Polyplastics-Evonik Corporation

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-06-04

Patent Grants:

Last grant date:

2025-11-18

Top Inventors for applications by Polyplastics-Evonik Corporation

These are the the leading inventors for applications assigned to Polyplastics-Evonik Corporation:

DAISUKE FUJIKI 4 TOKYO, Japan
Yoshiki NAKAIE 4 Tokyo, Japan
Mitsuteru MUTSUDA 3 Tokyo, Japan
Mitsuteru MUTSUDA 2 Minato-ku, Tokyo, Japan

Takuya OCHIAI 2 Tokyo, Japan
Keisuke TANAKA 1 Anjo-shi, Aichi, Japan
Toshihiko FUJINAKA 1 Tokyo, Japan
Tatsuki AKASHI 1 Shinjuku-ku, Tokyo, Japan

Rei SATO 1 Nagoya-shi, Japan
Yosuke Onoue 1 Nagoya-shi, Japan
Hiroyuki NISHIMURA 1 Anjo-shi, Aichi, Japan
Yuji KONDO 1 Anjo-shi, Aichi, Japan

Daisuke FUJIKI 1 Shinjuku-ku, Tokyo, Japan
Takuya OCHIAI 1 Shinjuku-ku, Tokyo, Japan
Kazuya Okubo 1 Nagoya-shi, Japan

Recent patent applications by Polyplastics-Evonik Corporation

Polyplastics-Evonik Corporation based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-06-04

US20260152633A1

Chemistry; metallurgy

THERMOSETTING RESIN COMPOSITION AND THERMOSET PRODUCT

#2 | 2026-03-19

US20260078256A1

Chemistry; metallurgy

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

#3 | 2025-08-07

US20250250472A1

Chemistry; metallurgy

RESIN COMPOSITION FOR ADHESIVE LAYER, AND MULTILAYER TUBE

#4 | 2025-04-17

US20250121581A1

Performing operations; transporting

FOAMED BODY, FOAMED FILM, AND LAMINATED FILM

#5 | 2024-10-31

US20240360307A1

Chemistry; metallurgy

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

#6 | 2024-10-17

US20240343904A1

Chemistry; metallurgy

THERMOPLASTIC RESIN COMPOSITION, RESIN SHEET, AND LAMINATED SHEET

#7 | 2023-08-03 ✅ Patent 12,472,667 granted on 2025-11-18

US20230241816A1

Performing operations; transporting

LAMINATE, METHOD FOR PRODUCING SAME, AND USE OF SAME

Also check out POLYPLASTICS-EVONIK CORPORATION's (Tokyo, Japan) applicant profile with 7 patent applications submitted.

AssigneeID:

340018 ⎘