Inventor profile of:

Ralf Rieske

City:

Dresden

Country:

Germany

Published Applications:

25

Last publication date:

2026-04-16

Top Assignees for applications by Ralf Rieske

The entities that hold a legal rights for patent applications filed by inventor Rieske Ralf:

Recent patent applications by Rieske Ralf

Ralf Rieske from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-16
US20260102857A1
Performing operations; transporting

METHOD OF PROCESSING A MONOCRYSTALLINE SEMICONDUCTOR WORK PIECE

#2 | 2026-03-12
US20260070159A1
Performing operations; transporting

Method for Producing Short Subcritical Cracks in Solid Bodies

#3 | 2024-12-12
US20240413023A1
Electricity

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A SOLID BODY

#4 | 2024-02-22
US20240058899A1
Performing operations; transporting

Method for Producing a Detachment Region in a Solid-state Body

#5 | 2023-12-07
US20230390961A1
Performing operations; transporting

Method for separating wafers from donor substrates

#6 | 2023-10-19
US20230330769A1
Performing operations; transporting

Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices

#7 | 2023-03-30
US20230093945A1
Electricity

Method and apparatus for producing at least one modification in a solid body

#8 | 2021-09-30
US20210299910A1
Performing operations; transporting

METHOD FOR SEPARATING A SOLID-STATE LAYER FROM A SOLID-STATE MATERIAL

#9 | 2021-07-22
US20210225709A1
Electricity

Method for thinning solid-body layers provided with components

#10 | 2021-07-22
US20210225659A1
Electricity

Solid body and multi-component arrangement

#11 | 2021-07-01
US20210197314A1
Performing operations; transporting

Method for reducing the thickness of solid-state layers provided with components

#12 | 2021-02-25
US20210053148A1
Performing operations; transporting

Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices

#13 | 2020-12-24
US20200398381A1
Performing operations; transporting

Method for Producing Short Subcritical Cracks in Solid Bodies

#14 | 2020-12-10
US20200388538A1
Electricity

Method for producing wafers with modification lines of defined orientation

#15 | 2020-10-29
US20200343147A1
Electricity

Method and apparatus for producing at least one modification in a solid body

#16 | 2020-08-13
US20200254650A1
Performing operations; transporting

Production facility for separating wafers from donor substrates

#17 | 2020-07-09
US20200215648A1
Performing operations; transporting

Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack

#18 | 2020-02-27
US20200066542A1
Electricity

Method for thinning solid body layers provided with components

#19 | 2020-02-13
US20200051831A1
Electricity

Method for modifying substrates based on crystal lattice dislocation density

#20 | 2019-12-05
US20190366586A1
Performing operations; transporting

Method and device for producing planar modifications in solid bodies

#21 | 2019-10-03
US20190302725A1
Physics

Laser conditioning of solid bodies using prior knowledge from previous machining steps

#22 | 2019-04-04
US20190099838A1
Performing operations; transporting

Combined laser treatment of a solid body to be split

#23 | 2018-10-11
US20180290232A1
Performing operations; transporting

Splitting of a solid using conversion of material

#24 | 2018-05-10
US20180126484A1
Performing operations; transporting

Splitting of a solid using conversion of material

#25 | 2012-09-06
US20120224966A1
Mechanical engineering

System for monitoring the condition of rotor blades at wind turbines

InventorID:

2183135 ⎘