Advanced Interconnecte Materials, LLC

City:

Sendai

Country:

Japan

Published Applications:

Last publication date:

2009-10-01

Patent Grants:

Last grant date:

2010-07-13

Top Inventors for applications by Advanced Interconnecte Materials, LLC

These are the the leading inventors for applications assigned to Advanced Interconnecte Materials, LLC:

Akihiro Shibatomi 1 Sendai, Japan
Junichi Koike 1 Sendai, Japan

Recent patent applications by Advanced Interconnecte Materials, LLC

Advanced Interconnecte Materials, LLC based in Sendai, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-10-01 ✅ Patent 7,755,192 granted on 2010-07-13

US20090243112A1

Electricity

Copper interconnection structure, barrier layer including carbon and hydrogen

AssigneeID:

254346 ⎘