Geraberg
Germany
14
2020-08-13
The entities that hold a legal rights for patent applications filed by inventor Knechtel Roy:
Roy Knechtel from Geraberg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon
#2 | 2020-08-13Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon
#3 | 2020-04-16Anodic bonding of a substrate of glass having contact vias to a substrate of silicon
#4 | 2019-06-27Electrically conductive via(s) in a semiconductor substrate and associated production method
#5 | 2017-10-12Electrically conductive via(s) in a semiconductor substrate and associated production method
#6 | 2010-12-30METHOD FOR TRANSFERRING AN EPITAXIAL LAYER FROM A DONOR WAFER TO A SYSTEM WAFER APPERTAINING TO MICROSYSTEMS TECHNOLOGY
#7 | 2010-12-09STRUCTURED LAYER DEPOSITION ON PROCESSED WAFERS USED IN MICROSYSTEM TECHNOLOGY
#8 | 2010-11-11PRODUCTION OF ADJUSTMENT STRUCTURES FOR A STRUCTURED LAYER DEPOSITION ON A MICROSYSTEM TECHNOLOGY WAFER
#9 | 2010-04-22Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (MEMS) produced therewith
#10 | 2008-02-14Production of semiconductor substrates with buried layers by joining (bonding) semiconductor wafers
#11 | 2008-02-07Firm, insulating and electrically conducting connection of processed semiconductor wafers
#12 | 2008-01-17Electrical determination of the connection quality of a bonded wafer connection
#13 | 2007-02-08Separating semiconductor wafers having exposed micromechanical structures into individual chips
#14 | 2006-06-15Production of an optoelectronic component that is enclosed in plastic, and corresponding methods
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