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Assignee profile:

Toppan Forms Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

17

Last publication date:

2018-10-25

Patent Grants:

16

Last grant date:

2018-12-25

Top Inventors for applications by Toppan Forms Co., Ltd.

These are the the leading inventors for applications assigned to Toppan Forms Co., Ltd.:

Recent patent applications by Toppan Forms Co., Ltd.

Toppan Forms Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2018-10-25 ✅ Patent 10,162,989 granted on 2018-12-25
US20180307872A1
Physics

Sensing system

 #2 | 2018-05-31 ✅ Patent 10,477,679 granted on 2019-11-12
US20180153034A1
Electricity

Method for producing wiring board

 #3 | 2017-08-17 ✅ Patent 10,303,994 granted on 2019-05-28
US20170236048A1
Physics

Non-contract data receiving/transmitting body

 #4 | 2017-01-26 ✅ Patent 10,094,609 granted on 2018-10-09
US20170023288A1
Mechanical engineering

Refrigerant pack

 #5 | 2016-09-29 ✅ Patent 10,849,231 granted on 2020-11-24
US20160286653A1
Electricity

Laminate and circuit board

 #6 | 2016-06-02 ✅ Patent 10,074,818 granted on 2018-09-11
US20160155969A1
Electricity

Transistor

 #7 | 2015-11-19 ✅ Patent 9,834,360 granted on 2017-12-05
US20150330697A1
Mechanical engineering

Implement for constant-temperature storage and storage container housing the same

 #8 | 2014-10-09 ✅ Patent 9,604,489 granted on 2017-03-28
US20140299493A1
Performing operations; transporting

Card enclosed units, service providing sheets and information concealment sheet

 #9 | 2013-05-16 ✅ Patent 9,328,254 granted on 2016-05-03
US20130121872A1
Chemistry; metallurgy

Silver ink composition and substrate

 #10 | 2012-06-21 ✅ Patent 8,603,863 granted on 2013-12-10
US20120156831A1
Physics

Method of manufacturing card

 #11 | 2010-04-08 ✅ Patent 8,208,262 granted on 2012-06-26
US20100085718A1
Physics

Window base material, card with embedded module, and manufacturing method of card with embedded module

 #12 | 2008-08-14 ✅ Patent 8,020,772 granted on 2011-09-20
US20080191028A1
Electricity

Noncontact data receiver/transmiter

 #13 | 2008-02-21 ✅ Patent 8,042,742 granted on 2011-10-25
US20080042266A1
Electricity

Noncontact IC label and method and apparatus for manufacturing the same

 #14 | 2007-11-08
US20070259175A1
Physics

Tape with Built-In Ic Chip, Production Method Thereof, and Sheet with Built-In Ic Chip

 #15 | 2007-01-25 ✅ Patent 7,840,017 granted on 2010-11-23
US20070018446A1
Electricity

Audio message transfer sheet and manufacturing method thereof, and power supply circuit

 #16 | 2006-03-16 ✅ Patent 7,795,335 granted on 2010-09-14
US20060057451A1
Chemistry; metallurgy

Conductive polymer gel and process for producing the same actuator, patch label for ion introduction, bioeletrode, toner, conductive functional member antistatic sheet, printed circuit member, conductive paste, electrode for fuel cell, and fuel cell

 #17 | 2005-04-14 ✅ Patent 7,232,857 granted on 2007-06-19
US20050080181A1
Chemistry; metallurgy

Radiation hardenable adhesive composition containing dispersed natural rubber fine particles

Also check out TOPPAN FORMS CO., LTD.'s (Tokyo, Japan) applicant profile with 8 patent applications submitted.

AssigneeID:

22746 ⎘