Philip E ROGREN

City:

San Jose, California

Country:

United States

Published Applications:

Last publication date:

2018-02-15

Top Assignees for applications by Philip E ROGREN

The entities that hold a legal rights for patent applications filed by inventor ROGREN Philip E:

Philip E ROGREN from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:

LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PATH REDISTRIBUTION STRUCTURES

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS

InventorID:

2107762 ⎘