Taoyuan
Taiwan
165
2024-04-04
165
2025-11-18
These are the the leading inventors for applications assigned to Xintec Inc.:
Xintec Inc. based in Taoyuan, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#2 | 2024-03-26 ✅ Patent 11,942,563 granted on 2024-03-26Manufacturing method of chip package and chip package
#3 | 2023-12-28 ✅ Patent 12,341,109 granted on 2025-06-24CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#4 | 2023-11-16 ✅ Patent 12,272,712 granted on 2025-04-08Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region
#5 | 2023-11-16 ✅ Patent 12,463,102 granted on 2025-11-04SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#6 | 2023-09-07 ✅ Patent 12,487,144 granted on 2025-12-02LEAKAGE DETECTING ASSEMBLY AND SHEET LEAKAGE DETECTING MODULE
#7 | 2023-07-27 ✅ Patent 12,477,848 granted on 2025-11-18CHIP PACKAGE AND METHOD FOR FORMING THE SAME
#8 | 2023-03-16 ✅ Patent 12,424,567 granted on 2025-09-23CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#9 | 2023-02-16 ✅ Patent 11,749,618 granted on 2023-09-05Chip package including substrate having through hole and redistribution line
#10 | 2022-12-01 ✅ Patent 12,388,034 granted on 2025-08-12CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#11 | 2022-10-27 ✅ Patent 11,973,095 granted on 2024-04-30Method for forming chip package with second opening surrounding first opening having conductive structure therein
#12 | 2022-10-20 ✅ Patent 11,505,457 granted on 2022-11-22Semiconductor removing apparatus and operation method thereof
#13 | 2022-09-08 ✅ Patent 12,237,354 granted on 2025-02-25Chip package and method for forming the same
#14 | 2022-07-14 ✅ Patent 11,746,003 granted on 2023-09-05Chip package
#15 | 2022-05-19 ✅ Patent 11,935,859 granted on 2024-03-19Chip structure and manufacturing method thereof
#16 | 2022-03-03 ✅ Patent 11,695,199 granted on 2023-07-04Antenna device and manufacturing method thereof
#17 | 2021-11-04 ✅ Patent 11,705,368 granted on 2023-07-18Manufacturing method of chip package and chip package
#18 | 2021-11-02 ✅ Patent 11,164,853 granted on 2021-11-02Chip package and manufacturing method thereof
#19 | 2021-09-02 ✅ Patent 11,873,212 granted on 2024-01-16Chip package and manufacturing method thereof
#20 | 2021-07-08 ✅ Patent 11,784,134 granted on 2023-10-10Chip package and manufacturing method thereof
#21 | 2021-07-08 ✅ Patent 11,521,938 granted on 2022-12-06Chip package including substrate inclined sidewall and redistribution line
#22 | 2021-05-27 ✅ Patent 11,355,659 granted on 2022-06-07Chip package and manufacturing method thereof
#23 | 2021-04-08 ✅ Patent 11,107,759 granted on 2021-08-31Chip package and manufacturing method thereof
#24 | 2021-03-18 ✅ Patent 11,387,201 granted on 2022-07-12Chip package and manufacturing method thereof
#25 | 2021-03-04 ✅ Patent 11,476,293 granted on 2022-10-18Manufacturing method of chip package
#26 | 2021-02-04 ✅ Patent 11,309,271 granted on 2022-04-19Chip structure and manufacturing method thereof
#27 | 2021-02-04 ✅ Patent 11,319,208 granted on 2022-05-03Chip package and manufacturing method thereof
#28 | 2020-10-22 ✅ Patent 11,137,559 granted on 2021-10-05Optical chip package and method for forming the same
#29 | 2020-05-07 ✅ Patent 11,121,031 granted on 2021-09-14Manufacturing method of chip package and chip package
#30 | 2020-04-30 ✅ Patent 11,310,904 granted on 2022-04-19Chip package and power module
#31 | 2020-04-09 ✅ Patent 11,056,427 granted on 2021-07-06Chip package
#32 | 2020-03-26 ✅ Patent 11,450,697 granted on 2022-09-20Chip package with substrate having first opening surrounded by second opening and method for forming the same
#33 | 2020-02-06 ✅ Patent 10,950,738 granted on 2021-03-16Chip package and method for forming the same
#34 | 2019-09-05 ✅ Patent 11,038,077 granted on 2021-06-15Chip package and manufacturing method thereof
#35 | 2019-05-09 ✅ Patent 10,714,528 granted on 2020-07-14Chip package and manufacturing method thereof
#36 | 2018-11-22 ✅ Patent 10,446,504 granted on 2019-10-15Chip package and method for forming the same
#37 | 2018-06-21 ✅ Patent 10,461,117 granted on 2019-10-29Semiconductor structure and method for manufacturing semiconductor structure
#38 | 2018-06-21 ✅ Patent 10,056,419 granted on 2018-08-21Chip package having chip connected to sensing device with redistribution layer in insulator layer
#39 | 2018-04-12 ✅ Patent 10,424,540 granted on 2019-09-24Chip package and method for forming the same
#40 | 2017-11-16 ✅ Patent 10,347,616 granted on 2019-07-09Chip package and manufacturing method thereof
#41 | 2017-09-28 ✅ Patent 10,157,811 granted on 2018-12-18Chip package and method for forming the same
#42 | 2017-09-21 ✅ Patent 10,153,237 granted on 2018-12-11Chip package and method for forming the same
#43 | 2017-07-27 ✅ Patent 9,853,074 granted on 2017-12-26Chip scale sensing chip package
#44 | 2017-07-27 ✅ Patent 10,050,006 granted on 2018-08-14Chip package and method for forming the same
#45 | 2017-07-20 ✅ Patent 9,997,473 granted on 2018-06-12Chip package and method for forming the same
#46 | 2017-06-29 ✅ Patent 9,859,320 granted on 2018-01-02Chip package and manufacturing method thereof
#47 | 2017-06-22 ✅ Patent 9,780,251 granted on 2017-10-03Semiconductor structure and manufacturing method thereof
#48 | 2017-05-25 ✅ Patent 9,947,716 granted on 2018-04-17Chip package and manufacturing method thereof
#49 | 2017-05-25 ✅ Patent 9,875,912 granted on 2018-01-23Chip package and manufacturing method thereof
#50 | 2017-04-27 ✅ Patent 10,140,498 granted on 2018-11-27Wafer-level packaging sensing device and method for forming the same
#51 | 2017-03-16 ✅ Patent 10,109,663 granted on 2018-10-23Chip package and method for forming the same
#52 | 2017-03-16 ✅ Patent 9,768,067 granted on 2017-09-19Chip package and manufacturing method thereof
#53 | 2017-02-23 ✅ Patent 9,711,425 granted on 2017-07-18Sensing module and method for forming the same
#54 | 2017-02-16 ✅ Patent 9,780,050 granted on 2017-10-03Method of fabricating chip package with laser
#55 | 2017-02-09 ✅ Patent 9,887,229 granted on 2018-02-06Sensing chip package and a manufacturing method thereof
#56 | 2017-01-19 ✅ Patent 9,935,148 granted on 2018-04-03Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer
#57 | 2016-12-29 ✅ Patent 10,318,784 granted on 2019-06-11Touch panel-sensing chip package module complex and a manufacturing method thereof
#58 | 2016-12-22 ✅ Patent 9,966,358 granted on 2018-05-08Chip package
#59 | 2016-11-24 ✅ Patent 9,799,778 granted on 2017-10-24Chip package having a trench exposed protruding conductive pad
#60 | 2016-11-10 ✅ Patent 9,613,904 granted on 2017-04-04Semiconductor structure and manufacturing method thereof
#61 | 2016-11-03 ✅ Patent 9,972,584 granted on 2018-05-15Chip package and manufacturing method thereof
#62 | 2016-11-03 ✅ Patent 9,831,185 granted on 2017-11-28Chip package and fabrication method thereof
#63 | 2016-10-27 ✅ Patent 9,793,234 granted on 2017-10-17Chip package and manufacturing method thereof
#64 | 2016-10-27 ✅ Patent 9,548,265 granted on 2017-01-17Chip package and manufacturing method thereof
#65 | 2016-10-20 ✅ Patent 10,388,541 granted on 2019-08-20Wafer coating system and method of manufacturing chip package
#66 | 2016-09-15 ✅ Patent 10,152,180 granted on 2018-12-11Chip scale sensing chip package and a manufacturing method thereof
#67 | 2016-09-01 ✅ Patent 9,875,924 granted on 2018-01-23Spray coater and ring-shaped structure thereof
#68 | 2016-07-28 ✅ Patent 9,450,015 granted on 2016-09-20Manufacturing method of semiconductor structure
#69 | 2016-07-28 ✅ Patent 9,978,788 granted on 2018-05-22Photosensitive module and method for forming the same
#70 | 2016-07-28 ✅ Patent 9,966,400 granted on 2018-05-08Photosensitive module and method for forming the same
#71 | 2016-07-21 ✅ Patent 10,833,118 granted on 2020-11-10Chip package and manufacturing method thereof
#72 | 2016-07-21 ✅ Patent 9,812,413 granted on 2017-11-07Chip module and method for forming the same
#73 | 2016-06-30 ✅ Patent 9,640,405 granted on 2017-05-02Chip package having a laser stop structure
#74 | 2016-06-23 ✅ Patent 9,613,919 granted on 2017-04-04Chip package and method for forming the same
#75 | 2016-06-16 ✅ Patent 10,049,252 granted on 2018-08-14Chip package and fabrication method thereof
#76 | 2016-05-19 ✅ Patent 9,640,488 granted on 2017-05-02Chip package and method for forming the same
#77 | 2016-05-19 ✅ Patent 9,704,772 granted on 2017-07-11Chip package and method for forming the same
#78 | 2016-05-12 ✅ Patent 9,721,911 granted on 2017-08-01Chip package and manufacturing method thereof
#79 | 2016-05-12 ✅ Patent 9,543,233 granted on 2017-01-10Chip package having a dual through hole redistribution layer structure
#80 | 2016-04-28 ✅ Patent 9,570,633 granted on 2017-02-14Semiconductor package and manufacturing method thereof
#81 | 2016-04-21 ✅ Patent 9,406,818 granted on 2016-08-02Chip package and method of manufacturing the same
#82 | 2016-04-07 ✅ Patent 9,865,526 granted on 2018-01-09Chip package and method for forming the same
#83 | 2016-03-24 ✅ Patent 9,355,970 granted on 2016-05-31Chip package and method for forming the same
#84 | 2016-02-25 ✅ Patent 9,771,259 granted on 2017-09-26Method for fabricating electronic device package
#85 | 2016-02-18 ✅ Patent 9,881,959 granted on 2018-01-30Chip package and method of manufacturing the same
#86 | 2016-02-11 ✅ Patent 10,096,635 granted on 2018-10-09Semiconductor structure and manufacturing method thereof
#87 | 2016-02-11 ✅ Patent 9,403,672 granted on 2016-08-02Chip package and method of manufacturing the same
#88 | 2016-02-11 ✅ Patent 9,334,156 granted on 2016-05-10Chip package and method thereof
#89 | 2015-11-26 ✅ Patent 9,419,050 granted on 2016-08-16Manufacturing method of semiconductor structure with protein tape
#90 | 2015-11-26 ✅ Patent 9,711,469 granted on 2017-07-18Semiconductor structure having recess and manufacturing method thereof
#91 | 2015-11-12 ✅ Patent 10,157,875 granted on 2018-12-18Chip package and method for forming the same
#92 | 2015-11-12 ✅ Patent 9,761,510 granted on 2017-09-12Chip package and method for forming the same
#93 | 2015-11-05 ✅ Patent 9,236,429 granted on 2016-01-12Semiconductor structure and manufacturing method thereof
#94 | 2015-10-29 ✅ Patent 9,633,935 granted on 2017-04-25Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#95 | 2015-10-15 ✅ Patent 9,269,837 granted on 2016-02-23Chip package and method of manufacturing the same
#96 | 2015-10-08 ✅ Patent 9,337,115 granted on 2016-05-10Chip package and method for forming the same
#97 | 2015-10-08 ✅ Patent 9,685,354 granted on 2017-06-20Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus
#98 | 2015-10-08 ✅ Patent 9,611,143 granted on 2017-04-04Method for forming chip package
#99 | 2015-10-01 ✅ Patent 9,397,138 granted on 2016-07-19Manufacturing method of semiconductor structure
#100 | 2015-10-01 ✅ Patent 9,653,422 granted on 2017-05-16Chip package and method for forming the same
Also check out XINTEC INC.'s (Taoyuan, Taiwan) applicant profile with 105 patent applications submitted.
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