Teitokusha Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2009-02-05

Patent Grants:

Last grant date:

2011-01-04

Top Inventors for applications by Teitokusha Co., Ltd.

These are the the leading inventors for applications assigned to Teitokusha Co., Ltd.:

Kenji TANAKA 4 Osaka, Japan
Kimio Kitamura 4 Osaka, Japan
Masakazu Shimada 4 Toyama, Japan
Akira HAYASHIDA 4 Toyama, Japan

Masaaki UENO 3 Toyama, Japan
Toshimitsu Miyata 3 Toyama, Japan
Jyunichi Nishihara 3 Osaka, Japan
Masashi SUGISHITA 2 Toyama, Japan

Recent patent applications by Teitokusha Co., Ltd.

Teitokusha Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-02-05 ✅ Patent 7,863,204 granted on 2011-01-04

US20090035948A1

Electricity

Substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structure

#2 | 2009-01-15 ✅ Patent 8,116,618 granted on 2012-02-14

US20090016706A1

Electricity

Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices

#3 | 2009-01-15 ✅ Patent 9,184,069 granted on 2015-11-10

US20090014435A1

Electricity

Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator

#4 | 2009-01-15 ✅ Patent 8,158,911 granted on 2012-04-17

US20090014428A1

Electricity

Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and extending member

AssigneeID:

240549 ⎘