Nihon Superior Sha Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2009-11-12

Patent Grants:

Last grant date:

2012-04-24

Top Inventors for applications by Nihon Superior Sha Co., Ltd.

These are the the leading inventors for applications assigned to Nihon Superior Sha Co., Ltd.:

Tetsuro Nishimura 1 Osaka, Japan

Recent patent applications by Nihon Superior Sha Co., Ltd.

Nihon Superior Sha Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-11-12 ✅ Patent 8,163,061 granted on 2012-04-24

US20090277302A1

Chemistry; metallurgy

Method of copper precipitation in lead-free solder, granulation and separation of (CuX)Sncompounds and recovery of tin

AssigneeID:

256150 ⎘