Assignee profile:

Advanced Interconnect Materials, LLC

City:

Sendai-City

Country:

Japan

Published Applications:

4

Last publication date:

2010-08-12

Patent Grants:

4

Last grant date:

2013-05-28

Top Inventors for applications by Advanced Interconnect Materials, LLC

These are the the leading inventors for applications assigned to Advanced Interconnect Materials, LLC:

AssigneeID:

231193 ⎘