 | 2016-02-04 ✅ Patent 9,825,264 granted on 2017-11-21Electricity storage device, electricity storage device container, and electricity storage device packaging material
#31 | 2012-04-19BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE
#32 | 2012-01-19RESIN COMPOSITION FOR SOLAR CELL-SEALING MATERIAL
Also check out TOYOCHEM CO., LTD.'s (Tokyo, Japan) applicant profile with 25 patent applications submitted.
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