Won Sun Shin

City:

Suwon

Country:

South Korea

Published Applications:

Last publication date:

2007-12-11

Top Assignees for applications by Won Sun Shin

The entities that hold a legal rights for patent applications filed by inventor Shin Won Sun:

Won Sun Shin from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

System for fabricating an integrated circuit package on a printed circuit board

System for different bond pads in an integrated circuit package

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

InventorID:

6080990 ⎘