Ming-Kun Yang

City:

Pingzhen

Country:

Taiwan

Published Applications:

Last publication date:

2012-08-02

Top Assignees for applications by Ming-Kun Yang

The entities that hold a legal rights for patent applications filed by inventor Yang Ming-Kun:

Ming-Kun Yang from Pingzhen, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Interposer and method for forming the same

Method for forming chip package

Chip package and method for forming the same

InventorID:

6320323 ⎘