Taichung
Taiwan
57
2022-05-12
34
2022-08-09
These are the the leading inventors for applications assigned to LINGSEN PRECISION INDUSTRIES, LTD:
LINGSEN PRECISION INDUSTRIES, LTD based in Taichung, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Chip packaging method
#2 | 2020-06-30 ✅ Patent 10,696,543 granted on 2020-06-30Waterproof MEMS chip package structure
#3 | 2019-08-29 ✅ Patent 11,041,774 granted on 2021-06-22Pressure sensor package
#4 | 2019-06-27 ✅ Patent 10,312,169 granted on 2019-06-04Substrate and package module including the same
#5 | 2018-07-05 ✅ Patent 10,396,234 granted on 2019-08-27Package structure of long-distance sensor and packaging method of the same
#6 | 2018-07-05 ✅ Patent 10,103,286 granted on 2018-10-16Packaging method of long-distance sensor
#7 | 2018-07-05 ✅ Patent 10,090,427 granted on 2018-10-02Package structure of long-distance sensor and packaging method of the same
#8 | 2018-03-01 ✅ Patent 10,299,046 granted on 2019-05-21MEMS microphone package
#9 | 2018-03-01 ✅ Patent 10,362,377 granted on 2019-07-23MEMS microphone package
#10 | 2018-03-01 ✅ Patent 10,003,874 granted on 2018-06-19Microphone package structure
#11 | 2016-12-15 ✅ Patent 9,905,548 granted on 2018-02-27Optical module integrated package
#12 | 2016-05-05 ✅ Patent 9,478,693 granted on 2016-10-25Optical module package and its packaging method
#13 | 2016-04-28 ✅ Patent 9,618,415 granted on 2017-04-11Pressure sensor package
#14 | 2016-03-31 ✅ Patent 9,952,089 granted on 2018-04-24Optical sensing module and method of manufacturing the same
#15 | 2016-02-25 ✅ Patent 9,260,298 granted on 2016-02-16Stacked MEMS microphone packaging method
#16 | 2016-02-25 ✅ Patent 9,309,108 granted on 2016-04-12MEMS microphone packaging method
#17 | 2015-10-01 ✅ Patent 9,449,955 granted on 2016-09-20Optical module integrated package
#18 | 2015-07-02 ✅ Patent 9,312,402 granted on 2016-04-12Micro optical package structure with filtration layer and method for making the same
#19 | 2015-07-02 ✅ Patent 9,553,073 granted on 2017-01-24Chip stack structure using conductive film bridge adhesive technology
#20 | 2015-07-02 ✅ Patent 9,063,084 granted on 2015-06-23Gas sensor having micro-package structure and method for making the same
#21 | 2015-03-12 ✅ Patent 8,980,659 granted on 2015-03-17LED package and manufacturing process of same
#22 | 2015-01-29 ✅ Patent 9,647,178 granted on 2017-05-09Package structure of optical module having printed shielding layer and its method for packaging
#23 | 2015-01-29 ✅ Patent 9,190,398 granted on 2015-11-17Method for packaging an optical module
#24 | 2015-01-29 ✅ Patent 9,705,025 granted on 2017-07-11Package structure of an optical module
#25 | 2013-01-29 ✅ Patent 8,362,496 granted on 2013-01-29Optical module package unit
#26 | 2012-09-13 ✅ Patent 8,664,045 granted on 2014-03-04LED lamp strip and manufacturing process thereof
#27 | 2011-12-01 ✅ Patent 8,254,619 granted on 2012-08-28Microelectromechanical microphone carrier module
#28 | 2011-10-06 ✅ Patent 8,247,821 granted on 2012-08-21Pre-molded support mount of lead frame-type for LED light module
#29 | 2011-07-28MEMS MODULE PACKAGE
#30 | 2011-07-21 ✅ Patent 8,238,107 granted on 2012-08-07Cap for MEMS package
#31 | 2010-07-01 ✅ Patent 8,027,153 granted on 2011-09-27Lead frame for quad flat no-lead package
#32 | 2010-05-27LEAD FRAME
#33 | 2009-11-19FLIP-CHIP PROCESS BY PHOTO-CURING ADHESIVE
#34 | 2009-09-24IC PACKAGING PROCESS
#35 | 2009-09-24METHOD OF STACKING DIES FOR DIE STACK PACKAGE
#36 | 2009-09-24IC PACKAGE HAVING REDUCED THICKNESS
#37 | 2009-07-23IC PACKAGING PROCESS BY PHOTO-CURING ADHESIVE
#38 | 2009-07-16IC PACKAGING PROCESS
#39 | 2009-07-16PACKAGE FOR MEMS MICROPHONE
#40 | 2009-07-16METHOD OF ARRANGING STACKED CHIP BY PHOTO-CURING ADHESIVE
#41 | 2009-01-22METHOD OF FORMING PASSAGE THROUGH SUBSTRATE FOR MEMS MODULE
#42 | 2008-10-16PHOTOSENSITIVE CHIP PACKAGE
#43 | 2008-07-10CAP PACKAGE FOR MICRO ELECTRO-MECHANICAL SYSTEM CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE
#44 | 2008-07-10 ✅ Patent 7,511,373 granted on 2009-03-31Cap package for micro electro-mechanical system
#45 | 2008-07-10CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE
#46 | 2008-05-29MEMS module package
#47 | 2008-04-03MICRO ELECTRO-MECHANICAL SYSTEM MODULE PACKAGE CAPABLE OF MINIMIZING INTERFERENCE OF NOISES
#48 | 2008-03-13Micro electro-mechanical system module package
#49 | 2008-03-13PHOTOSENSITIVE CHIP MOLDING PACKAGE
#50 | 2008-03-13PHOTO-SENSITIVE CHIP MODULE PACKAGE
#51 | 2006-11-09Lead frame having contacting pins of different thickness
#52 | 2006-10-05Method of making substrate for integrated circuit
#53 | 2006-10-05Packaging substrate having adhesive-overflowing prevention structure
#54 | 2006-10-05 ✅ Patent 7,242,083 granted on 2007-07-10Substrate for IC package
#55 | 2006-10-05 ✅ Patent 7,154,169 granted on 2006-12-26Substrate for IC package
#56 | 2005-07-26 ✅ Patent 6,921,926 granted on 2005-07-26LED package and the process making the same
#57 | 2005-05-19Integrated circuit chip packaging process
Also check out LINGSEN PRECISION INDUSTRIES, LTD.'s (Taichung, Taiwan) applicant profile with 26 patent applications submitted.
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