BUC Cedex
France
9
2011-12-22
9
2013-10-01
These are the the leading inventors for applications assigned to 3D PLUS:
3D PLUS based in BUC Cedex, FR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method for positioning chips during the production of a reconstituted wafer
#2 | 2011-10-13 ✅ Patent 8,359,740 granted on 2013-01-29Process for the wafer-scale fabrication of electronic modules for surface mounting
#3 | 2010-11-04 ✅ Patent 8,136,237 granted on 2012-03-20Method of interconnecting electronic wafers
#4 | 2009-10-22 ✅ Patent 8,567,051 granted on 2013-10-29Process for the vertical interconnection of 3D electronic modules by vias
#5 | 2009-08-20 ✅ Patent 7,951,649 granted on 2011-05-31Process for the collective fabrication of 3D electronic modules
#6 | 2008-12-25 ✅ Patent 8,264,853 granted on 2012-09-113D electronic module
#7 | 2008-11-27 ✅ Patent 7,877,874 granted on 2011-02-01Process for the collective fabrication of 3D electronic modules
#8 | 2008-07-17 ✅ Patent 8,243,468 granted on 2012-08-14Low-thickness electronic module comprising a stack of electronic packages provided with connection balls
#9 | 2007-11-15 ✅ Patent 7,476,965 granted on 2009-01-13Electronic device with integrated heat distributor
210310 ⎘