ADVANCED INTERCONNECT MATERIALS, LLC

City:

Sendai-shi, Miyagi

Country:

Japan

Published Applications:

Last publication date:

2013-07-04

Patent Grants:

Last grant date:

2014-11-25

Top Inventors for applications by ADVANCED INTERCONNECT MATERIALS, LLC

These are the the leading inventors for applications assigned to ADVANCED INTERCONNECT MATERIALS, LLC:

Hideaki KAWAKAMI 1 Chiba-shi, Japan
Hideaki Kawakami 1 Chiba, Japan
Pilsang Yun 1 Sendai-shi, Japan
Junichi KOIKE 1 Sendai-shi, Japan

Pilsang Yun 1 Sendai, Japan
Junichi Koike 1 Sendai, Japan

Recent patent applications by ADVANCED INTERCONNECT MATERIALS, LLC

ADVANCED INTERCONNECT MATERIALS, LLC based in Sendai-shi, Miyagi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-07-04 ✅ Patent 8,895,978 granted on 2014-11-25

US20130168671A1

Electricity

Semiconductor device

Also check out Advanced Interconnect Materials, LLC's (Sendai-shi, Miyagi, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

28626 ⎘