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Inventor profile of:

Tetsuro Nishimura

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-07-18

Top Assignees for applications by Tetsuro Nishimura

The entities that hold a legal rights for patent applications filed by inventor Nishimura Tetsuro:

NIHON SUPERIOR CO., LTD. 12 Osaka, Japan
Nihon Superior Sha Co., Ltd. 6 , Japan
NIHON SUPERIOR SHA CO., LTD. 3 SUITA-SHI OSAKA, Japan
NIHON KOHDEN CORPORATION 1 Tokyo, Japan
Nihon Superior Sha Co., Ltd. 1 Osaka, Japan
KYOTO UNIVERSITY 1 Kyoto, Japan
National Institute of Advanced Industrial Science and Technology 1 Tokyo, Japan
KYOTO UNIVERSITY 1 Kyotos, Japan
Nihon Superior Co., Ltd. 1 , Japan

Recent patent applications by Nishimura Tetsuro

Tetsuro Nishimura from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-07-18

US20240238915A1

Performing operations; transporting

LEAD-FREE SOLDER PASTE

#2 | 2022-09-22

US20220297243A1

Performing operations; transporting

SOLDER PASTE AND SOLDER BONDED BODY

#3 | 2022-09-08

US20220281035A1

Performing operations; transporting

SOLDER-METAL MESH COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME

#4 | 2022-09-01

US20220274212A1

Performing operations; transporting

PREFORMED SOLDER AND SOLDER BONDED BODY FORMED BY USING SAID PREFORMED SOLDER

#5 | 2022-04-07

US20220105593A1

Performing operations; transporting

Lead-free solder alloy

#6 | 2022-01-20

US20220016733A1

Performing operations; transporting

Lead-free solder alloy and solder joint part

#7 | 2018-07-26

US20180206748A1

Human necessities

Lifesaving assisting apparatus

#8 | 2016-12-29

US20160375517A1

Performing operations; transporting

Solder wire bobbinless coil

#9 | 2016-02-04

US20160032424A1

Chemistry; metallurgy

Solder alloy and joint thereof

#10 | 2014-08-14

US20140224861A1

Performing operations; transporting

WIRE SOLDER, METHOD OF FEEDING THE SAME, AND APPARATUS AND SYSTEM THEREFOR

#11 | 2014-02-06

US20140037369A1

Performing operations; transporting

Lead-free solder alloy

#12 | 2012-11-15

US20120286026A1

Performing operations; transporting

WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR

#13 | 2012-11-08

US20120280020A1

Performing operations; transporting

WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR

#14 | 2011-11-10

US20110272454A1

Performing operations; transporting

WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR

#15 | 2011-09-15

US20110220247A1

Chemistry; metallurgy

Flux composition and soldering paste composition

#16 | 2010-12-09

US20100307292A1

Chemistry; metallurgy

Method of regulating nickel concentration in lead-free solder containing nickel

#17 | 2010-10-21

US20100266870A1

Chemistry; metallurgy

Solder joint

#18 | 2010-01-14

US20100007068A1

Chemistry; metallurgy

Apparatus for precipitation/separation of excess copper in lead-free solder

#19 | 2009-11-26

US20090289102A1

Performing operations; transporting

Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath

#20 | 2009-11-12

US20090277302A1

Chemistry; metallurgy

Method of copper precipitation in lead-free solder, granulation and separation of (CuX)Sncompounds and recovery of tin

#21 | 2008-09-11

US20080216605A1

Chemistry; metallurgy

Method of copper precipitation in lead-free solder, granulation and separation of (CuX)Sncompounds and recovery of tin

InventorID:

640074 ⎘