Dresden
Germany
44
2023-12-07
43
2024-07-09
These are the the leading inventors for applications assigned to SILTECTRA GmbH:
SILTECTRA GmbH based in Dresden, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method for separating wafers from donor substrates
#2 | 2023-04-06 ✅ Patent 11,996,331 granted on 2024-05-28Method for separating a solid body
#3 | 2021-08-26 ✅ Patent 11,527,441 granted on 2022-12-13Method for producing a detachment area in a solid body
#4 | 2021-07-22 ✅ Patent 11,664,277 granted on 2023-05-30Method for thinning solid-body layers provided with components
#5 | 2021-07-22 ✅ Patent 11,699,616 granted on 2023-07-11Method for producing a layer of solid material
#6 | 2021-07-22 ✅ Patent 12,211,702 granted on 2025-01-28Solid body and multi-component arrangement
#7 | 2021-07-15 ✅ Patent 12,097,641 granted on 2024-09-24Method for forming a crack in an edge region of a donor substrate
#8 | 2021-07-01 ✅ Patent 11,869,810 granted on 2024-01-09Method for reducing the thickness of solid-state layers provided with components
#9 | 2021-02-11 ✅ Patent 11,518,066 granted on 2022-12-06Method of treating a solid layer bonded to a carrier substrate
#10 | 2020-12-24 ✅ Patent 12,539,565 granted on 2026-02-03Method for Producing Short Subcritical Cracks in Solid Bodies
#11 | 2020-12-10 ✅ Patent 12,159,805 granted on 2024-12-03Method for producing wafers with modification lines of defined orientation
#12 | 2020-08-20 ✅ Patent 11,014,199 granted on 2021-05-25Method of modifying a solid using laser light
#13 | 2020-08-13 ✅ Patent 11,787,083 granted on 2023-10-17Production facility for separating wafers from donor substrates
#14 | 2020-07-09 ✅ Patent 12,151,314 granted on 2024-11-26Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack
#15 | 2020-06-11 ✅ Patent 11,004,723 granted on 2021-05-11Wafer production method
#16 | 2020-05-07 ✅ Patent 10,825,732 granted on 2020-11-03Method of producing stresses in a semiconductor wafer
#17 | 2020-03-03 ✅ Patent 10,580,699 granted on 2020-03-03Method and device for the production of wafers with a pre-defined break initiation point
#18 | 2020-02-27 ✅ Patent 10,978,311 granted on 2021-04-13Method for thinning solid body layers provided with components
#19 | 2020-02-27 ✅ Patent 10,661,392 granted on 2020-05-26Splitting of a solid using conversion of material
#20 | 2020-02-13 ✅ Patent 11,309,191 granted on 2022-04-19Method for modifying substrates based on crystal lattice dislocation density
#21 | 2020-01-02 ✅ Patent 11,201,081 granted on 2021-12-14Method for separating thin layers of solid material from a solid body
#22 | 2019-12-05 ✅ Patent 11,059,202 granted on 2021-07-13Method and device for producing planar modifications in solid bodies
#23 | 2019-11-07 ✅ Patent 11,772,201 granted on 2023-10-03Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components
#24 | 2019-10-03 ✅ Patent 11,822,307 granted on 2023-11-21Laser conditioning of solid bodies using prior knowledge from previous machining steps
#25 | 2019-08-01 ✅ Patent 10,593,590 granted on 2020-03-17Combined wafer production method with laser treatment and temperature-induced stresses
#26 | 2019-07-18 ✅ Patent 10,676,386 granted on 2020-06-09Method for guiding a crack in the peripheral region of a donor substrate
#27 | 2019-04-04 ✅ Patent 11,130,200 granted on 2021-09-28Combined laser treatment of a solid body to be split
#28 | 2019-03-07 ✅ Patent 10,858,495 granted on 2020-12-08Polymer hybrid material for use in a splitting method
#29 | 2018-12-27 ✅ Patent 10,994,442 granted on 2021-05-04Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam
#30 | 2018-10-11 ✅ Patent 11,833,617 granted on 2023-12-05Splitting of a solid using conversion of material
#31 | 2018-08-30 ✅ Patent 10,843,380 granted on 2020-11-24Method for the material-saving production of wafers and processing of wafers
#32 | 2018-08-16 ✅ Patent 10,229,835 granted on 2019-03-12Splitting method and use of a material in a splitting method
#33 | 2018-08-16 ✅ Patent 10,707,068 granted on 2020-07-07Combined wafer production method with a multi-component receiving layer
#34 | 2018-07-05 ✅ Patent 10,280,107 granted on 2019-05-07Method for guiding a crack in the peripheral region of a donor substrate
#35 | 2018-05-10 ✅ Patent 11,407,066 granted on 2022-08-09Splitting of a solid using conversion of material
#36 | 2018-01-11SEPARATING DEVICE FOR THE CHIP-FREE CUTTING OF WAFERS OF DONOR SUBSTRATES
#37 | 2018-01-04 ✅ Patent 11,786,995 granted on 2023-10-17Nonplanar wafer and method for producing a nonplanar wafer
#38 | 2017-11-16 ✅ Patent 10,930,560 granted on 2021-02-23Laser-based separation method
#39 | 2017-08-03 ✅ Patent 10,960,574 granted on 2021-03-30Combined wafer production method with a receiving layer having holes
#40 | 2017-02-02 ✅ Patent 10,029,277 granted on 2018-07-24Method of producing large-scale layers of solid material
#41 | 2016-09-01 ✅ Patent 10,312,135 granted on 2019-06-04Combined wafer production method with laser treatment and temperature-induced stresses
#42 | 2016-08-25 ✅ Patent 10,141,219 granted on 2018-11-27Combined production method for separating a number of thin layers of solid material from a thick solid body
#43 | 2016-03-24 ✅ Patent 9,754,810 granted on 2017-09-05Method for the production of a wafer with a carrier unit
#44 | 2011-10-27 ✅ Patent 8,877,077 granted on 2014-11-04Method for producing thin, free-standing layers of solid state materials with structured surfaces
Also check out Siltectra GmbH's (Dresden, Germany) applicant profile with 44 patent applications submitted.
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