Assignee profile:

SENIC Inc.

City:

Cheonan-si

Country:

South Korea

Published Applications:

21

Last publication date:

2024-03-07

Patent Grants:

17

Last grant date:

2025-04-08

Top Inventors for applications by SENIC Inc.

These are the the leading inventors for applications assigned to SENIC Inc.:

Recent patent applications by SENIC Inc.

SENIC Inc. based in Cheonan-si, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-03-07
US20240076799A1
Chemistry; metallurgy

WAFER MANUFACTURING METHOD, EPITAXIAL WAFER MANUFACTURING METHOD, AND WAFER AND EPITAXIAL WAFER MANUFACTURED THEREBY

#2 | 2023-06-29
US20230203708A1
Chemistry; metallurgy

SILICON CARBIDE INGOT MANUFACTURING METHOD, SILICON CARBIDE INGOTS, AND GROWTH SYSTEM THEREFOR

#3 | 2022-12-22 ✅ Patent 12,270,122 granted on 2025-04-08
US20220403551A1
Chemistry; metallurgy

Silicon carbide wafer and semiconductor device

#4 | 2022-10-27
US20220341055A1
Chemistry; metallurgy

SILICON CARBIDE INGOT, METHOD OF PREPARING THE SAME, AND METHOD FOR PREPARING SILICON CARBIDE WAFER

#5 | 2022-10-06 ✅ Patent 12,136,653 granted on 2024-11-05
US20220320296A1
Electricity

Silicon carbide wafer and semiconductor device applied the same

#6 | 2022-07-14
US20220220632A1
Chemistry; metallurgy

SILICON CARBIDE INGOT MANUFACTURING METHOD AND SILICON CARBIDE INGOT MANUFACTURED THEREBY

#7 | 2022-07-14 ✅ Patent 11,969,917 granted on 2024-04-30
US20220219354A1
Performing operations; transporting

Manufacturing method of silicon carbide wafer, silicon carbide wafer and system for manufacturing wafer

#8 | 2022-05-19 ✅ Patent 11,862,685 granted on 2024-01-02
US20220157944A1
Electricity

Wafer and method of manufacturing wafer

#9 | 2022-03-24 ✅ Patent 11,646,209 granted on 2023-05-09
US20220093419A1
Electricity

Method of cleaning wafer and wafer with reduced impurities

#10 | 2022-03-24 ✅ Patent 12,320,033 granted on 2025-06-03
US20220090295A1
Chemistry; metallurgy

Silicon carbide wafer and method of preparing the same

#11 | 2022-03-03 ✅ Patent 11,339,497 granted on 2022-05-24
US20220064817A1
Chemistry; metallurgy

Silicon carbide ingot manufacturing method and silicon carbide ingot manufactured thereby

#12 | 2021-12-16 ✅ Patent 11,566,344 granted on 2023-01-31
US20210388527A1
Chemistry; metallurgy

Silicon carbide ingot, wafer, method for producing a silicon carbide ingot, and method for manufacturing a wafer

#13 | 2021-12-02 ✅ Patent 11,939,698 granted on 2024-03-26
US20210372005A1
Chemistry; metallurgy

Wafer manufacturing method, epitaxial wafer manufacturing method, and wafer and epitaxial wafer manufactured thereby

#14 | 2021-12-02 ✅ Patent 11,795,572 granted on 2023-10-24
US20210372003A1
Chemistry; metallurgy

Method of manufacturing a silicon carbide ingot comprising moving a heater surrounding a reactor to induce silicon carbide raw materials to sublimate and growing the silicon carbide ingot on a seed crystal

#15 | 2021-10-14 ✅ Patent 11,591,711 granted on 2023-02-28
US20210317593A1
Chemistry; metallurgy

Method and system for producing silicon carbide ingot

#16 | 2021-04-29 ✅ Patent 11,856,678 granted on 2023-12-26
US20210127462A1
Electricity

Method of measuring a graphite article, apparatus for a measurement, and ingot growing system

#17 | 2021-04-29 ✅ Patent 11,474,012 granted on 2022-10-18
US20210123843A1
Physics

Method for preparing silicon carbide wafer and silicon carbide wafer

#18 | 2021-04-29 ✅ Patent 11,708,644 granted on 2023-07-25
US20210123160A1
Chemistry; metallurgy

Method for preparing SiC ingot, method for preparing SiC wafer and the SiC wafer prepared therefrom

#19 | 2021-04-29 ✅ Patent 11,359,306 granted on 2022-06-14
US20210123157A1
Chemistry; metallurgy

Method for preparing a SiC ingot and device for preparing a SiC ingot wherein electrical resistance of crucible body is 2.9 ohms or more

#20 | 2021-04-22 ✅ Patent 11,466,383 granted on 2022-10-11
US20210115592A1
Chemistry; metallurgy

Silicon carbide ingot, method of preparing the same, and method for preparing silicon carbide wafer

#21 | 2021-04-22 ✅ Patent 11,447,889 granted on 2022-09-20
US20210115587A1
Chemistry; metallurgy

Adhesive layer of seed crystal, method for preparing a laminate using the same, and method for preparing a wafer

Also check out SENIC INC.'s (Cheonan-si, South Korea) applicant profile with 18 patent applications submitted.

AssigneeID:

323980 ⎘