Sendai
Japan
49
2024-04-11
The entities that hold a legal rights for patent applications filed by inventor Koike Junichi:
Junichi Koike from Sendai, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
COPPER PASTE
#2 | 2023-02-23WIRING BOARD AND METHOD FOR MANUFACTURING SAME
#3 | 2022-03-03Electronic component and method for producing same
#4 | 2021-08-26Circuit board and production method therefor, and electronic device and production method therefor
#5 | 2020-11-19Semiconductor devices including cobalt alloys and fabrication methods thereof
#6 | 2019-05-30Semiconductor devices including a first cobalt alloy in a first barrier layer and a second cobalt alloy in a second barrier layer
#7 | 2018-07-12Solar cell and method of manufacturing the same
#8 | 2018-01-11Solar cell module and method for manufacturing the same
#9 | 2017-06-22Electronic component and method for manufacturing same
#10 | 2017-05-11Method for firing copper paste
#11 | 2017-02-09Hard lubricating coating film and hard lubricating coating film-covered tool
#12 | 2016-01-21Hard film for machining tools and hard film-coated metal machining tool
#13 | 2015-05-21Conductive paste, method for forming wiring, electronic component, and silicon solar cell
#14 | 2014-08-14Liquid crystal display device
#15 | 2014-03-13Electrode for oxide semiconductor, method of forming the same, and oxide semiconductor device provided with the electrode
#16 | 2013-07-04Semiconductor device
#17 | 2013-05-09Thin-film transistor
#18 | 2013-04-11Semiconductor device having a multilevel interconnect structure and method for fabricating the same
#19 | 2012-10-25Liquid crystal display device
#20 | 2012-09-20Phase-change material and phase-change type memory device
#21 | 2012-08-23SiC single crystal wafer and process for production thereof
#22 | 2012-05-31Film forming method, pretreatment device, and processing system
#23 | 2012-01-26Method for forming copper interconnection structures
#24 | 2012-01-05Copper interconnection structure and method for forming copper interconnections
#25 | 2011-08-04Semiconductor device with a barrier film
#26 | 2011-03-10Contact plug structure, semiconductor device, and method for forming contact plug
#27 | 2011-03-03Method of manufacturing semiconductor device, semiconductor device, electronic instrument, semiconductor manufacturing apparatus, and storage medium
#28 | 2010-10-21Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure
#29 | 2010-08-12Liquid crystal display device and manufacturing method therefor
#30 | 2010-06-24Copper interconnection structures and semiconductor devices
#31 | 2010-06-24Copper interconnection structure and method for forming copper interconnections
#32 | 2010-06-24Method for forming copper interconnection structures
#33 | 2010-06-10Film forming method and film forming apparatus
#34 | 2010-05-06Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
#35 | 2010-03-18Copper interconnection, method for forming copper interconnection structure, and semiconductor device
#36 | 2010-02-25Liquid crystal display device
#37 | 2010-01-28Liquid crystal display device and manufacturing method therefor
#38 | 2010-01-21Copper alloy and liquid-crystal display device
#39 | 2009-11-26Liquid crystal display device and manufacturing method therefor
#40 | 2009-10-08Semiconductor device, its manufacturing method, and sputtering target material for use in the method
#41 | 2009-10-01Copper interconnection structure, barrier layer including carbon and hydrogen
#42 | 2009-09-24Semiconductor device having a multilevel interconnect structure and method for fabricating the same
#43 | 2009-04-16Semiconductor device, its manufacturing method, and sputtering target material for use in the method
#44 | 2008-11-13Liquid crystal display device and manufacturing method therefor
#45 | 2008-10-16Liquid crystal display device and manufacturing method therefor
#46 | 2008-07-17Liquid crystal display device and manufacturing method therefor
#47 | 2008-03-06Semiconductor device with a barrier film
#48 | 2007-01-04Copper alloys and liquid-crystal display device
#49 | 2005-10-06Semiconductor device with a barrier film which contains manganese
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