Takuya Sekiguchi

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Takuya Sekiguchi

The entities that hold a legal rights for patent applications filed by inventor Sekiguchi Takuya:

Takuya Sekiguchi from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

JOINING MATERIAL AND METHOD OF PRODUCING JOINED BODY

JOINING MATERIAL AND METHOD OF PRODUCING JOINED BODY

SINTERED MATERIAL, METAL SINTERED COMPACT, METHOD FOR PRODUCING SINTERED MATERIAL, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY

Method for producing wiring board

WIRING BOARD

Silver ink composition, conductor and communication device

InventorID:

1708703 ⎘