Singapore
Singapore
37
2012-01-26
37
2015-05-19
These are the the leading inventors for applications assigned to ST Assembly Test Services Ltd.:
ST Assembly Test Services Ltd. based in Singapore, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Integrated circuit package with open substrate and method of manufacturing thereof
#2 | 2010-06-10 ✅ Patent 8,035,204 granted on 2011-10-11Large die package structures and fabrication method therefor
#3 | 2010-02-18 ✅ Patent 8,030,783 granted on 2011-10-04Integrated circuit package with open substrate
#4 | 2009-11-05 ✅ Patent 8,207,598 granted on 2012-06-26Semiconductor package heat spreader
#5 | 2007-12-11 ✅ Patent 7,306,133 granted on 2007-12-11System for fabricating an integrated circuit package on a printed circuit board
#6 | 2007-10-04 ✅ Patent 7,786,593 granted on 2010-08-31Integrated circuit die with pedestal
#7 | 2007-08-16 ✅ Patent 7,413,933 granted on 2008-08-19Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
#8 | 2007-05-15 ✅ Patent 7,217,599 granted on 2007-05-15Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
#9 | 2007-01-25 ✅ Patent 7,700,404 granted on 2010-04-20Large die package structures and fabrication method therefor
#10 | 2006-11-14 ✅ Patent 7,135,760 granted on 2006-11-14Moisture resistant integrated circuit leadframe package
#11 | 2006-09-07 ✅ Patent 7,443,039 granted on 2008-10-28System for different bond pads in an integrated circuit package
#12 | 2006-09-07 ✅ Patent 7,960,816 granted on 2011-06-14Semiconductor package with passive device integration
#13 | 2006-08-24 ✅ Patent 7,339,258 granted on 2008-03-04Dual row leadframe and fabrication method
#14 | 2006-06-20 ✅ Patent 7,064,420 granted on 2006-06-20Integrated circuit leadframe with ground plane
#15 | 2006-03-16 ✅ Patent 7,626,277 granted on 2009-12-01Integrated circuit package with open substrate
#16 | 2006-02-09 ✅ Patent 7,381,593 granted on 2008-06-03Method and apparatus for stacked die packaging
#17 | 2006-01-19 ✅ Patent 7,242,101 granted on 2007-07-10Integrated circuit die with pedestal
#18 | 2005-12-15 ✅ Patent 7,008,820 granted on 2006-03-07Chip scale package with open substrate
#19 | 2005-11-24 ✅ Patent 7,060,536 granted on 2006-06-13Dual row leadframe and fabrication method
#20 | 2005-11-24 ✅ Patent 7,091,469 granted on 2006-08-15Packaging for optoelectronic devices
#21 | 2005-11-17 ✅ Patent 7,005,370 granted on 2006-02-28Method of manufacturing different bond pads on the same substrate of an integrated circuit package
#22 | 2005-11-17 ✅ Patent 7,129,569 granted on 2006-10-31Large die package structures and fabrication method therefor
#23 | 2005-11-03 ✅ Patent 7,327,025 granted on 2008-02-05Heat spreader for thermally enhanced semiconductor package
#24 | 2005-10-27 ✅ Patent 7,595,551 granted on 2009-09-29Semiconductor package for a large die
#25 | 2005-10-20 ✅ Patent 7,205,651 granted on 2007-04-17Thermally enhanced stacked die package and fabrication method
#26 | 2005-08-11 ✅ Patent 7,005,325 granted on 2006-02-28Semiconductor package with passive device integration
#27 | 2005-08-09 ✅ Patent 6,927,479 granted on 2005-08-09Method of manufacturing a semiconductor package for a die larger than a die pad
#28 | 2005-07-28 ✅ Patent 7,153,725 granted on 2006-12-26Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
#29 | 2005-05-26 ✅ Patent 7,575,956 granted on 2009-08-18Fabrication method for semiconductor package heat spreaders
#30 | 2005-04-28 ✅ Patent 7,309,913 granted on 2007-12-18Stacked semiconductor packages
#31 | 2005-04-28 ✅ Patent 7,091,596 granted on 2006-08-15Semiconductor packages and leadframe assemblies
#32 | 2005-03-10 ✅ Patent 6,979,907 granted on 2005-12-27Integrated circuit package
#33 | 2005-03-03 ✅ Patent 7,863,730 granted on 2011-01-04Array-molded package heat spreader and fabrication method therefor
#34 | 2005-03-01 ✅ Patent 6,861,288 granted on 2005-03-01Stacked semiconductor packages and method for the fabrication thereof
#35 | 2005-02-22 ✅ Patent 6,858,470 granted on 2005-02-22Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof
#36 | 2005-02-15 ✅ Patent 6,855,573 granted on 2005-02-15Integrated circuit package and manufacturing method therefor with unique interconnector
#37 | 2005-01-13 ✅ Patent 6,960,493 granted on 2005-11-01Semiconductor device package
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