Gyeonggi-do
South Korea
6
2021-11-25
6
2023-05-30
These are the the leading inventors for applications assigned to LBSEMICON CO., LTD.:
LBSEMICON CO., LTD. based in Gyeonggi-do, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Manufacturing method for reflowed solder balls and their under bump metallurgy structure
#2 | 2020-08-20 ✅ Patent 10,825,788 granted on 2020-11-03Method for manufacturing compliant bump
#3 | 2020-08-20 ✅ Patent 10,937,751 granted on 2021-03-02Bump structure manufacturing method
#4 | 2019-08-01 ✅ Patent 11,127,658 granted on 2021-09-21Manufacturing method for reflowed solder balls and their under bump metallurgy structure
#5 | 2019-06-06 ✅ Patent 10,784,228 granted on 2020-09-22Method of manufacturing semiconductor package using side molding
#6 | 2018-06-14 ✅ Patent 10,629,444 granted on 2020-04-21Method for manufacturing bump structure
Also check out LBSEMICON CO., LTD.'s (Gyeonggi-do, South Korea) applicant profile with 6 patent applications submitted.
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