Assignee profile:

NIPPON MINING & METALS CO., LTD.

City:

Tokyo

Country:

Japan

Published Applications:

128

Last publication date:

2012-01-12

Patent Grants:

101

Last grant date:

2014-02-11

Top Inventors for applications by NIPPON MINING & METALS CO., LTD.

These are the the leading inventors for applications assigned to NIPPON MINING & METALS CO., LTD.:

Recent patent applications by NIPPON MINING & METALS CO., LTD.

NIPPON MINING & METALS CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-01-12 ✅ Patent 8,647,747 granted on 2014-02-11
US20120009374A1
Chemistry; metallurgy

Hybrid silicon wafer and method of producing the same

#2 | 2012-01-12 ✅ Patent 8,252,422 granted on 2012-08-28
US20120009373A1
Chemistry; metallurgy

Hybrid silicon wafer and method of producing the same

#3 | 2011-12-15 ✅ Patent 8,148,245 granted on 2012-04-03
US20110306165A1
Electricity

Method for producing a-IGZO oxide thin film

#4 | 2011-01-06
US20110003169A1
Electricity

Non-Adhesive Flexible Laminate

#5 | 2011-01-06 ✅ Patent 8,298,502 granted on 2012-10-30
US20110002825A1
Electricity

Preparation method of lithium carbonate from lithium-ion secondary battery recovered material

#6 | 2010-12-30
US20100330325A1
Chemistry; metallurgy

Sintered Silicon Wafer

#7 | 2010-12-23
US20100323215A1
Electricity

Non-Adhesive-Type Flexible Laminate and Method for Production Thereof

#8 | 2010-12-23 ✅ Patent 8,652,399 granted on 2014-02-18
US20100320085A1
Chemistry; metallurgy

Sputtering target for producing metallic glass membrane and manufacturing method thereof

#9 | 2010-12-16 ✅ Patent 8,003,065 granted on 2011-08-23
US20100316544A1
Chemistry; metallurgy

Method for collection of valuable metal from ITO scrap

#10 | 2010-12-09 ✅ Patent 7,943,033 granted on 2011-05-17
US20100307923A1
Chemistry; metallurgy

Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode

#11 | 2010-12-02 ✅ Patent 9,045,823 granted on 2015-06-02
US20100300878A1
Chemistry; metallurgy

Sintered oxide compact target for sputtering and process for producing the same

#12 | 2010-11-25 ✅ Patent 8,012,335 granted on 2011-09-06
US20100294082A1
Chemistry; metallurgy

Method for collection of valuable metal from ITO scrap

#13 | 2010-11-18 ✅ Patent 8,308,932 granted on 2012-11-13
US20100288646A1
Chemistry; metallurgy

Method of recovering valuable metals from IZO scrap

#14 | 2010-11-18 ✅ Patent 8,308,934 granted on 2012-11-13
US20100288645A1
Chemistry; metallurgy

Method of recovering valuable metals from IZO scrap

#15 | 2010-11-11 ✅ Patent 8,308,933 granted on 2012-11-13
US20100282615A1
Chemistry; metallurgy

Method of recovering valuable metals from IZO scrap

#16 | 2010-11-04
US20100276037A1
Chemistry; metallurgy

High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same

#17 | 2010-10-21
US20100266863A1
Chemistry; metallurgy

Sn-PLATED MATERIALS FOR ELECTRONIC COMPONENTS

#18 | 2010-09-23 ✅ Patent 7,897,068 granted on 2011-03-01
US20100240521A1
Chemistry; metallurgy

Sputtering target, thin film for optical information recording medium and process for producing the same

#19 | 2010-09-02 ✅ Patent 8,158,092 granted on 2012-04-17
US20100221170A1
Chemistry; metallurgy

Iron silicide powder and method for production thereof

#20 | 2010-09-02 ✅ Patent 9,765,425 granted on 2017-09-19
US20100219070A1
Chemistry; metallurgy

Copper alloy sputtering target, process for producing the same and semiconductor element wiring

#21 | 2010-08-26 ✅ Patent 8,318,313 granted on 2012-11-27
US20100215970A1
Performing operations; transporting

Method for supporting metal nanoparticles and metal nanoparticles-carrying substrate

#22 | 2010-08-05 ✅ Patent 8,007,652 granted on 2011-08-30
US20100193372A1
Chemistry; metallurgy

Method for collection of valuable metal from ITO scrap

#23 | 2010-08-05
US20100192728A1
Performing operations; transporting

Spherical Copper Fine Powder and Process for Producing the Same

#24 | 2010-07-29 ✅ Patent 8,252,206 granted on 2012-08-28
US20100189636A1
Chemistry; metallurgy

Amorphous film of composite oxide, crystalline film of composite oxide, method of producing said films and sintered compact of composite oxide

#25 | 2010-07-29
US20100187661A1
Chemistry; metallurgy

Sintered Silicon Wafer

#26 | 2010-07-01 ✅ Patent 7,892,843 granted on 2011-02-22
US20100167407A1
Physics

Nickel crucible for melting analytical sample, method of preparing analytical sample and method of analysis

#27 | 2010-07-01 ✅ Patent 7,892,457 granted on 2011-02-22
US20100167000A1
Chemistry; metallurgy

Sputtering target, thin film for optical information recording medium and process for producing the same

#28 | 2010-07-01 ✅ Patent 8,216,442 granted on 2012-07-10
US20100163425A1
Chemistry; metallurgy

Ultrahigh-purity copper and process for producing the same

#29 | 2010-06-10 ✅ Patent 8,277,694 granted on 2012-10-02
US20100140570A1
Chemistry; metallurgy

Sintered compact of composite oxide, amorphous film of composite oxide, process for producing said film, crystalline film of composite oxide and process for producing said film

#30 | 2010-06-03
US20100136434A1
Electricity

Electrolytic Copper Foil for Lithium Rechargeable Battery and Process for Producing the Copper Foil

#31 | 2010-05-13 ✅ Patent 8,206,595 granted on 2012-06-26
US20100116093A1
Chemistry; metallurgy

Method of recovering silver using anion-exchange resin

#32 | 2010-04-29 ✅ Patent 8,734,633 granted on 2014-05-27
US20100101964A1
Chemistry; metallurgy

Method of recovering valuable metal from scrap containing conductive oxide

#33 | 2010-04-29 ✅ Patent 8,685,225 granted on 2014-04-01
US20100101963A1
Chemistry; metallurgy

Method of recovering valuable metal from scrap conductive oxide

#34 | 2010-04-22 ✅ Patent 8,216,438 granted on 2012-07-10
US20100096271A1
Chemistry; metallurgy

Copper anode or phosphorous-containing copper anode, method of electroplating copper on semiconductor wafer, and semiconductor wafer with low particle adhesion

#35 | 2010-04-15 ✅ Patent 8,318,314 granted on 2012-11-27
US20100089622A1
Electricity

Barrier film for flexible copper substrate and sputtering target for forming barrier film

#36 | 2010-04-08
US20100086435A1
Chemistry; metallurgy

Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS

#37 | 2010-04-08 ✅ Patent 8,012,337 granted on 2011-09-06
US20100084281A1
Chemistry; metallurgy

Method for collection of valuable metal from ITO scrap

#38 | 2010-04-08 ✅ Patent 8,012,336 granted on 2011-09-06
US20100084279A1
Chemistry; metallurgy

Method for collection of valuable metal from ITO scrap

#39 | 2010-03-25 ✅ Patent 8,685,226 granted on 2014-04-01
US20100072075A1
Chemistry; metallurgy

Method of recovering valuable metal from scrap containing conductive oxide

#40 | 2010-03-11 ✅ Patent 8,029,629 granted on 2011-10-04
US20100058827A1
Chemistry; metallurgy

Sputtering target and manufacturing method thereof

#41 | 2010-03-04 ✅ Patent 7,976,687 granted on 2011-07-12
US20100051451A1
Chemistry; metallurgy

Roll unit dipped in surface treatment liquid

#42 | 2010-02-25 ✅ Patent 9,328,411 granted on 2016-05-03
US20100044223A1
Chemistry; metallurgy

Ytterbium sputtering target and method of producing said target

#43 | 2010-02-18
US20100040873A1
Electricity

Two-Layered Copper-Clad Laminate

#44 | 2010-02-11 ✅ Patent 9,234,259 granted on 2016-01-12
US20100031779A1
Chemistry; metallurgy

Process for recovery of copper from copper-containing chloride media

#45 | 2010-02-04 ✅ Patent 7,943,021 granted on 2011-05-17
US20100025236A1
Chemistry; metallurgy

Sb-Te alloy sintered compact target and manufacturing method thereof

#46 | 2010-01-28 ✅ Patent 8,276,420 granted on 2012-10-02
US20100018273A1
Mechanical engineering

Roll unit for use in surface treatment of copper foil

#47 | 2010-01-21
US20100016144A1
Electricity

Sintered Silicon Wafer

#48 | 2010-01-21
US20100013096A1
Chemistry; metallurgy

Cu-Mn Alloy Sputtering Target and Semiconductor Wiring

#49 | 2010-01-07 ✅ Patent 7,799,188 granted on 2010-09-21
US20100000871A1
Chemistry; metallurgy

Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode

#50 | 2010-01-07
US20100000637A1
Electricity

Cu-ni-si system alloy

#51 | 2009-12-10 ✅ Patent 8,882,975 granted on 2014-11-11
US20090301872A1
Chemistry; metallurgy

Sb-Te base alloy sinter sputtering target

#52 | 2009-12-10 ✅ Patent 8,444,779 granted on 2013-05-21
US20090301614A1
Chemistry; metallurgy

Cu—Ni—Si—Co copper alloy for electronic materials and method for manufacturing same

#53 | 2009-11-12 ✅ Patent 7,871,564 granted on 2011-01-18
US20090280025A1
Chemistry; metallurgy

High-purity Ru alloy target, process for producing the same, and sputtered film

#54 | 2009-11-12 ✅ Patent 8,157,973 granted on 2012-04-17
US20090277788A1
Chemistry; metallurgy

Sputtering target/backing plate bonded body

#55 | 2009-11-05
US20090272466A1
Chemistry; metallurgy

Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper

#56 | 2009-10-08 ✅ Patent 7,674,404 granted on 2010-03-09
US20090250669A1
Chemistry; metallurgy

Gallium oxide/zinc oxide sputtering target, method of forming transparent conductive film and transparent conductive film

#57 | 2009-10-01 ✅ Patent 9,034,153 granted on 2015-05-19
US20090242393A1
Physics

Nonmagnetic material particle dispersed ferromagnetic material sputtering target

#58 | 2009-10-01 ✅ Patent 8,585,798 granted on 2013-11-19
US20090241736A1
Chemistry; metallurgy

Method for recovering metal from ore

#59 | 2009-09-17 ✅ Patent 9,677,170 granted on 2017-06-13
US20090229975A1
Chemistry; metallurgy

Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same

#60 | 2009-09-10 ✅ Patent 8,277,723 granted on 2012-10-02
US20090226341A1
Chemistry; metallurgy

High-purity hafnium, target and thin film comprising high-purity hafnium, and process for producing high-purity hafnium

#61 | 2009-08-20
US20090208762A1
Chemistry; metallurgy

Copper Foil for Printed Wiring Board

#62 | 2009-08-20 ✅ Patent 7,682,529 granted on 2010-03-23
US20090206303A1
Chemistry; metallurgy

Gallium oxide-zinc oxide sputtering target, method for forming transparent conductive film, and transparent conductive film

#63 | 2009-08-13 ✅ Patent 8,007,693 granted on 2011-08-30
US20090200525A1
Chemistry; metallurgy

Zinc oxide based transparent electric conductor, sputtering target for forming of the conductor and process for producing the target

#64 | 2009-08-13 ✅ Patent 9,136,533 granted on 2015-09-15
US20090200508A1
Electricity

Lithium nickel manganese cobalt composite oxide and lithium rechargeable battery

#65 | 2009-08-06 ✅ Patent 7,674,446 granted on 2010-03-09
US20090194898A1
Electricity

Hafnium silicide target for forming gate oxide film, and method for preparation thereof

#66 | 2009-07-09 ✅ Patent 8,118,984 granted on 2012-02-21
US20090173627A1
Chemistry; metallurgy

Sintered sputtering target made of refractory metals

#67 | 2009-07-02 ✅ Patent 8,062,486 granted on 2011-11-22
US20090166187A1
Chemistry; metallurgy

Lithium-containing transition metal oxide target, process for producing the same and lithium ion thin film secondary battery

#68 | 2009-06-25 ✅ Patent 8,449,987 granted on 2013-05-28
US20090162685A1
Electricity

Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil

#69 | 2009-06-04
US20090140430A1
Electricity

Copper Alloy Sputtering Target and Semiconductor Element Wiring

#70 | 2009-06-04 ✅ Patent 8,246,764 granted on 2012-08-21
US20090139863A1
Electricity

Copper alloy sputtering target and semiconductor element wiring

#71 | 2009-06-04 ✅ Patent 8,877,021 granted on 2014-11-04
US20090139859A1
Chemistry; metallurgy

Chromic oxide powder for sputtering target, and sputtering target manufactured from such chromic oxide powder

#72 | 2009-06-04 ✅ Patent 8,663,439 granted on 2014-03-04
US20090139858A1
Chemistry; metallurgy

Sputtering target for producing metallic glass membrane and manufacturing method thereof

#73 | 2009-05-28 ✅ Patent 8,425,696 granted on 2013-04-23
US20090134021A1
Chemistry; metallurgy

Sputtering target

#74 | 2009-05-21 ✅ Patent 7,674,441 granted on 2010-03-09
US20090126529A1
Chemistry; metallurgy

Highly pure hafnium material, target and thin film comprising the same and method for producing highly pure hafnium

#75 | 2009-05-14 ✅ Patent 7,799,301 granted on 2010-09-21
US20090121198A1
Chemistry; metallurgy

Cathode material for lithium secondary battery and manufacturing method thereof

#76 | 2009-05-14 ✅ Patent 7,686,985 granted on 2010-03-30
US20090120786A1
Chemistry; metallurgy

Gallium oxide-zinc oxide sputtering target, method of forming transparent conductive film, and transparent conductive film

#77 | 2009-05-07 ✅ Patent 9,732,413 granted on 2017-08-15
US20090114535A1
Chemistry; metallurgy

Ruthenium-alloy sputtering target

#78 | 2009-04-23
US20090104107A1
Chemistry; metallurgy

Methods of making and washing scorodite

#79 | 2009-04-23 ✅ Patent 7,927,879 granted on 2011-04-19
US20090104082A1
Performing operations; transporting

Zirconium crucible for melting analytical sample, method of preparing analytical sample and method of analysis

#80 | 2009-04-16
US20090098012A1
Chemistry; metallurgy

High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin

#81 | 2009-04-09
US20090090621A1
Chemistry; metallurgy

Erbium Sputtering Target and Manufacturing Method

#82 | 2009-04-02 ✅ Patent 7,699,965 granted on 2010-04-20
US20090085014A1
Chemistry; metallurgy

Zinc oxide-based transparent conductor and sputtering target for forming the transparent conductor

#83 | 2009-03-26 ✅ Patent 8,277,633 granted on 2012-10-02
US20090078584A1
Chemistry; metallurgy

Process for producing scorodite and recycling the post-scorodite-synthesis solution

#84 | 2009-03-19 ✅ Patent 7,947,106 granted on 2011-05-24
US20090071821A1
Chemistry; metallurgy

Sb-Te alloy powder for sintering, sintered compact sputtering target obtained by sintering said powder, and manufacturing method of Sb-Te alloy powder for sintering

#85 | 2009-03-12 ✅ Patent 7,789,948 granted on 2010-09-07
US20090064861A1
Chemistry; metallurgy

Hydrogen separation membrane, sputtering target for forming said hydrogen separation membrane, and manufacturing method thereof

#86 | 2009-03-05 ✅ Patent 8,262,816 granted on 2012-09-11
US20090057142A1
Electricity

Hafnium alloy target

#87 | 2009-03-05 ✅ Patent 8,728,255 granted on 2014-05-20
US20090057139A1
Chemistry; metallurgy

Pot-shaped copper sputtering target and manufacturing method thereof

#88 | 2009-02-26 ✅ Patent 7,991,501 granted on 2011-08-02
US20090055009A1
Physics

Method for determining machining plane of planar material, machining method and device for determining machining plane and flat surface machining device

#89 | 2009-02-26 ✅ Patent 8,449,845 granted on 2013-05-28
US20090053112A1
Performing operations; transporting

Zirconium crucible

#90 | 2009-02-26 ✅ Patent 8,241,438 granted on 2012-08-14
US20090050475A1
Electricity

Hafnium alloy target

#91 | 2009-02-12 ✅ Patent 8,697,233 granted on 2014-04-15
US20090042021A1
Chemistry; metallurgy

Metal-coated lipid bilayer vesicles and process for producing same

#92 | 2009-02-05 ✅ Patent 8,317,948 granted on 2012-11-27
US20090035174A1
Chemistry; metallurgy

Copper alloy for electronic materials

#93 | 2009-02-05 ✅ Patent 8,177,947 granted on 2012-05-15
US20090032392A1
Chemistry; metallurgy

Sputtering target

#94 | 2009-01-29 ✅ Patent 8,070,893 granted on 2011-12-06
US20090025840A1
Electricity

Cu—Ni—Si—Co—Cr copper alloy for electronic materials and method for manufacturing same

#95 | 2009-01-22
US20090022993A1
Chemistry; metallurgy

Copper alloy

#96 | 2009-01-08 ✅ Patent 9,653,270 granted on 2017-05-16
US20090008245A1
Electricity

Method for connecting magnetic substance target to backing plate, and magnetic substance target

#97 | 2009-01-01
US20090004498A1
Chemistry; metallurgy

Manufacturing Method of High Purity Nickel, High Purity Nickel, Sputtering Target formed from said High Purity Nickel, and Thin Film formed with said Sputtering Target

#98 | 2009-01-01 ✅ Patent 8,062,440 granted on 2011-11-22
US20090000704A1
Electricity

Hafnium alloy target and process for producing the same

#99 | 2008-12-04 ✅ Patent 7,718,095 granted on 2010-05-18
US20080299415A1
Chemistry; metallurgy

Sputtering target, thin film for optical information recording medium and process for producing the same

#100 | 2008-11-13
US20080277032A1
Performing operations; transporting

COPPER, COPPER ALLOY, AND MANUFACTURING METHOD THEREFOR

AssigneeID:

173971 ⎘