Jae Jin KWON

City:

Gyeonggi-do

Country:

South Korea

Published Applications:

Last publication date:

2021-11-25

Top Assignees for applications by Jae Jin KWON

The entities that hold a legal rights for patent applications filed by inventor KWON Jae Jin:

Jae Jin KWON from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Manufacturing method for reflowed solder balls and their under bump metallurgy structure

Method for manufacturing compliant bump

Manufacturing method for reflowed solder balls and their under bump metallurgy structure

InventorID:

2576540 ⎘