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Inventor profile of:

DAISUKE FUJIKI

City:

TOKYO

Country:

Japan

Published Applications:

8

Last publication date:

2026-06-04

Top Assignees for applications by DAISUKE FUJIKI

The entities that hold a legal rights for patent applications filed by inventor FUJIKI DAISUKE:

  • Polyplastics-Evonik Corporation 4 Tokyo, Japan
  • BASF SE 3 Ludwigshafen, Germany
  • DAICEL-EVONIK LTD. 1 Tokyo, Japan

Recent patent applications by FUJIKI DAISUKE

DAISUKE FUJIKI from TOKYO, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-04
US20260152633A1
Chemistry; metallurgy

THERMOSETTING RESIN COMPOSITION AND THERMOSET PRODUCT

#2 | 2026-03-19
US20260078256A1
Chemistry; metallurgy

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

#3 | 2024-10-31
US20240360307A1
Chemistry; metallurgy

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

#4 | 2023-08-03
US20230241816A1
Performing operations; transporting

LAMINATE, METHOD FOR PRODUCING SAME, AND USE OF SAME

#5 | 2021-12-02
US20210370649A1
Performing operations; transporting

Laminate

#6 | 2014-05-15
US20140130865A1
Electricity

PHOTOVOLTAIC MODULE WITH STABILIZED POLYMERIC ENCAPSULANT

#7 | 2012-06-14
US20120145241A1
Electricity

PHOTOVOLTAIC MODULE WITH STABILIZED POLYMERIC ENCAPSULANT

#8 | 2012-06-14
US20120145236A1
Performing operations; transporting

UV-STABILIZED PHOTOVOLTAIC MODULE

InventorID:

758188 ⎘

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