Erfurt
Germany
106
2019-11-28
89
2021-06-15
These are the the leading inventors for applications assigned to X-FAB SEMICONDUCTOR FOUNDRIES AG:
X-FAB SEMICONDUCTOR FOUNDRIES AG based in Erfurt, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Optical sensors in semiconductor devices
#2 | 2019-08-08 β Patent 11,417,757 granted on 2022-08-16Ohmic contacts in semiconductor devices
#3 | 2019-02-28 β Patent 10,446,675 granted on 2019-10-15Noff III-nitride high electron mobility transistor
#4 | 2018-06-21 β Patent 10,297,502 granted on 2019-05-21Isolation structure for micro-transfer-printable devices
#5 | 2018-06-14 β Patent 10,388,785 granted on 2019-08-20LDMOS transistors for CMOS technologies and an associated production method
#6 | 2018-06-07PHOTODIODE DEVICE AND METHOD OF MANUFACTURE
#7 | 2018-01-18 β Patent 10,068,935 granted on 2018-09-04Image lag free pixel
#8 | 2017-11-30 β Patent 10,181,429 granted on 2019-01-15Method for the formation of transistors PDSO1 and FDSO1 on a same substrate
#9 | 2017-10-05 β Patent 9,875,900 granted on 2018-01-23Method of fabricating a tunnel oxide layer and a tunnel oxide layer for a semiconductor device
#10 | 2017-06-22 β Patent 10,014,314 granted on 2018-07-03Semiconductor device and methods of manufacture thereof
#11 | 2017-05-18 β Patent 10,151,794 granted on 2018-12-11Sleek serial interface for a wrapper boundary register (device and method)
#12 | 2017-03-23 β Patent 10,074,681 granted on 2018-09-11Light shield for light sensitive elements
#13 | 2016-06-02 β Patent 10,031,003 granted on 2018-07-24Relative and absolute pressure sensor combined on chip
#14 | 2016-04-21 β Patent 9,543,504 granted on 2017-01-10Vertical hall sensors with reduced offset error
#15 | 2015-04-23 β Patent 9,627,213 granted on 2017-04-18Method of fabricating a tunnel oxide layer and a tunnel oxide layer for a semiconductor device
#16 | 2015-02-05 β Patent 9,153,716 granted on 2015-10-06Semiconductor component with a window opening as an interface for ambient coupling
#17 | 2014-12-18 β Patent 10,026,734 granted on 2018-07-17MOS device assembly
#18 | 2014-09-18 β Patent 9,524,963 granted on 2016-12-20Semiconductor device
#19 | 2014-08-21 β Patent 9,496,357 granted on 2016-11-15Semiconductor device
#20 | 2014-07-03SEMICONDUCTOR DEVICE
#21 | 2014-03-06 β Patent 9,304,104 granted on 2016-04-05Ion sensitive field effect transistor
#22 | 2014-02-13 β Patent 9,293,569 granted on 2016-03-22Bipolar transistor
#23 | 2013-12-05 β Patent 8,970,016 granted on 2015-03-03Semiconductor device
#24 | 2013-12-05 β Patent 10,529,866 granted on 2020-01-07Semiconductor device
#25 | 2013-09-05 β Patent 9,559,170 granted on 2017-01-31Electrostatic discharge protection devices
#26 | 2013-07-11 β Patent 9,224,856 granted on 2015-12-29LDMOS transistors for CMOS technologies and an associated production method
#27 | 2013-06-06 β Patent 9,793,338 granted on 2017-10-17Capacitor structures for semiconductor device
#28 | 2013-04-18HIGH VOLTAGE MOS TRANSISTOR
#29 | 2012-12-20 β Patent 8,841,186 granted on 2014-09-23Manufacturing of a semiconductor device and corresponding semiconductor device
#30 | 2012-10-25 β Patent 8,759,169 granted on 2014-06-24Method for producing silicon semiconductor wafers comprising a layer for integrating III-V semiconductor components
#31 | 2012-09-27 β Patent 9,059,110 granted on 2015-06-16Reduction of fluorine contamination of bond pads of semiconductor devices
#32 | 2012-09-27 β Patent 8,564,083 granted on 2013-10-22Vertical hall sensor and method for producing a vertical hall sensor
#33 | 2012-09-13 β Patent 8,793,116 granted on 2014-07-29Method for the construction of vertical power transistors with differing powers by combination of pre-defined part pieces
#34 | 2012-09-06 β Patent 8,546,207 granted on 2013-10-01Method for fabricating semiconductor wafers for the integration of silicon components with HEMTs, and appropriate semiconductor layer arrangement
#35 | 2012-08-23 β Patent 8,729,666 granted on 2014-05-20Ultra-low voltage coefficient capacitors
#36 | 2012-08-23 β Patent 9,331,211 granted on 2016-05-03PN junctions and methods
#37 | 2012-08-02 β Patent 9,985,237 granted on 2018-05-29Method of manufacturing an organic light emitting diode by lift-off
#38 | 2012-07-26 β Patent 8,865,553 granted on 2014-10-21Semiconductor component with a window opening as an interface for ambient coupling
#39 | 2012-06-28 β Patent 8,759,942 granted on 2014-06-24Semiconductor device comprising an isolation trench including semiconductor islands
#40 | 2012-05-24 β Patent 9,202,937 granted on 2015-12-01Semiconductor device
#41 | 2012-04-26 β Patent 8,530,999 granted on 2013-09-10Semiconductor component with isolation trench intersections
#42 | 2012-03-22 β Patent 8,736,021 granted on 2014-05-27Semiconductor device comprising a metal system including a separate inductor metal layer
#43 | 2012-02-09 β Patent 8,546,268 granted on 2013-10-01Manufacturing integrated circuit components having multiple gate oxidations
#44 | 2012-02-09 β Patent 8,722,506 granted on 2014-05-13Production of high alignment marks and such alignment marks on a semiconductor wafer
#45 | 2012-02-09 β Patent 8,741,676 granted on 2014-06-03Method of manufacturing OLED-on-silicon
#46 | 2011-10-13 β Patent 8,691,658 granted on 2014-04-08Orientation of an electronic CMOS structure with respect to a buried structure in the case of a bonded and thinned-back stack of semiconductor wafers
#47 | 2011-08-18 β Patent 9,748,383 granted on 2017-08-29Transistor
#48 | 2011-06-30 β Patent 8,921,945 granted on 2014-12-30High-voltage power transistor using SOI technology
#49 | 2011-06-16 β Patent 8,278,183 granted on 2012-10-02Production of isolation trenches with different sidewall dopings
#50 | 2011-06-02 β Patent 8,058,086 granted on 2011-11-15Self-organized pin-type nanostructures, and production thereof on silicon
#51 | 2011-06-02 β Patent 8,222,679 granted on 2012-07-17Semiconductor component with integrated hall effect sensor
#52 | 2011-05-05 β Patent 8,901,614 granted on 2014-12-02Location-related adjustment of the operating temperature distribution or power distribution of a semiconductor power component, and component for carrying out said method
#53 | 2011-02-17 β Patent 8,836,342 granted on 2014-09-16Test structure for highly accelerated electromigration tests for thick metallization systems of solid state integrated circuits
#54 | 2011-01-20 β Patent 8,645,895 granted on 2014-02-04Checking an ESD behavior of integrated circuits on the circuit level
#55 | 2010-12-30METHOD FOR TRANSFERRING AN EPITAXIAL LAYER FROM A DONOR WAFER TO A SYSTEM WAFER APPERTAINING TO MICROSYSTEMS TECHNOLOGY
#56 | 2010-12-09STRUCTURED LAYER DEPOSITION ON PROCESSED WAFERS USED IN MICROSYSTEM TECHNOLOGY
#57 | 2010-12-09 β Patent 8,207,031 granted on 2012-06-26Mask-saving production of complementary lateral high-voltage transistors with a RESURF structure
#58 | 2010-12-09 β Patent 8,247,884 granted on 2012-08-21Semiconductor structure for fabricating a handle wafer contact in a trench insulated SOI disc
#59 | 2010-12-02 β Patent 8,187,908 granted on 2012-05-29Light-blocking layer sequence having one or more metal layers for an integrated circuit and method for the production of the layer sequence
#60 | 2010-11-25 β Patent 8,823,095 granted on 2014-09-02MOS-power transistors with edge termination with small area requirement
#61 | 2010-11-11PRODUCTION OF ADJUSTMENT STRUCTURES FOR A STRUCTURED LAYER DEPOSITION ON A MICROSYSTEM TECHNOLOGY WAFER
#62 | 2010-10-07METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, AND A SEMICONDUCTOR DEVICE
#63 | 2010-09-23 β Patent 8,378,451 granted on 2013-02-19Capacitor and a method of manufacturing a capacitor
#64 | 2010-08-26MOS TRANSISTOR WITH A P-FIELD IMPLANT OVERLYING EACH END OF A GATE THEREOF
#65 | 2010-06-24METHOD FOR THE SELECTIVE ANTIREFLECTION COATING OF A SEMICONDUCTOR INTERFACE BY A PARTICULAR PROCESS IMPLEMENTATION
#66 | 2010-06-17 β Patent 8,405,157 granted on 2013-03-26Bipolar integration without additional masking steps
#67 | 2010-05-13 β Patent 8,258,557 granted on 2012-09-04Uses of self-organized needle-type nanostructures
#68 | 2010-04-22 β Patent 8,021,906 granted on 2011-09-20Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (MEMS) produced therewith
#69 | 2010-03-11CMOS CIRCUITS COMBINING HIGH VOLTAGE AND RF TECHNOLOGIES
#70 | 2010-02-11 β Patent 8,268,688 granted on 2012-09-18Production of VDMOS-transistors having optimized gate contact
#71 | 2010-02-04 β Patent 7,994,806 granted on 2011-08-09System and method for testing embedded circuits with test islands
#72 | 2009-12-24 β Patent 9,947,662 granted on 2018-04-17CMOS circuits suitable for low noise RF applications
#73 | 2009-12-24 β Patent 8,455,955 granted on 2013-06-04Transistor array with shared body contact and method of manufacturing
#74 | 2009-12-03ISOLATION TRENCH INTERSECTION STRUCTURE WITH REDUCED GAP WIDTH
#75 | 2009-10-22 β Patent 8,350,209 granted on 2013-01-08Production of self-organized pin-type nanostructures, and the rather extensive applications thereof
#76 | 2009-10-08BIPOLAR TRANSISTOR AND METHOD OF MAKING SUCH A TRANSISTOR
#77 | 2009-10-01 β Patent 7,973,385 granted on 2011-07-05Semiconductor device
#78 | 2009-09-24 β Patent 8,110,468 granted on 2012-02-07DMOS-transistor having improved dielectric strength of drain and source voltages
#79 | 2009-07-16BROADBAND ANTIREFLECTIVE OPTICAL COMPONENTS WITH CURVED SURFACES AND THEIR PRODUCTION
#80 | 2009-07-09Method and Device for Electrically Determining the Thickness of Semiconductor Membranes by Means of an Energy Input
#81 | 2009-06-25 β Patent 7,865,787 granted on 2011-01-04Testing embedded circuits with the aid of a separate supply voltage
#82 | 2009-06-11 β Patent 7,746,695 granted on 2010-06-29Non-volatile semiconductor latch using hot-electron injection devices
#83 | 2009-04-09ISOLATION TRENCH STRUCTURE FOR HIGH ELECTRIC STRENGTH
#84 | 2009-01-01 β Patent 8,448,101 granted on 2013-05-21Layout method for vertical power transistors having a variable channel width
#85 | 2009-01-01Vertical Pin or Nip Photodiode and Method for the Production which is Compatible with a Conventional Cmos-Process
#86 | 2008-12-25 β Patent 7,625,805 granted on 2009-12-01Passivation of deep isolating separating trenches with sunk covering layers
#87 | 2008-12-11 β Patent 7,935,606 granted on 2011-05-03Transistor manufacture
#88 | 2008-11-27 β Patent 7,989,921 granted on 2011-08-02Soi vertical bipolar power component
#89 | 2008-11-20 β Patent 8,053,897 granted on 2011-11-08Production of a carrier wafer contact in trench insulated integrated SOI circuits having high-voltage components
#90 | 2008-11-13 β Patent 7,989,310 granted on 2011-08-02Filling of insulation trenches using CMOS standard processes for creating dielectrically insulated areas on a SOI disk
#91 | 2008-10-30 β Patent 7,989,308 granted on 2011-08-02Creation of dielectrically insulating soi-technlogical trenches comprising rounded edges for allowing higher voltages
#92 | 2008-10-02 β Patent 8,190,415 granted on 2012-05-29Method for the construction of vertical power transistors with differing powers by combination of pre-defined part pieces
#93 | 2008-06-12 β Patent 7,517,813 granted on 2009-04-14Two-step oxidation process for semiconductor wafers
#94 | 2008-05-01Electrical Measurement Of The Thickness Of A Semiconductor Layer
#95 | 2008-02-21 β Patent 8,742,536 granted on 2014-06-03SOI disks comprising MEMS structures and filled isolating trenches having a defined cross-section
#96 | 2008-02-14 β Patent 7,790,569 granted on 2010-09-07Production of semiconductor substrates with buried layers by joining (bonding) semiconductor wafers
#97 | 2008-02-07 β Patent 8,129,255 granted on 2012-03-06Firm, insulating and electrically conducting connection of processed semiconductor wafers
#98 | 2008-01-17 β Patent 7,509,875 granted on 2009-03-31Electrical determination of the connection quality of a bonded wafer connection
#99 | 2007-08-23 β Patent 7,520,161 granted on 2009-04-21Tightness test for disk bond connections and test structure for carrying out said method
#100 | 2007-07-19 β Patent 7,491,925 granted on 2009-02-17Photodetector comprising a monolithically integrated transimpedance amplifier and evaluation electronics, and production method
Also check out X-FAB SEMICONDUCTOR FOUNDRIES AG's (Erfurt, Germany) applicant profile with 21 patent applications submitted.
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