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Assignee profile:

Advanced Interconnect Materials, LLC

City:

Sendai

Country:

Japan

Published Applications:

Last publication date:

2012-01-26

Patent Grants:

Last grant date:

2015-07-14

Top Inventors for applications by Advanced Interconnect Materials, LLC

These are the the leading inventors for applications assigned to Advanced Interconnect Materials, LLC:

Junichi Koike 17 Sendai, Japan
Akihiro Shibatomi 9 Sendai, Japan
Junichi Koike 5 Sendai-City, Japan
Hideaki Kawakami 5 Chiba, Japan

Hideaki Kawakami 5 Chiba-city, Japan
Junichi KOIKE 1 Sendai-shi, Japan
Kouji Neishi 1 Sendai, Japan

Recent patent applications by Advanced Interconnect Materials, LLC

Advanced Interconnect Materials, LLC based in Sendai, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-01-26 ✅ Patent 9,082,821 granted on 2015-07-14

US20120021603A1

Electricity

Method for forming copper interconnection structures

#2 | 2012-01-05 ✅ Patent 8,580,688 granted on 2013-11-12

US20120003390A1

Electricity

Copper interconnection structure and method for forming copper interconnections

#3 | 2011-03-10 ✅ Patent 8,531,033 granted on 2013-09-10

US20110057317A1

Electricity

Contact plug structure, semiconductor device, and method for forming contact plug

#4 | 2010-10-21 ✅ Patent 8,163,649 granted on 2012-04-24

US20100267228A1

Electricity

Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure

#5 | 2010-06-24 ✅ Patent 8,169,079 granted on 2012-05-01

US20100155952A1

Electricity

Copper interconnection structures and semiconductor devices

#6 | 2010-06-24 ✅ Patent 8,324,730 granted on 2012-12-04

US20100155951A1

Electricity

Copper interconnection structure and method for forming copper interconnections

#7 | 2010-06-24 ✅ Patent 8,112,885 granted on 2012-02-14

US20100154213A1

Electricity

Method for forming copper interconnection structures

#8 | 2010-03-18 ✅ Patent 8,258,626 granted on 2012-09-04

US20100065967A1

Electricity

Copper interconnection, method for forming copper interconnection structure, and semiconductor device

#9 | 2010-01-28 ✅ Patent 8,084,860 granted on 2011-12-27

US20100018614A1

Physics

Liquid crystal display device and manufacturing method therefor

#10 | 2010-01-21 ✅ Patent 7,782,433 granted on 2010-08-24

US20100015330A1

Chemistry; metallurgy

Copper alloy and liquid-crystal display device

#11 | 2009-11-26 ✅ Patent 8,089,158 granted on 2012-01-03

US20090290116A1

Physics

Liquid crystal display device and manufacturing method therefor

#12 | 2009-10-08 ✅ Patent 8,372,745 granted on 2013-02-12

US20090253260A1

Electricity

Semiconductor device, its manufacturing method, and sputtering target material for use in the method

#13 | 2009-10-01 ✅ Patent 7,755,192 granted on 2010-07-13

US20090243112A1

Electricity

Copper interconnection structure, barrier layer including carbon and hydrogen

#14 | 2009-04-16

US20090095620A1

Chemistry; metallurgy

Semiconductor device, its manufacturing method, and sputtering target material for use in the method

#15 | 2008-11-13 ✅ Patent 7,782,413 granted on 2010-08-24

US20080278649A1

Electricity

Liquid crystal display device and manufacturing method therefor

#16 | 2008-10-16 ✅ Patent 7,633,164 granted on 2009-12-15

US20080252843A1

Physics

Liquid crystal display device and manufacturing method therefor

#17 | 2008-07-17 ✅ Patent 7,642,552 granted on 2010-01-05

US20080170193A1

Physics

Liquid crystal display device and manufacturing method therefor

AssigneeID:

173463 ⎘