Hong Kong
China
9
2018-12-27
6
2020-06-09
These are the the leading inventors for applications assigned to EOPLEX LIMITED:
EOPLEX LIMITED based in Hong Kong, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Integrated circuit system with carrier construction configuration and method of manufacture thereof
#2 | 2018-02-15LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PATH REDISTRIBUTION STRUCTURES
#3 | 2018-02-15LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS
#4 | 2018-02-01LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS
#5 | 2016-05-19 ✅ Patent 10,612,751 granted on 2020-04-07Electrical system with lighting configuration and method of manufacture thereof
#6 | 2015-11-05 ✅ Patent 9,604,411 granted on 2017-03-28Multi-material three dimensional printer
#7 | 2014-03-13 ✅ Patent 9,184,114 granted on 2015-11-10Lead carrier with print-formed terminal pads
#8 | 2013-09-03 ✅ Patent 8,525,305 granted on 2013-09-03Lead carrier with print-formed package components
#9 | 2013-02-14 ✅ Patent 8,749,035 granted on 2014-06-10Lead carrier with multi-material print formed package components
Also check out EoPlex Limited's (Hong Kong, China) applicant profile with 4 patent applications submitted.
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